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公开(公告)号：US07032403B1
公开(公告)日：2006-04-25
申请号：US10723607
申请日：2003-11-26
申请人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
发明人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A method of controlling spray distances in a spray unit for efficiently thermally managing one or more electronic devices. The method of controlling spray distances in a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
摘要翻译： 一种控制喷射单元中的喷雾距离以有效地热管理一个或多个电子设备的方法。 在喷雾单元中控制喷雾距离的方法包括第一部分和与第一部分定位的第二部分。 第一部分包括至少一个用于朝向至少一个电子装置分配第一流体流的第一孔口。 第二部分定位在第一部分内，其中第二部分可以可滑动地定位或不可移动地定位在第一部分内。 第二部分包括至少一个用于朝向至少一个电子装置分配第二流体流的第二孔口。
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公开(公告)号：US06857283B2
公开(公告)日：2005-02-22
申请号：US10243683
申请日：2002-09-13
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.
摘要翻译： 一种用于提供能够在老化周期期间保持期望的半导体温度的有效热管理系统的半导体老化热管理系统。 半导体老化热管理系统包括用于存储一定体积的流体的储存器，与储存器流体连接的泵以及与泵流体连接的多个喷射单元。 喷射单元在燃烧期间将流体分配在半导体的表面上，从而保持相对恒定的表面温度。 每个喷射单元优选地包括固定的第一部分，其中第二部分以偏置的方式可移动地定位在第一部分内。 当在没有集成散热器的半导体中燃烧时，凹陷在老化板的插座内时，向第二部分提供的流体压力增加，从而使第二部分从第一部分延伸，从而减小与第二部分的表面的有效距离 半导体。
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公开(公告)号：US07308801B1
公开(公告)日：2007-12-18
申请号：US11356272
申请日：2006-02-15
申请人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
发明人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
IPC分类号： F25B21/02
CPC分类号： G01R31/2874 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method of operating a spray unit for efficiently thermally managing one or more electronic devices. The method of operating a spray unit includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
摘要翻译： 一种操作喷射单元以有效地热管理一个或多个电子设备的方法。 操作喷雾单元的方法包括第一部分和与第一部分定位的第二部分。 第一部分包括至少一个用于朝向至少一个电子装置分配第一流体流的第一孔口。 第二部分定位在第一部分内，其中第二部分可以可滑动地定位或不可移动地定位在第一部分内。 第二部分包括至少一个用于朝向至少一个电子装置分配第二流体流的第二孔口。
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公开(公告)号：US07013662B1
公开(公告)日：2006-03-21
申请号：US10723608
申请日：2003-11-26
申请人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
发明人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A staggered spray nozzle system for efficiently thermally managing one or more electronic devices. The staggered spray nozzle system includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
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公开(公告)号：US07021067B1
公开(公告)日：2006-04-04
申请号：US10769561
申请日：2004-01-30
申请人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
发明人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A dynamic thermal management spray system for efficiently thermally managing one or more electronic devices. The dynamic thermal management spray system includes one or more spray units having an adjustable spray characteristic. The spray characteristic of at least one spray unit is adjusted based upon the desired thermal management of one or more electronic devices. Adjusting the spray characteristic is preferably comprised of increasing/decreasing the fluid flow rate.
摘要翻译： 一种用于有效地管理一个或多个电子设备的动态热管理喷射系统。 动态热管理喷射系统包括具有可调喷雾特性的一个或多个喷雾单元。 基于一个或多个电子设备的期望的热管理来调节至少一个喷雾单元的喷雾特性。 调整喷雾特性优选包括增加/减少流体流速。
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公开(公告)号：US07506519B1
公开(公告)日：2009-03-24
申请号：US11137137
申请日：2005-05-24
申请人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
发明人： Charles L. Tilton , Tahir Cader , Nathan G. Muoio
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A staggered spray nozzle system for efficiently thermally managing one or more electronic devices. The staggered spray nozzle system includes a first portion and a second portion positioned with the first portion. The first portion includes at least one first orifice for dispensing a first fluid flow towards at least one electronic device. A second portion is positioned within the first portion, wherein the second portion may be slidably positioned or non-movably positioned within the first portion. The second portion includes at least one second orifice for dispensing a second fluid flow towards at least one electronic device.
摘要翻译： 一种交错喷嘴系统，用于有效地管理一个或多个电子设备。 交错喷嘴系统包括第一部分和与第一部分定位的第二部分。 第一部分包括至少一个用于朝向至少一个电子装置分配第一流体流的第一孔口。 第二部分定位在第一部分内，其中第二部分可以可滑动地定位或不可移动地定位在第一部分内。 第二部分包括至少一个用于朝向至少一个电子装置分配第二流体流的第二孔口。
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公开(公告)号：US06889509B1
公开(公告)日：2005-05-10
申请号：US10371403
申请日：2003-02-19
CPC分类号： G01R31/2874 , G05D23/1919
摘要： A coolant recovery system for reducing coolant loss within thermal management systems. The coolant recovery system includes a thermal management unit having a spray chamber and a coolant recovery chamber, a first cooling coil within the coolant recovery chamber, and a chilled water supply fluidly connected to the first cooling coil. The coolant is sprayed upon the electronic device within the spray chamber and then is collected into the coolant recovery chamber for thermal conditioning. A removable chamber may be removably positioned within the spray chamber. In an alternative embodiment, a central unit may be connected to a plurality of thermal management units.
摘要翻译： 冷却液回收系统，用于减少热管理系统中的冷却剂损失。 冷却剂回收系统包括具有喷雾室和冷却剂回收室的热管理单元，冷却剂回收室内的第一冷却盘管和流体连接到第一冷却盘管的冷却水供应。 冷却剂喷洒在喷雾室内的电子设备上，然后被收集到冷却剂回收室中用于热调节。 可拆卸的室可以可拆卸地定位在喷雾室内。 在替代实施例中，中央单元可以连接到多个热管理单元。
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公开(公告)号：US07086455B1
公开(公告)日：2006-08-08
申请号：US10955323
申请日：2004-09-30
CPC分类号： F28D15/0266 , F28D5/00 , F28D15/0258 , F28F7/02 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
摘要翻译： 一种用于有效地管理单个或多个半导体芯片封装的喷雾冷却系统。 喷雾冷却系统包括具有泵单元和储存器的热交换器单元，流体连接到热交换器单元的同轴管，连接到同轴管的耦合器单元和喷射模块，其中耦合器单元可拆卸地连接到 喷雾模块。 热交换器单元具有允许进入和释放空气而不干扰其运行的耐空气设计。
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公开(公告)号：US06889515B2
公开(公告)日：2005-05-10
申请号：US10368289
申请日：2003-02-14
IPC分类号： F28F7/02 , H01L23/433 , F25D23/12
CPC分类号： F28D15/0266 , F28D5/00 , F28D15/0258 , F28F7/02 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
摘要翻译： 一种用于有效地管理单个或多个半导体芯片封装的喷雾冷却系统。 喷雾冷却系统包括具有泵单元和储存器的热交换器单元，流体连接到热交换器单元的同轴管，连接到同轴管的耦合器单元和喷射模块，其中耦合器单元可拆卸地连接到 喷雾模块。 热交换器单元具有允许进入和释放空气而不干扰其运行的耐空气设计。
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公开(公告)号：US20130190941A1
公开(公告)日：2013-07-25
申请号：US13876399
申请日：2010-10-12
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , G06F1/20 , G06F1/266 , G06F2200/201 , H05K7/20836 , Y02D10/16
摘要： Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.
摘要翻译： 披露了数据中心的资源管理。 在示例性实施例中，一种方法包括确定数据中心的电力使用，以及确定数据中心的冷却液使用情况。 该方法还包括处理数据中心的资源利用上限，并且基于资源利用率上限来调整数据中心的电力和冷却流体中的至少一个。
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