Optical waveguide comprising Bragg grating coupling means
    2.
    发明授权
    Optical waveguide comprising Bragg grating coupling means 失效
    光波导包括布拉格光栅耦合装置

    公开(公告)号:US5195161A

    公开(公告)日:1993-03-16

    申请号:US806941

    申请日:1991-12-11

    摘要: Disclosed are planar waveguides comprising substantially polarization-independent Bragg gratings. A preferred embodiment of the invention comprises a Si body with a silica lower cladding layer thereon, and a phosphorus P-doped silica core on the lower cladding. Appropriate periodic recessed features are etched into the core, and phophorus P- and B-doped silica upper cladding is deposited over the core. The dopant concentrations are adjusted such that the refractive index difference between core and upper cladding is small (0.35-1.45.times.10.sup.-2), and such that the flow temperature of the upper cladding material is lower than that of the core material. In another preferred embodiment a thin layer of Si.sub.3 N.sub.x (x.about.4) is conformally deposited over the core after the grating etch, and the upper cladding material is deposited onto the Si.sub.3 N.sub.x layer. Bragg devices according to the invention are advantageously used in Integrated Optical Circuits (IOCs), e.g. in IOCs used in WDM optical communication systems.

    Method and apparatus for removing material from microfeature workpieces
    4.
    发明授权
    Method and apparatus for removing material from microfeature workpieces 失效
    从微型工件去除材料的方法和装置

    公开(公告)号:US07628680B2

    公开(公告)日:2009-12-08

    申请号:US11938097

    申请日:2007-11-09

    IPC分类号: B24B1/00 H01L21/302

    CPC分类号: B24B37/22 B24B37/24

    摘要: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.

    摘要翻译: 从微型工件中去除材料的方法和设备。 根据本发明的子垫的一个实施例包括具有构造成支撑抛光介质的第一表面和与第一表面相对的第二表面的矩阵。 该实施例中的子垫还包括基质中的加氢控制剂。 加氢控制剂具有抑制液体吸收到亚垫中的疏水性。 例如,加氢控制剂可以是通常为疏水性的偶联剂,疏水性表面活性剂或与基质相容并且至少一般疏水的其它试剂。

    Chemical mechanical polishing slurry useful for copper/tantalum substrates
    5.
    发明授权
    Chemical mechanical polishing slurry useful for copper/tantalum substrates 失效
    用于铜/钽基板的化学机械抛光浆料

    公开(公告)号:US06217416B1

    公开(公告)日:2001-04-17

    申请号:US09105065

    申请日:1998-06-26

    IPC分类号: C09K1300

    CPC分类号: C23F3/00 C09G1/02 H01L21/3212

    摘要: The present invention is a first CMP slurry including an abrasive, an oxidizing agent, a complexing agent, a film forming agent and an organic amino compound, a second polishing slurry including an abrasive, an oxidizing agent, and acetic acid wherein the weight ratio of the oxidizing agent to acetic acid is at least 10 and a method for using the first and second polishing slurries sequentially to polish a substrate containing copper and containing tantalum or tantalum nitride or both tantalum and tantalum nitride.

    摘要翻译: 本发明是包括研磨剂,氧化剂,配位剂,成膜剂和有机氨基化合物的第一CMP浆料,包括研磨剂,氧化剂和乙酸的第二研磨浆料,其中重量比 氧化剂至乙酸为至少10,并且依次使用第一和第二抛光浆料的方法来抛光含有铜并含有钽或氮化钽或钽或氮化钽的基板。

    Method and apparatus for removing material from microfeature workpieces
    7.
    发明授权
    Method and apparatus for removing material from microfeature workpieces 有权
    从微型工件去除材料的方法和装置

    公开(公告)号:US08105131B2

    公开(公告)日:2012-01-31

    申请号:US12621366

    申请日:2009-11-18

    IPC分类号: B24B1/00

    CPC分类号: B24B37/22 B24B37/24

    摘要: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.

    摘要翻译: 从微型工件中去除材料的方法和设备。 根据本发明的子垫的一个实施例包括具有构造成支撑抛光介质的第一表面和与第一表面相对的第二表面的矩阵。 该实施例中的子垫还包括基质中的加氢控制剂。 加氢控制剂具有抑制液体吸收到亚垫中的疏水性。 例如,加氢控制剂可以是通常为疏水性的偶联剂,疏水性表面活性剂或与基质相容并且至少一般疏水的其它试剂。

    Chemical mechanical polishing slurry useful for copper substrates
    8.
    发明授权
    Chemical mechanical polishing slurry useful for copper substrates 有权
    用于铜基材的化学机械抛光浆料

    公开(公告)号:US07381648B2

    公开(公告)日:2008-06-03

    申请号:US10616335

    申请日:2003-07-09

    IPC分类号: H01L21/302

    摘要: A chemical mechanical polishing slurry comprising an oxidizing agent, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, titanium nitride, tantalum and tantalum nitride containing layers from a substrate. The slurry does not include a separate film-forming agent.

    摘要翻译: 包含氧化剂,络合剂,研磨剂和任选的表面活性剂的化学机械抛光浆料以及使用化学机械抛光浆料去除铜合金,钛,氮化钛,钽和氮化钽的层的方法 从底物。 浆料不包括单独的成膜剂。

    Afferent-based polishing media for chemical mechanical planarization
    9.
    发明授权
    Afferent-based polishing media for chemical mechanical planarization 失效
    用于化学机械平面化的基于传入的抛光介质

    公开(公告)号:US06752693B1

    公开(公告)日:2004-06-22

    申请号:US10206749

    申请日:2002-07-26

    申请人: Rodney C. Kistler

    发明人: Rodney C. Kistler

    IPC分类号: B24B4900

    CPC分类号: B24B37/24 B24B49/10 B24B49/16

    摘要: One polishing media for chemical mechanical planarization includes an underlayer and a plurality of pressure sensors provided on the underlayer. At least some of the pressure sensors have a pad asperity provided thereon. The pressure sensors may be micro electromechanical systems (MEMS) pressure transducers or MEMS thermal actuators that monitor at least one of localized strain and temperature variation. Another polishing media includes a plurality of chemical sensors. Yet another polishing media includes pressure sensors, chemical sensors, and piezoelectric elements. Based upon the sensory outputs received from adjacent sensors, the piezoelectric elements provide active control to the process input by, for example, inducing localized vibration to modify the spatial removal behavior, inducing localized electric fields, or inducing localized heating/cooling elements.

    摘要翻译: 用于化学机械平面化的一种抛光介质包括底层和设置在底层上的多个压力传感器。 至少一些压力传感器具有设置在其上的垫粗糙度。 压力传感器可以是监测局部应变和温度变化中的至少一个的微机电系统(MEMS)压力换能器或MEMS热致动器。 另一抛光介质包括多个化学传感器。 另一种抛光介质包括压力传感器,化学传感器和压电元件。 基于从相邻传感器接收的感觉输出,压电元件通过例如引起局部振动来改变空间去除行为,诱导局部电场或引起局部加热/冷却元件,来为过程输入提供主动控制。