公开(公告)号：US09897267B2

公开(公告)日：2018-02-20

申请号：US13838654

申请日：2013-03-15

Applicant: CREE, Inc.

Inventor： Christopher P. Hussell ,  Sung Chul Joo ,  Erin Welch ,  Peter Scott Andrews ,  Joseph G. Clark ,  John A. Edmond ,  Jesse C. Reiherzer

IPC: F21V23/02 ,  F21K9/90 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

公开(公告)号：US09318674B2

公开(公告)日：2016-04-19

申请号：US13759229

申请日：2013-02-05

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  Peter S. Andrews ,  Jesse C. Reiherzer

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/50 ,  H01L2224/13 ,  H01L2933/0066

Abstract: Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.

Abstract translation: 发光器件包括在其表面上具有阳极接触和阴极接触的发光二极管（LED）芯片。 焊接掩模从触点之间的间隙延伸到一个或两个触点上。 LED芯片可以安装在印刷电路板上而没有中间的基座。 还描述了相关的制造方法。

公开(公告)号：US20140268728A1

公开(公告)日：2014-09-18

申请号：US13838654

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Sung Chul Joo ,  Erin Welch ,  Peter Scott Andrews ,  Joseph G. Clark ,  John A. Edmond ,  Jesse C. Reiherzer

IPC: F21K99/00

CPC classification number: F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

Abstract translation: 公开了具有改善的光学效率和较低制造成本的光发射器部件，系统和相关方法。 在一个方面，光发射器部件可以包括具有细长主体和第一和第二端的基板。 可以在衬底上提供至少第一迹线和第二迹线。 在一些方面，第一迹线可以设置在基板的第一端附近，并且第二迹线可以设置在基板的第二端附近，而第一迹线或第二迹线的其它部分没有设置在第一和第二迹线之间 基片的端部。 在一些方面，可以在衬底上提供一串LED芯片。 LED芯片串可以设置在基板的第一和第二端之间。 在某些方面也可以提供角度曲线，间隙和光发射器部件。

公开(公告)号：US20140217436A1

公开(公告)日：2014-08-07

申请号：US13759229

申请日：2013-02-05

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Peter S. Andrews ,  Jesse C. Reiherzer

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/50 ,  H01L2224/13 ,  H01L2933/0066

Abstract: Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.

Abstract translation: 发光器件包括在其表面上具有阳极接触和阴极接触的发光二极管（LED）芯片。 焊接掩模从触点之间的间隙延伸到一个或两个触点上。 LED芯片可以安装在印刷电路板上而没有中间的基座。 还描述了相关的制造方法。

公开(公告)号：US08729589B2

公开(公告)日：2014-05-20

申请号：US13671089

申请日：2012-11-07

Applicant: CREE, Inc.

Inventor： Christopher P. Hussell ,  Jesse C. Reiherzer ,  Jeffrey C. Britt ,  Praneet Athalye ,  Peter S. Andrews

IPC: H01L21/00

CPC classification number: F21V21/00 ,  F21K9/60 ,  F21V7/00 ,  F21V11/00 ,  F21V15/01 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/1305 ,  H05B37/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: High voltage array light emitting devices, fixtures and methods are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.

Abstract translation: 公开了高压阵列发光器件，灯具和方法。 在一个实施例中，发光器件可以包括底座，设置在底座上的发光区域和适于围绕发光区域分配的保持材料。 发光器件可以在大于大约40伏（V）的高电压下工作。 在一个方面，保持材料可以最少部分地设置在发光区域内，使得保持材料将发光区域的第一部分与发光区域的第二部分物理分离。