Acoustic backing material for small-element ultrasound transducer arrays
    1.
    发明申请
    Acoustic backing material for small-element ultrasound transducer arrays 审中-公开
    用于小元件超声波换能器阵列的声学背衬材料

    公开(公告)号:US20050127793A1

    公开(公告)日:2005-06-16

    申请号:US10737216

    申请日:2003-12-15

    CPC分类号: G10K11/002

    摘要: A fine-pitch acoustic transducer array that has a backing made of acoustically attenuative material. The backing material is prepared by homogeneously combining a matrix component and filler components having an average particle size less than one-fifth (preferably less than one-tenth) of the smallest dimension of the elements making up the array. In certain embodiments, the acoustically attenuative material comprises 25-45 wt. % tungsten particles, 15-35 wt. % silicone particles and 40-60 wt. % epoxy.

    摘要翻译: 具有由声衰减材料制成的背衬的细间距声换能器阵列。 通过均匀组合基质组分和平均粒径小于构成阵列的元素的最小尺寸的五分之一(优选小于十分之一)的填料组分来制备背衬材料。 在某些实施方案中,声学减弱材料包含25-45wt。 %钨颗粒,15-35重量% %硅氧烷颗粒和40-60重量% %环氧树脂。

    Method of manufacturing ultrasound transducer device having acoustic backing
    2.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号:US20050046311A1

    公开(公告)日:2005-03-03

    申请号:US10960871

    申请日:2004-10-06

    摘要: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译: 一种超声波换能器装置,包括:微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征,例如突片或凹口,用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄,以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配,以便防止在向后传播的任何声能的界面处的反射,即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Ultrasound transducer with additional sensors
    3.
    发明申请
    Ultrasound transducer with additional sensors 审中-公开
    超声波换能器附加传感器

    公开(公告)号:US20060004290A1

    公开(公告)日:2006-01-05

    申请号:US10881986

    申请日:2004-06-30

    IPC分类号: A61B8/14

    摘要: The present technique provides for the manufacture and/or use of an ultrasound probe configured to acquire non-imaging data in addition to imaging data. In particular, the ultrasound probe includes a micro-machined ultrasound transducer formed on the surface of a substrate using micro-electric mechanical systems techniques or other techniques associated with semiconductor processing. Non-imaging sensors are formed on the substrate, either on the surface or the interior, or on a substrate proximate to the substrate upon which the transducer is formed. The non-imaging sensors may be used to acquire non-imaging data in conjunction with the acquisition of imaging data by the transducer.

    摘要翻译: 本技术提供了除了成像数据之外还配置成获取非成像数据的超声波探头的制造和/或使用。 特别地,超声波探头包括使用微电子机械系统技术或与半导体处理相关的其它技术在基板的表面上形成的微加工的超声换能器。 非成像传感器形成在衬底上,无论是在表面还是内部,或者在靠近形成换能器的衬底的衬底上。 非成像传感器可以用于通过换能器获取成像数据来获取非成像数据。

    Backing material for micromachined ultrasonic transducer devices
    5.
    发明申请
    Backing material for micromachined ultrasonic transducer devices 审中-公开
    用于微加工超声波换能器的支撑材料

    公开(公告)号:US20050043628A1

    公开(公告)日:2005-02-24

    申请号:US10959343

    申请日:2004-10-06

    摘要: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译: 一种超声波换能器装置,包括:微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征,例如突片或凹口,用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄,以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配,以便防止在向后传播的任何声能的界面处的反射,即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Method for making multi-layer ceramic acoustic transducer
    7.
    发明申请
    Method for making multi-layer ceramic acoustic transducer 失效
    制作多层陶瓷声换能器的方法

    公开(公告)号:US20050099096A1

    公开(公告)日:2005-05-12

    申请号:US10706820

    申请日:2003-11-11

    摘要: A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

    摘要翻译: 一种制造具有降低的总电阻抗的多层声学换能器的方法。 该方法基于将具有相对的金属化表面的两个压电陶瓷层与薄的电导体接合,然后将中间导体形成第二电极而将顶表面和底表面电连接以形成环绕电极。 由以这种方式连接的压电层组成的两层陶瓷堆叠的总电阻为相同尺寸的固体陶瓷元件的四分之一。 这提供了声堆叠阻抗与电缆的阻抗的更好匹配,用于在身体内成像的增加的穿透深度以及改善的声学元件灵敏度。

    Catheter apparatus and methods of using same
    9.
    发明申请
    Catheter apparatus and methods of using same 审中-公开
    导管装置及其使用方法

    公开(公告)号:US20070123750A1

    公开(公告)日:2007-05-31

    申请号:US11290020

    申请日:2005-11-30

    IPC分类号: A61B1/00 A61B5/05

    摘要: A catheter apparatus includes a catheter having an electroactive polymer inside. The electroactive polymer is configured to control either or both shape and/or direction of the catheter in a vessel as the electroactive polymer is electrically activated. The apparatus further includes a computer which may be denoted as a “control computer.” The computer includes a memory and a processor configured to store vascular information and determine voltages to be applied to activate the electroactive polymer to steer the catheter to a desired site after it is inserted into a body. Also included is an electrical source responsive to the computer and configured to apply the determined voltages to the electroactive polymer.

    摘要翻译: 导管装置包括内部具有电活性聚合物的导管。 电活性聚合物被配置为当电活性聚合物电活化时,在容器中控制导管的形状和/或方向之一或两者。 该装置还包括可以表示为“控制计算机”的计算机。 计算机包括存储器和处理器,其被配置为存储血管信息并且确定要施加的电压以激活电活性聚合物,以将导管插入到所需位置之后将其导入体内。 还包括响应于计算机并被配置为将所确定的电压施加到电活性聚合物的电源。