摘要:
A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.
摘要:
A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.
摘要:
A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.
摘要:
A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.
摘要:
Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.
摘要:
Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.
摘要:
Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.
摘要:
The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.
摘要:
A perpendicular write head having a wrap around shield and a conformal side gap. In fabricating the write head, the leading edge shield may be chemical mechanical polished down to a level that is substantially even with a chemical mechanical polishing stop layer. Because the leading edge shield and the chemical mechanical polishing stop layer are used as RIE stop for trench RIE, a fully conformal side shield may be formed with a LTE/LES.
摘要:
The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.