摘要:
An one-time programmable read only memory is provided. An N-type doping region and a first P-type doping layer are disposed in a P-type semiconductor substrate sequentially. A second P-type doping layer is disposed between the first P-type doping layer and the N-type doping region. The second P-type doping layer with higher doping level, which has a linear structure, is served as a bit line. An electrically conductive layer is disposed over the P-type semiconductor substrate. The electrically conductive layer also has a linear structure that crosses over the first P-type doping layer. The first N-type doping layer is disposed in the P-type semiconductor substrate between the electrically conductive layer and the first P-type doping layer. The arrangement of N-type and P-type doping layer is used to be selective diode device. An anti-fuse layer is disposed between the electrically conductive layer and the first N-type doping layer.
摘要:
An one-time programmable read only memory is provided. An N-type doping region and a first P-type doping layer are disposed in a P-type semiconductor substrate sequentially. A second P-type doping layer is disposed between the first P-type doping layer and the N-type doping region. The second P-type doping layer with higher doping level, which has a linear structure, is served as a bit line. An electrically conductive layer is disposed over the P-type semiconductor substrate. The electrically conductive layer also has a linear structure that crosses over the first P-type doping layer. The first N-type doping layer is disposed in the P-type semiconductor substrate between the electrically conductive layer and the first P-type doping layer. The arrangement of N-type and P-type doping layer is used to be selective diode device. An anti-fuse layer is disposed between the electrically conductive layer and the first N-type doping layer.
摘要:
An one-time programmable read only memory is provided. An N-type doping region and a first P-type doping layer are disposed in a P-type semiconductor substrate sequentially. A second P-type doping layer is disposed between the first P-type doping layer and the N-type doping region. The second P-type doping layer with higher doping level, which has a linear structure, is served as a bit line. An electrically conductive layer is disposed over the P-type semiconductor substrate. The electrically conductive layer also has a linear structure that crosses over the first P-type doping layer. The first N-type doping layer is disposed in the P-type semiconductor substrate between the electrically conductive layer and the first P-type doping layer. The arrangement of N-type and P-type doping layer is used to be selective diode device. An anti-fuse layer is disposed between the electrically conductive layer and the first N-type doping layer.
摘要:
A method for patterning a material is provided. The method includes patterning a second material over a first material over a substrate. A surface portion of the patterned second material is converted to form a third material and a remaining patterned second material, wherein the third material is around the remaining patterned second material. One of the remaining patterned second material and the third material is removed to form a mask. The first material is patterned by using the mask.
摘要:
A method for forming a dielectric is provided. The method includes providing a substrate having a silicon-containing semiconductor layer within a process chamber. The process chamber is capable of ionizing a process precursor to a plasma comprising an oxygen-containing element and a fluorocarbon-containing element. A surface portion of the silicon-containing material is oxidized by using the plasma to convert the surface portion into an oxidized dielectric material.
摘要:
The invention is directed to an etching method for patterning a first material layer over a second material layer to expose a portion of the second material layer. The etching method comprises steps of performing a first etching process to remove a portion of the first material layer in an etching chamber and then performing an etching environment adjustment process in the etching chamber. A second etching process is performed on the first material layer and, meanwhile, a real-time etching monitor process is performed for generating an endpoint detection spectrum subsequent to the etching environment adjustment process, wherein at least one of signals of the endpoint detection spectrum is stabilized by the inert gas plasma treatment.
摘要:
A patterning method is provided. First, a substrate having an objective material layer thereon is provided. Thereafter, a mask layer is formed on the objective material layer. Afterwards, a patterned layer is formed over the mask layer, wherein a material of the patterned layer includes a metal-containing substance. Then, the mask layer is patterned to form a patterned mask layer. Further, the objective material layer is patterned, using the patterned mask layer as a mask.
摘要:
An apparatus for forming a dielectric layer includes a process chamber configured for disposing a substrate therein, a gas inlet for delivering a mixture gas to the process chamber, and an RF generator for producing a plasma from the mixture gas. The plasma includes an oxygen-containing element and a fluorocarbon-containing element. The apparatus also has a heating element configured for maintaining the chamber temperature at a desired process temperature, for example, at 800° C. or lower, and a connector to a vacuum pump for maintaining a process pressure. The apparatus is configured for using the plasma to convert a surface portion of the substrate into an oxidized dielectric material.
摘要:
A patterning method is provided. First, a substrate having an objective material layer thereon is provided. Thereafter, a mask layer is formed on the objective material layer. Afterwards, a patterned layer is formed over the mask layer, wherein a material of the patterned layer includes a metal-containing substance. Then, the mask layer is patterned to form a patterned mask layer. Further, the objective material layer is patterned, using the patterned mask layer as a mask.
摘要:
Methods are described which comprise: providing a plasma etching apparatus having an etching chamber; disposing a substrate to be etched in the chamber; introducing N2 gas and one or more process gases into the chamber; and etching the substrate, wherein the introduction of the N2 gas is stopped prior to etching, and wherein etching comprises an initial plasma ignition wherein at least a portion of the N2 gas remains present in the chamber during initial plasma ignition. Additional methods are described which comprise: providing a plasma etching apparatus having an etching chamber; disposing a substrate to be etched in the chamber; introducing N2 gas and one or more process gases into the chamber; applying power to an electrode in the chamber such that an N2 memory species is formed; and etching the substrate, where the introduction of the N2 gas into the chamber can be stopped prior to etching. Other methods are also described which comprise: providing a plasma etching apparatus having an etching chamber; disposing a substrate to be etched in the chamber; introducing N2 gas into the chamber; applying power to an electrode in the chamber such that an N2 memory species is formed; removing the applied power from the electrode in the chamber; stopping the introduction of the N2 gas into the chamber and introducing one or more process gases into the chamber; and etching the substrate.
摘要翻译:描述了包括:提供具有蚀刻室的等离子体蚀刻装置的方法; 将待蚀刻的基板设置在所述室中; 将N 2 O 2气体和一种或多种工艺气体引入所述室中; 以及蚀刻所述衬底,其中在蚀刻之前停止引入N 2 O 2气体,并且其中蚀刻包括初始等离子体点火,其中N 2 N 2 N 2的至少一部分 初始等离子体点火期间气体保留在腔室中。 描述了附加方法,其包括:提供具有蚀刻室的等离子体蚀刻装置; 将待蚀刻的基板设置在所述室中; 将N 2 O 2气体和一种或多种工艺气体引入所述室中; 向腔室中的电极施加功率,使得形成N 2种记忆物质; 并且在蚀刻之前可以停止引入N 2气体到腔室中的衬底。 还描述了其它方法,其包括:提供具有蚀刻室的等离子体蚀刻装置; 将待蚀刻的基板设置在所述室中; 将N 2 O 2气体引入室中; 向腔室中的电极施加功率,使得形成N 2种记忆物质; 从室中的电极去除施加的功率; 停止将N 2 N 2气体引入室中并将一种或多种工艺气体引入室中; 并蚀刻衬底。