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公开(公告)号：US07223344B2
公开(公告)日：2007-05-29
申请号：US10479301
申请日：2001-05-29
IPC分类号： B01D11/02 , C02F103/00 , B24B1/00
CPC分类号： C10M175/005 , B23Q11/1069 , B24B57/00 , B24B57/02 , B28D5/007 , C10M175/00 , Y02P70/179
摘要： A method of separating, recovering and reusing components of an exhausted slurry used in slicing silicon wafers from a silicon ingot. In the method, the solid particles and lubricating fluid of the exhausted slurry are separated without decreasing the viscosity of the exhausted slurry. The separated lubricating fluid may be collected and reused in the preparation of a fresh slurry. Additionally, the silicon particulate and metal slicing wire particulate are dissolved and separated from the abrasive grains. The abrasive grains are separated into spent abrasive grains and unspent abrasive grains. The separated unspent abrasive grains are suitable for reuse in the preparation of a fresh slurry.
摘要翻译： 分离，回收和再利用用于从硅锭切片硅晶片的排出浆料的组分的方法。 在该方法中，排出的浆料的固体颗粒和润滑液被分离而不降低排出的浆料的粘度。 分离的润滑流体可以被收集并重新用于制备新鲜的浆料。 此外，硅颗粒和金属切片线粒子从磨粒中溶解并分离。 将磨料颗粒分成废磨粒和未稀释的磨粒。 分离的未使用的磨料颗粒适于在制备新鲜浆料时再次使用。
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2.发明授权Method for the separation, regeneration and reuse of an exhausted glycol-based slurry 有权用于分离，再生和再利用废二醇基浆料的方法公开(公告)号：US06231628B1
公开(公告)日：2001-05-15
申请号：US09345934
申请日：1999-07-01
申请人： Carlo Zavattari , Guido Fragiacomo
发明人： Carlo Zavattari , Guido Fragiacomo
IPC分类号： B01D2101
CPC分类号： B24B57/02 , B24B55/12 , B28D5/007 , Y02P70/179
摘要： A method of separating, recovering and reusing components of an exhausted slurry used in slicing silicon wafers from a silicon ingot. In the method, the viscosity of the exhausted slurry is reduced and the lubricating fluid component of the slurry is separated from solids and collected, the collected lubricating fluid component being suitable for reuse in the preparation of a fresh slurry without any additional separation steps being necessary. Additionally, the separated solids may be collected and further separated into an unspent abrasive grain component, which is suitable for reused in the preparation of a fresh slurry, and a waste product containing silicon particulate and spent abrasive grains.
摘要翻译： 分离，回收和再利用用于从硅锭切片硅晶片的排出浆料的组分的方法。 在该方法中，排出的浆料的粘度降低，并且将浆料的润滑流体组分与固体分离并收集，收集的润滑流体组分适于在制备新鲜浆料中再次使用，而不需要任何额外的分离步骤 。 此外，分离的固体可以被收集并进一步分离成未使用的磨料颗粒组分，其适用于重新用于制备新鲜浆料，以及含有硅颗粒和废磨料颗粒的废产物。
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3.发明申请公开(公告)号：US20130139800A1
公开(公告)日：2013-06-06
申请号：US13309260
申请日：2011-12-02
申请人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
发明人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
IPC分类号： B28D5/00
CPC分类号： B28D5/045 , B23D57/0053 , B28D5/0064 , B28D5/0076
摘要： Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
摘要翻译： 公开了用于控制在线锯机中切割的晶片的表面轮廓的方法。 本文所述的系统和方法通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 晶片的形状通过改变流体连通的温度控制流体的温度和/或流速来改变，所述温度控制流体与支撑导线器的导线器的轴承保持流体连通。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。
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公开(公告)号：US20130206163A1
公开(公告)日：2013-08-15
申请号：US13585547
申请日：2012-08-14
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , B08B3/123 , B08B7/028 , B08B2203/0288 , B28D5/0076 , B28D5/045
摘要： A system for ultrasonically cleaning one or more wires of a wire saw for slicing semiconductor or solar material into wafers. The system includes an ultrasonic transducer connected to a sonotrode. The system also includes a sonotrode plate adjacent to one or more of the wires. The sonotrode plate has an opening that exposes the sonotrode to one or more of the wires. The system further includes a tank for delivering a flow of liquid to contact the sonotrode and one or more of the wires. The tank is positioned on the same side of the wires as the sonotrode plate. The ultrasonic transducer is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires.
摘要翻译： 一种用于超声波清洁线锯的一根或多根线的系统，用于将半导体或太阳能材料切割成晶片。 该系统包括连接到超声波发生器的超声波换能器。 该系统还包括与一个或多个电线相邻的超声电极板。 超声电极板具有使超声波发生器暴露于一根或多根电线的开口。 该系统还包括用于输送液体流以接触超声波发生器和一根或多根电线的罐。 油箱位于与超声焊盘相同的一侧。 超声波换能器被配置为在液体中振动并形成空穴，以从一个或多个电线的表面去除污染物。
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公开(公告)号：US20130144421A1
公开(公告)日：2013-06-06
申请号：US13309275
申请日：2011-12-01
申请人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
发明人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
CPC分类号： B28D5/0064 , B28D5/045 , G05D23/1919
摘要： Systems and are disclosed for controlling the temperature of bearings in a wire saw machine. The systems described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling the temperature of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
摘要翻译： 公开了用于控制线锯机中的轴承的温度的系统。 本文描述的系统通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 晶片的形状通过改变与支撑锯的线引导件的轴承流体连通的温度控制流体的温度和/或流速来控制线锯中的轴承的温度来改变。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。
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6.发明授权Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control 失效线锯锭切割系统和方法，其具有锭预热，幅材预热，浆料温度控制和/或浆料流速控制公开(公告)号：US07878883B2
公开(公告)日：2011-02-01
申请号：US11621920
申请日：2007-01-10
CPC分类号： B28D5/007 , B28D5/0076 , Y02P70/179
摘要： A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
摘要翻译： 一种使用线锯工艺将晶锭切割成晶片的系统和方法。 浆料收集系统收集并将浆料供应到浆料处理系统中，用于控制浆料的温度和/或流速，从而在受控温度和/或受控流速下提供浆料输出到切割锭的切片系统，其可以是 预热。
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7.发明申请公开(公告)号：US20130144420A1
公开(公告)日：2013-06-06
申请号：US13309243
申请日：2011-12-01
申请人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
发明人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
CPC分类号： B28D5/0064 , B28D5/045 , G05D23/1917
摘要： Systems are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
摘要翻译： 公开了用于控制在线锯机中切割的晶片的表面轮廓的系统。 本文所述的系统和方法通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 晶片的形状通过改变流体连通的温度控制流体的温度和/或流速来改变，所述温度控制流体与支撑导线器的导线器的轴承保持流体连通。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。
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公开(公告)号：US20130139801A1
公开(公告)日：2013-06-06
申请号：US13309270
申请日：2011-12-01
申请人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
发明人： Carlo Zavattari , Ferdinando Severico , Sumeet S. Bhagavat , Gabriele Vercelloni , Roland R. Vandamme
CPC分类号： B28D5/045 , B28D5/0064
摘要： Methods are disclosed for controlling the displacement of bearings in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling displacement of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
摘要翻译： 公开了用于控制线锯机中的轴承的位移的方法。 本文所述的系统和方法通常可操作以通过控制晶片的形状来改变从晶锭切片的晶片的纳米拓扑学。 通过改变与支撑导线器的导轨的轴承流体连通的温度控制流体的温度和/或流速来控制线锯中的轴承的位移来改变晶片的形状。 可以使用不同的反馈系统来确定产生具有期望形状和/或纳米拓扑的晶片所需的流体的温度。
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9.发明申请Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control 失效线锯锭切割系统和方法，其具有锭预热，幅材预热，浆料温度控制和/或浆料流速控制公开(公告)号：US20070178807A1
公开(公告)日：2007-08-02
申请号：US11621920
申请日：2007-01-10
CPC分类号： B28D5/007 , B28D5/0076 , Y02P70/179
摘要： A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
摘要翻译： 一种使用线锯工艺将晶锭切割成晶片的系统和方法。 浆料收集系统收集并将浆料供应到浆料处理系统中，用于控制浆料的温度和/或流速，从而在受控温度和/或受控流速下提供浆料输出到切割锭的切片系统，其可以是 预热。
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公开(公告)号：US06941940B1
公开(公告)日：2005-09-13
申请号：US10296919
申请日：2000-05-31
CPC分类号： B23D57/0061 , B28D1/025 , B28D5/0082
摘要： A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). A slurry delivery system includes nozzles (34, 36, and 38) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.
摘要翻译： 一种线锯（10），用于同时将多个通常为圆柱形的单晶锭（14）切割成晶片。 线锯包括切割头（16），锭支架（12）和多个大致平行的切割丝（18）长度，限定切割幅材（30）。 浆料输送系统包括喷嘴（34,36和38），其被定位成用于沿着丝网一般在每个锭的横向侧分配浆料。 用于将至少两个大致圆柱形的半导体锭同时切割成晶片的方法包括将至少两个锭安装到公共铸锭支撑件上，使铸锭支撑件相对于切割幅材移动，使得两个铸锭在切割区域同时压靠切割幅材， 并且将液体浆料分配到线网上的至少三个位置，包括切割区域的两个最外侧和每对锭之间的位置。
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