摘要:
Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.
摘要:
Systems and methods of managing workload at a data center are disclosed. An example method may include actively managing workload at a data center to realize energy savings. The method may also include providing excess power generated for the data center onto a utility grid.
摘要:
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
摘要:
A method of operating a spray unit for efficiently thermally managing one or more electronic devices. The method of operating a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
摘要:
A staggered spray nozzle system for efficiently thermally managing one or more electronic devices. The staggered spray nozzle system includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
摘要:
A coolant recovery system for reducing coolant loss within thermal management systems. The coolant recovery system includes a thermal management unit having a spray chamber and a coolant recovery chamber, a first cooling coil within the coolant recovery chamber, and a chilled water supply fluidly connected to the first cooling coil. The coolant is sprayed upon the electronic device within the spray chamber and then is collected into the coolant recovery chamber for thermal conditioning. A removable chamber may be removably positioned within the spray chamber. In an alternative embodiment, a central unit may be connected to a plurality of thermal management units.
摘要:
A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.
摘要:
In an implementation, airflow provisioning in an area by a plurality of fluid moving devices is managed through assignment of the fluid moving devices to monitor and regulate conditions at respective subsets of a plurality of locations based upon determined influence levels of the fluid moving devices on the respective locations to meet a predefined cooling influence redundancy level. The predefined cooling influence redundancy level for a particular location identifies a number of the fluid moving devices that are to monitor and regulate a condition at the particular location.
摘要:
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
摘要:
Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.