公开(公告)号：US20140367713A1

公开(公告)日：2014-12-18

申请号：US14453482

申请日：2014-08-06

Applicant: CREE, INC.

Inventor： FAN ZHANG ,  James IBBETSON ,  Bernd KELLER ,  Theodore LOWES ,  Antony VAN DE VEN ,  Deborah KIRCHER ,  Tao GILBERT

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L25/0753 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21Y2113/005 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Light emitting diodes are disclosed that utilize multiple conversion materials in the conversion process in order to achieve the desired emission color point. Different embodiments of the present invention can comprise different phosphor types in separate layers on, above or around one or a plurality of LED chips to achieve the desired light conversion. The LEDs can then emit a desired combination of light from the LED chips and conversion material. In some embodiments, conversion materials can be applied as layers of different phosphor types in order of longest emission wavelength phosphor first, followed by shorter emission phosphors in sequence as opposed to applying in a homogeneously mixed phosphor converter. The conversion material layers can be applied as a blanket over the LED chips and the area surrounding the chip, such as the surface of a submount holding the LED chips.

Abstract translation: 公开了在转换过程中利用多种转换材料以实现期望的发射色点的发光二极管。 本发明的不同实施例可以在一个或多个LED芯片上，上方或周围的不同层中包含不同的荧光体类型，以实现期望的光转换。 然后，LED可以发射来自LED芯片和转换材料的期望的光组合。 在一些实施方案中，转换材料可以按照最长发射波长荧光体的顺序施加为不同荧光体类型的层，其次是顺序地施加较短的发射荧光体，而不是施加在均匀混合的荧光转换器中。 转换材料层可以作为覆盖层应用于LED芯片和围绕芯片的区域，例如保持LED芯片的基座的表面。

公开(公告)号：US20180216791A1

公开(公告)日：2018-08-02

申请号：US15419538

申请日：2017-01-30

Applicant: CREE, INC.

Inventor： Michael LEUNG ,  Ben JACOBSON ,  Eric TARSA ,  James IBBETSON ,  Claudio GIROTTO ,  Bernd KELLER

IPC: F21S8/00 ,  F21V14/02 ,  F21S8/02 ,  F21V7/04 ,  H05B33/08 ,  F21K9/61

Abstract: A light fixture, e.g., as an artificial skylight, in which light within a region defined by x, y color coordinates (0.37, 0.34), (0.35, 0.38), (0.15, 0.20), and (0.20, 0.14) exits a first light engine, and light within a region defined by coordinates (0.29, 0.32), (0.32, 0.29), (0.41, 0.36), (0.48, 0.39), (0.48, 0.43), (0.40, 0.41), and (0.35, 0.38) exits a second light engine. Also, light fixtures in which a second light engine comprises a sidewall, and light exiting a first light engine passes through space defined by the sidewall; light fixtures in which first and second light engines are able to output light providing different CS values at a luminance; light fixtures in which light incident on a surface of the fixture and cumulative light exiting the fixture have different color points; light fixtures in which light distribution characteristics of light engines differ; and/or other features. Also, methods.

公开(公告)号：US20210366880A9

公开(公告)日：2021-11-25

申请号：US14453482

申请日：2014-08-06

Applicant: CREE, INC.

Inventor： FAN ZHANG ,  James IBBETSON ,  Bernd KELLER ,  Theodore LOWES ,  Antony VAN DE VEN ,  Deborah KIRCHER ,  Tao Feng GILBERT ,  Peter Andrews

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: Light emitting diodes are disclosed that utilize multiple conversion materials in the conversion process in order to achieve the desired emission color point. Different embodiments of the present invention can comprise different phosphor types in separate layers on, above or around one or a plurality of LED chips to achieve the desired light conversion. The LEDs can then emit a desired combination of light from the LED chips and conversion material. In some embodiments, conversion materials can be applied as layers of different phosphor types in order of longest emission wavelength phosphor first, followed by shorter emission phosphors in sequence as opposed to applying in a homogeneously mixed phosphor converter. The conversion material layers can be applied as a blanket over the LED chips and the area surrounding the chip, such as the surface of a submount holding the LED chips.