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公开(公告)号：US20220082374A1
公开(公告)日：2022-03-17
申请号：US17534539
申请日：2021-11-24
Applicant: CKD CORPORATION
Inventor： Manabu Okuda , Tsuyoshi Ohyama , Norihiko Sakaida
IPC: G01B11/25
Abstract: A three-dimensional measurement device performs three-dimensional measurement of a measured object using a phase shift method. The three-dimensional measurement device includes: an irradiator that irradiates the measured object with a predetermined light pattern having a light intensity distribution in a fringe shape; a control device that shifts a phase of the light pattern radiated from the irradiator in N different ways, where N is a natural number of not less than 3; and an imaging device that takes an image of the measured object irradiated with the light pattern. The control device executes three-dimensional measurement of the measured object by the phase shift method based on N different image data taken under the light pattern having the phase shifted in the N different ways.
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公开(公告)号：US10508903B2
公开(公告)日：2019-12-17
申请号：US16014515
申请日：2018-06-21
Applicant: CKD Corporation
Inventor： Nobuyuki Umemura , Tsuyoshi Ohyama , Norihiko Sakaida , Manabu Okuda
Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.
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公开(公告)号：US20150231744A1
公开(公告)日：2015-08-20
申请号：US14624124
申请日：2015-02-17
Applicant: CKD Corporation
Inventor： Manabu Okuda , Tsuyoshi Ohyama , Norihiko Sakaida
CPC classification number: B23K37/04 , G01N21/956 , G01N2021/95646 , G01R31/2813 , G01R31/309
Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.
Abstract translation: 提供了基板检查装置和部件安装装置。 焊料检查装置和部件安装装置分别具有支撑印刷电路板的背面的基板支撑装置。 基板支撑装置包括支撑印刷电路板的后表面的备用引脚，确定备用引脚的位置的位置确定器以及将备用引脚放置在由位置确定的备用引脚的位置处的备用引脚定位器 决定者 位置确定器确定用于支撑引脚的位置的用于支撑印刷电路板的背面的区域的位置，其中电极被抗蚀剂膜覆盖，并且其中不存在电子部件和焊料。
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公开(公告)号：US09511455B2
公开(公告)日：2016-12-06
申请号：US14624124
申请日：2015-02-17
Applicant: CKD Corporation
Inventor： Manabu Okuda , Tsuyoshi Ohyama , Norihiko Sakaida
IPC: G01N21/01 , B23K37/04 , G01N21/956 , G01R31/309 , G01R31/28
CPC classification number: B23K37/04 , G01N21/956 , G01N2021/95646 , G01R31/2813 , G01R31/309
Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.
Abstract translation: 提供了基板检查装置和部件安装装置。 焊料检查装置和部件安装装置分别具有支撑印刷电路板的背面的基板支撑装置。 基板支撑装置包括支撑印刷电路板的后表面的备用引脚，确定备用引脚的位置的位置确定器以及将备用引脚放置在由位置确定的备用引脚的位置处的备用引脚定位器 决定者 位置确定器确定用于支撑引脚的位置的用于支撑印刷电路板的背面的区域的位置，其中电极被抗蚀剂膜覆盖，并且其中不存在电子部件和焊料。
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公开(公告)号：US10679332B2
公开(公告)日：2020-06-09
申请号：US16211920
申请日：2018-12-06
Applicant: CKD Corporation
Inventor： Manabu Okuda , Nobuyuki Umemura
Abstract: A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.
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Patent Agency Ranking
公开(公告)号：US20190114764A1
公开(公告)日：2019-04-18
申请号：US16211920
申请日：2018-12-06
Applicant: CKD Corporation
Inventor： Manabu Okuda , Nobuyuki Umemura
Abstract: A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.
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公开(公告)号：US09465385B2
公开(公告)日：2016-10-11
申请号：US14109560
申请日：2013-12-17
Applicant: CKD Corporation
Inventor： Yosuke Kamioka , Manabu Okuda , Shingo Suzuki
IPC: G06F19/00 , G05B19/418 , H05K13/08
CPC classification number: G05B19/41875 , G05B2219/32209 , G05B2219/37217 , H05K13/08 , H05K13/0817 , H05K13/083 , Y02P90/22
Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.
Abstract translation: 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。
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公开(公告)号：US20140200700A1
公开(公告)日：2014-07-17
申请号：US14109560
申请日：2013-12-17
Applicant: CKD Corporation
Inventor： Yosuke Kamioka , Manabu Okuda , Shingo Suzuki
IPC: G05B19/418
CPC classification number: G05B19/41875 , G05B2219/32209 , G05B2219/37217 , H05K13/08 , H05K13/0817 , H05K13/083 , Y02P90/22
Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.
Abstract translation: 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。
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公开(公告)号：US11927435B2
公开(公告)日：2024-03-12
申请号：US17534539
申请日：2021-11-24
Applicant: CKD CORPORATION
Inventor： Manabu Okuda , Tsuyoshi Ohyama , Norihiko Sakaida
IPC: G01B11/25
CPC classification number: G01B11/2527 , G01B11/2513 , G01B11/254
Abstract: A three-dimensional measurement device performs three-dimensional measurement of a measured object using a phase shift method. The three-dimensional measurement device includes: an irradiator that irradiates the measured object with a predetermined light pattern having a light intensity distribution in a fringe shape; a control device that shifts a phase of the light pattern radiated from the irradiator in N different ways, where N is a natural number of not less than 3; and an imaging device that takes an image of the measured object irradiated with the light pattern. The control device executes three-dimensional measurement of the measured object by the phase shift method based on N different image data taken under the light pattern having the phase shifted in the N different ways.
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10.发明授权公开(公告)号：US11184984B2
公开(公告)日：2021-11-23
申请号：US16527947
申请日：2019-07-31
Applicant: CKD Corporation
Inventor： Manabu Okuda , Tsuyoshi Ohyama , Norihiko Sakaida
IPC: H05K3/00 , B23K1/00 , B23K3/00 , H05K3/34 , G06T7/70 , B23K1/005 , G01B11/24 , G06T7/00 , B23K101/42
Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.
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