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公开(公告)号：US20120187507A1
公开(公告)日：2012-07-26
申请号：US13263746
申请日：2010-04-07
CPC分类号： H03H3/0076 , H03H9/2405 , H03H9/2457 , H03H2009/02496 , H03H2009/02503
摘要： A bulk-acoustic-mode MEMS resonator has a first portion with a first physical layout, and a layout modification feature. The resonant frequency is a function of the physical layout, which is designed such that the frequency variation is less than 150 ppm for a variation in edge position of the resonator shape edges of 50 nm. This design combines at least two different layout features in such a way that small edge position variations (resulting from uncontrollable process variation) have negligible effect on the resonant frequency.
摘要翻译： 体声模式MEMS谐振器具有具有第一物理布局的第一部分和布局修改特征。 谐振频率是物理布局的函数，其被设计为使得对于50nm的谐振器形状边缘的边缘位置的变化，频率变化小于150ppm。 该设计结合了至少两种不同的布局特征，使得小边缘位置变化（由不可控过程变化引起）对共振频率具有可忽略的影响。
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公开(公告)号：US08854150B2
公开(公告)日：2014-10-07
申请号：US13446894
申请日：2012-04-13
CPC分类号： H03H9/02433 , H03H9/02338 , H03H9/2452 , H03H2009/02456 , H03H2009/02488
摘要： A resonator in which in addition to the normal anchor at a nodal point, a second anchor arrangement is provided and an associated connecting arm between the resonator body and the second anchor arrangement. The connecting arm connects to the resonator body at a non-nodal point so that it is not connected to a normal position where fixed connections are made. The connecting arm is used to suppress transverse modes of vibration.
摘要翻译： 一种谐振器，其中除了在节点处的正常锚固件之外，提供第二锚定装置以及在谐振器本体和第二锚定装置之间的相关联的连接臂。 连接臂在非节点处连接到谐振器体，使得它不连接到形成固定连接的正常位置。 连接臂用于抑制横向振动模式。
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公开(公告)号：US09800223B2
公开(公告)日：2017-10-24
申请号：US13263746
申请日：2010-04-07
申请人： Joep J. M. Bontemps , Jan Jacob Koning , Casper van der Avoort , Jozef Thomas Martinus van Beek
发明人： Joep J. M. Bontemps , Jan Jacob Koning , Casper van der Avoort , Jozef Thomas Martinus van Beek
CPC分类号： H03H3/0076 , H03H9/2405 , H03H9/2457 , H03H2009/02496 , H03H2009/02503
摘要： A bulk-acoustic-mode MEMS resonator has a first portion with a first physical layout, and a layout modification feature. The resonant frequency is a function of the physical layout, which is designed such that the frequency variation is less than 150 ppm for a variation in edge position of the resonator shape edges of 50 nm. This design combines at least two different layout features in such a way that small edge position variations (resulting from uncontrollable process variation) have negligible effect on the resonant frequency.
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公开(公告)号：US08426928B2
公开(公告)日：2013-04-23
申请号：US12916454
申请日：2010-10-29
申请人： Johannes van Wingerden , Greja Johanna Adriana Maria Verheijden , Gerhard Koops , Jozef Thomas Martinus van Beek
发明人： Johannes van Wingerden , Greja Johanna Adriana Maria Verheijden , Gerhard Koops , Jozef Thomas Martinus van Beek
IPC分类号： H01L27/14
CPC分类号： B81C1/00293 , B81C2203/0136 , B81C2203/0145
摘要： Disclosed is a device comprising a substrate carrying a microscopic structure in a cavity capped by a capping layer including a material of formula SiNxHy, wherein x>1.33 and y>0. A method of forming such a device is also disclosed.
摘要翻译： 公开了一种装置，其包括在由包含式SiN x H y的材料的覆盖层封盖的空腔中承载微观结构的基板，其中x> 1.33且y> 0。 还公开了一种形成这种装置的方法。
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5.发明授权Microscopic structure packaging method and device with packaged microscopic structure 有权显微结构包装方法和装置，具有微观结构公开(公告)号：US08330238B2
公开(公告)日：2012-12-11
申请号：US12953092
申请日：2010-11-23
申请人： Johannes van Wingerden , Wim van den Einden , Harold H. Roosen , Greja Johanna Adriana Maria Verheijden , Gerhard Koops , Didem Ernur , Jozef Thomas Martinus van Beek
发明人： Johannes van Wingerden , Wim van den Einden , Harold H. Roosen , Greja Johanna Adriana Maria Verheijden , Gerhard Koops , Didem Ernur , Jozef Thomas Martinus van Beek
IPC分类号： H01L29/84
CPC分类号： B81C1/00476 , B81B2201/0271 , B81C2203/0136 , B81C2203/0145 , H03H3/0072
摘要： A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
摘要翻译： 包装微电子机械结构的方法包括在基底上形成所述结构; 在所述结构上沉积牺牲层; 图案化牺牲层; 在图案化的牺牲层上沉积SIPOS（半绝缘多晶硅）层; 用蚀刻剂处理SIPOS层以将SIPOS层转换成多孔SIPOS层，通过多孔层SIPOS去除图案化的牺牲层以形成包括所述结构的空腔; 并密封多孔SIPOS层。 还公开了一种包括这种封装的微机电结构的装置。
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公开(公告)号：US20120139065A1
公开(公告)日：2012-06-07
申请号：US13312503
申请日：2011-12-06
申请人： Jozef Thomas Martinus van Beek , Klaus Reimann , Remco Henricus Wilhelmus Pijnenburg , Twan Van Lippen
发明人： Jozef Thomas Martinus van Beek , Klaus Reimann , Remco Henricus Wilhelmus Pijnenburg , Twan Van Lippen
CPC分类号： B81B3/001 , B81B2201/0257 , B81B2201/0264
摘要： A MEMS manufacturing method and device in which a spacer layer is provided over a side wall of at least one opening in a structural layer which will define the movable MEMS element. The opening extends below the structural layer. The spacer layer forms a side wall portion over the side wall of the at least one opening and also extends below the level of the structural layer to form a contact area.
摘要翻译： 一种MEMS制造方法和装置，其中间隔层设置在将限定可移动MEMS元件的结构层中的至少一个开口的侧壁上。 开口延伸到结构层的下方。 间隔层在至少一个开口的侧壁上形成侧壁部分，并且还在结构层的水平面下方延伸以形成接触区域。
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公开(公告)号：US08729973B2
公开(公告)日：2014-05-20
申请号：US13062877
申请日：2009-09-07
CPC分类号： H03H9/02448
摘要： A MEMS resonator comprises a resonator body (34), and an anchor (32) which provides a fixed connection between the resonator body (34) and a support body. A resistive heating element (R1,R2) and a feedback control system are used to maintain the resonator body (34) at a constant temperature. A location for thermally coupling the anchor (32) to the resistive heating element (R1,R2) is selected which has a lowest dependency of its temperature on the ambient temperature during the operation of the feedback control.
摘要翻译： MEMS谐振器包括谐振器主体（34）和在谐振器主体（34）和支撑体之间提供固定连接的锚固件（32）。 使用电阻加热元件（R1，R2）和反馈控制系统将谐振器本体（34）保持在恒定温度。 选择用于将锚固件（32）热耦合到电阻加热元件（R1，R2）的位置，其在反馈控制的操作期间具有最低的温度对环境温度的依赖性。
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8.发明授权Circuit and method for correcting temperature dependence of frequency for piezoresistive oscillators 有权用于校正压阻振荡器的频率温度依赖性的电路和方法公开(公告)号：US08593230B2
公开(公告)日：2013-11-26
申请号：US13273704
申请日：2011-10-14
IPC分类号： H03B5/00
摘要： MEMS oscillators, which include a silicon-type, in particular piezoresistive resonators, can be used to provide a fixed, stable output frequency. Silicon has a natural temperature dependence of Young's modulus, therefore, as ambient temperature changes and/or the piezoresistive resonator is powered, the resonator temperature changes, and the resonance frequency of the resonator drifts. In order to account for the temperature drift of the piezoresistive resonator, the piezoresistive resonator itself is used as a temperature sensor. The relative resistance change of the piezoresistive resonator depends only on the relative temperature change and material property of the resonator. Therefore, an accurate temperature can be sensed directly on the piezoresistive resonator. The temperature drift information is provided to a frequency adjuster, which corrects the output frequency of the circuit.
摘要翻译： 可以使用包括硅型特别是压阻谐振器的MEMS振荡器来提供固定的稳定的输出频率。 因此，随着环境温度的变化和/或压阻式谐振器的供电，谐振器温度变化，谐振器的谐振频率偏移，硅的温度依赖于杨氏模量。 为了解决压阻谐振器的温度漂移，压电谐振器本身被用作温度传感器。 压阻谐振器的相对电阻变化仅取决于谐振器的相对温度变化和材料特性。 因此，可以直接在压阻谐振器上感测到精确的温度。 温度漂移信息被提供给频率调节器，其校正电路的输出频率。
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公开(公告)号：US08564377B2
公开(公告)日：2013-10-22
申请号：US13271970
申请日：2011-10-12
IPC分类号： H03B5/30
CPC分类号： H03H9/02259 , H03B5/30
摘要： A piezoresistive MEMS oscillator uses an output circuit to control the voltage across the resonator body. This results in a DC bias of the resonator. A current path is provided between the output of the output circuit and the resonator body, such that changes in current through or voltage across the resonator body, resulting from changes in resistance of the resonator body, are coupled to the output. This arrangement uses the bias current flowing through the resonator to derive the output. In this way, the same DC current is used to provide the required DC resonator bias and to drive the output circuit to its DC operating point.
摘要翻译： 压阻MEMS振荡器使用输出电路来控制谐振器本体上的电压。 这导致谐振器的直流偏置。 在输出电路的输出和谐振器本体之间提供电流路径，使得由谐振器本体的电阻变化导致的谐振器本体上的电流或电压的变化耦合到输出端。 这种布置使用流过谐振器的偏置电流来导出输出。 以这种方式，使用相同的直流电流来提供所需的DC谐振器偏置并将输出电路驱动到其DC工作点。
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10.发明申请公开(公告)号：US20130093525A1
公开(公告)日：2013-04-18
申请号：US13273704
申请日：2011-10-14
IPC分类号： H03L7/00
摘要： MEMS oscillators, which include a silicon-type, in particular piezoresistive resonators, can be used to provide a fixed, stable output frequency. Silicon has a natural temperature dependence of Young's modulus, therefore, as ambient temperature changes and/or the piezoresistive resonator is powered, the resonator temperature changes, and the resonance frequency of the resonator drifts. In order to account for the temperature drift of the piezoresistive resonator, the piezoresistive resonator itself is used as a temperature sensor. The relative resistance change of the piezoresistive resonator depends only on the relative temperature change and material property of the resonator. Therefore, an accurate temperature can be sensed directly on the piezoresistive resonator. The temperature drift information is provided to a frequency adjuster, which corrects the output frequency of the circuit.
摘要翻译： 可以使用包括硅型特别是压阻谐振器的MEMS振荡器来提供固定的稳定的输出频率。 因此，随着环境温度的变化和/或压阻式谐振器的供电，谐振器温度变化，谐振器的谐振频率偏移，硅的温度依赖于杨氏模量。 为了解决压阻谐振器的温度漂移，压电谐振器本身被用作温度传感器。 压阻谐振器的相对电阻变化仅取决于谐振器的相对温度变化和材料特性。 因此，可以直接在压阻谐振器上感测到精确的温度。 温度漂移信息被提供给频率调节器，其校正电路的输出频率。
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