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1.发明授权公开(公告)号：US08742262B2
公开(公告)日：2014-06-03
申请号：US13483837
申请日：2012-05-30
申请人： Scott E. Gordon , Elizabeth D. Hughes , Joao Carlos Malerbi , Deepukumar M. Nair , Kumaran Manikantan Nair , James M. Parisi , Michael Arnett Smith , Ken E. Souders
发明人： Scott E. Gordon , Elizabeth D. Hughes , Joao Carlos Malerbi , Deepukumar M. Nair , Kumaran Manikantan Nair , James M. Parisi , Michael Arnett Smith , Ken E. Souders
CPC分类号： H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/165 , H05K3/4061 , H05K3/4629 , H05K2201/0317 , H05K2201/0352 , H01L2924/00
摘要： Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 μm. Also disclosed is a process for making the LTCC structure.
摘要翻译： 本文公开了一种多层低温共烧陶瓷（LTCC）结构，其包括多层低温共烧陶瓷，其包含玻璃陶瓷电介质层，其中丝网印刷的厚膜内导体在层的部分上，并且薄膜外导体沉积在 LTCC的上下外表面。 薄膜外导体的至少一部分以线的形式图案化，并且线之间的间距小于50μm。 还公开了制造LTCC结构的方法。
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2.发明授权公开(公告)号：US08633858B2
公开(公告)日：2014-01-21
申请号：US13015254
申请日：2011-01-27
申请人： Deepukumar M. Nair , Kumaran Manikantan Nair , Mark Frederick McCombs , Joao Carlos Malerbi , James M. Parisi
发明人： Deepukumar M. Nair , Kumaran Manikantan Nair , Mark Frederick McCombs , Joao Carlos Malerbi , James M. Parisi
IPC分类号： H01Q1/38
CPC分类号： C03C3/068 , C03C3/19 , H01L23/66 , H01L25/0655 , H01L25/16 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2924/09701 , H01L2924/19032 , H01L2924/3011 , H01Q21/065 , H05K1/0306 , H05K3/4688
摘要： The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.
摘要翻译： 本发明涉及从低温共烧陶瓷（LTCC）材料形成高频接收器，发射器和收发器的方法。 两层或多层低k厚膜电介质胶带彼此接触和两层或多层低k厚膜电介质胶带并彼此接触形成具有改进性能的低k高k LTCC结构， 支持高频收发器的经济批量生产技术的能力。 本发明还涉及LTCC接收，发射和收发结构以及由这种结构制成的设备。
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3.发明申请公开(公告)号：US20110187602A1
公开(公告)日：2011-08-04
申请号：US13015254
申请日：2011-01-27
申请人： Deepukumar M. Nair , Kumaran Manikantan Nair , Mark Frederick McCombs , Joao Carlos Malerbi , James M. Parisi
发明人： Deepukumar M. Nair , Kumaran Manikantan Nair , Mark Frederick McCombs , Joao Carlos Malerbi , James M. Parisi
CPC分类号： C03C3/068 , C03C3/19 , H01L23/66 , H01L25/0655 , H01L25/16 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2924/09701 , H01L2924/19032 , H01L2924/3011 , H01Q21/065 , H05K1/0306 , H05K3/4688
摘要： The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.
摘要翻译： 本发明涉及从低温共烧陶瓷（LTCC）材料形成高频接收器，发射器和收发器的方法。 两层或多层低k厚膜电介质胶带彼此接触和两层或多层低k厚膜电介质胶带并彼此接触形成具有改进性能的低k高k LTCC结构， 支持高频收发器的经济批量生产技术的能力。 本发明还涉及LTCC接收，发射和收发结构以及由这种结构制成的设备。
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4.发明授权Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic) 有权用于LTCC（低温共烧陶瓷）的混合金属系统导体公开(公告)号：US08704105B2
公开(公告)日：2014-04-22
申请号：US12981196
申请日：2010-12-29
CPC分类号： H05K3/0094 , H01B1/22 , H05K1/09 , H05K1/092 , H05K1/095 , H05K1/115 , H05K3/4061 , H05K2201/032 , H05K2201/09481 , H05K2201/09563 , H05K2203/1126
摘要： A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
摘要翻译： 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。
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5.发明申请MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC) 有权用于LTCC（低温共烧陶瓷）的混合金属系统导体公开(公告)号：US20110155431A1
公开(公告)日：2011-06-30
申请号：US12981196
申请日：2010-12-29
CPC分类号： H05K3/0094 , H01B1/22 , H05K1/09 , H05K1/092 , H05K1/095 , H05K1/115 , H05K3/4061 , H05K2201/032 , H05K2201/09481 , H05K2201/09563 , H05K2203/1126
摘要： A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
摘要翻译： 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。
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6.发明授权Thick film conductor compositions and the use thereof in LTCC circuits and devices 有权厚膜导体组合物及其在LTCC电路和器件中的应用公开(公告)号：US07611645B2
公开(公告)日：2009-11-03
申请号：US11398337
申请日：2006-04-05
IPC分类号： H01B1/00
CPC分类号： H05K1/097 , C03C3/062 , C03C3/074 , C03C3/091 , C03C3/108 , C03C8/04 , C03C8/10 , C03C8/18 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2203/1131 , H01L2924/00
摘要： The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
摘要翻译： 本发明涉及一种用于低温共烧陶瓷回路的厚膜组合物，其基于重量百分比的总厚膜组合物：（a）30-98重量％的细碎颗粒，其选自贵金属，贵金属合金 金属及其混合物; （b）一种或多种选择的无机粘合剂和/或其混合物，并分散在（c）有机介质中，并且其中所述玻璃组合物与低温共烧陶瓷基底玻璃中存在的残留玻璃不混溶或部分混溶 射击条件。 本发明还涉及使用上述组合物形成多层电路的方法以及该组合物在高频应用（包括微波应用）中的用途。
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7.发明授权公开(公告)号：US07666328B2
公开(公告)日：2010-02-23
申请号：US11601136
申请日：2006-11-16
CPC分类号： H05K1/092 , C03C3/062 , C03C3/066 , C03C3/091 , C03C8/14 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.
摘要翻译： 本发明涉及可用于通孔填充和/或线路导体以制造低温可共烧陶瓷（LTCC）器件和其它多层互连（MLI）陶瓷复合电路的厚膜导体组合物，例如光敏胶带 底物（PTOS）; 金，银和混合金属多层电路和器件。 本发明可用于形成从以下组中选择的微波和其它高频电路组件：天线，滤波器，平衡 - 不平衡转换器，成波器，I / O，耦合器，经由馈通，EM耦合馈通，引线连接和传输线。
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公开(公告)号：US20090110939A1
公开(公告)日：2009-04-30
申请号：US12347076
申请日：2008-12-31
CPC分类号： C03C3/068 , C03C3/19 , C03C3/21 , C03C3/253 , H01L31/00 , H05K1/0306 , Y10T29/49117 , Y10T428/24926
摘要： A glass composition consisting essentially of, based on mole percent, 46-56% B2O3, 0.5-8.5% P2O5, SiO2 and mixtures thereof, 20-50% CaO, 2-15% Ln2O3 where Ln is selected from the group consisting of rare earth elements and mixtures thereof; 0-6% M′2O where M′ is selected from the group consisting of alkali elements; and 0-10% Al2O3, with the proviso that the composition is water millable.
摘要翻译： 一种玻璃组合物，其基本上由摩尔百分数组成，为46-56％B2O3,0.5-8.5％P2O5，SiO2及其混合物，20-50％CaO，2-15％Ln2O3，其中Ln选自稀有金属 地球元素及其混合物; 0-6％M'2O其中M'选自碱元素; 和0-10％的Al 2 O 3，条件是组合物是可水洗的。
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9.发明申请Thick film conductor compositions and the use thereof in LTCC circuits and devices 有权厚膜导体组合物及其在LTCC电路和器件中的应用公开(公告)号：US20070235694A1
公开(公告)日：2007-10-11
申请号：US11398337
申请日：2006-04-05
IPC分类号： H01B1/12
CPC分类号： H05K1/097 , C03C3/062 , C03C3/074 , C03C3/091 , C03C3/108 , C03C8/04 , C03C8/10 , C03C8/18 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2203/1131 , H01L2924/00
摘要： The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
摘要翻译： 本发明涉及一种用于低温共烧陶瓷回路的厚膜组合物，其基于重量百分比的总厚膜组合物：（a）30-98重量％的细碎颗粒，其选自贵金属，贵金属合金 金属及其混合物; （b）一种或多种选择的无机粘合剂和/或其混合物，并分散在（c）有机介质中，并且其中所述玻璃组合物与低温共烧陶瓷基底玻璃中存在的残留玻璃不混溶或部分混溶 射击条件。 本发明还涉及使用上述组合物形成多层电路的方法以及该组合物在高频应用（包括微波应用）中的用途。
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公开(公告)号：US08609256B2
公开(公告)日：2013-12-17
申请号：US12571665
申请日：2009-10-01
CPC分类号： H05K3/4661 , C03C8/04 , C03C8/18 , C23C18/1601 , C23C18/1646 , C23C18/1651 , C23C18/42 , C23C18/54 , H01B1/22 , H01L21/4867 , H05K1/092 , H05K3/246 , H05K2203/072
摘要： Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.
摘要翻译： 描述了具有外部含银电触点的LTCC器件，其被连续地镀有含镍金属和含金属金属，并具有用于制造的限定的银膏组合物。
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