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    IMAGE CAPTURE METHOD AND PORTABLE COMMUNICATION DEVICE
    1.
    发明申请
    IMAGE CAPTURE METHOD AND PORTABLE COMMUNICATION DEVICE 有权
    图像捕获方法和便携式通信设备

    公开(公告)号：US20110267524A1

    公开(公告)日：2011-11-03

    申请号：US12915015

    申请日：2010-10-29

    申请人： Chien-Hsin Lee ,  Chia-Hua Chang ,  Sung-Hao Lin

    发明人： Chien-Hsin Lee ,  Chia-Hua Chang ,  Sung-Hao Lin

    IPC分类号： H04N5/232 ,  H04N5/225

    CPC分类号： H04N5/23248 ,  H04N5/23212 ,  H04N5/23216 ,  H04N5/23219 ,  H04N5/23258 ,  H04N5/23293

    摘要： An image capture method is provided for a portable communication device having a display unit, which real-time displays an image at least including an object to be shot. The method includes sensing a moving acceleration of the portable communication device based on a first gravity-sensing threshold value. A touch focus signal is received so that the portable communication device focuses on one of the objects to be the focus-lock object. Then, according to the touch focus signal, the first gravity-sensing threshold value is changed to a second gravity-sensing threshold value, which is larger than the first gravity-sensing threshold value. The image at least including the focus-lock object is captured.

    摘要翻译： 提供了一种用于具有显示单元的便携式通信设备的图像捕获方法，该显示单元实时显示至少包括要被拍摄的对象的图像。 该方法包括基于第一重力感测阈值来感测便携式通信设备的移动加速度。 接收到触摸对焦信号，使得便携式通信装置将对象中的一个对焦为对焦锁定对象。 然后，根据触摸对焦信号，将第一重力感测阈值变更为大于第一重力感测阈值的第二重力感测阈值。 捕获至少包含对焦锁定对象的图像。

    Methods of fabricating a micromechanical structure
    5.
    发明授权
    Methods of fabricating a micromechanical structure 有权
    制造微机械结构的方法

    公开(公告)号：US08278724B2

    公开(公告)日：2012-10-02

    申请号：US12254493

    申请日：2008-10-20

    申请人： Chia-Hua Chang ,  Hua-Shu Wu ,  Tsung-Mu Lai

    发明人： Chia-Hua Chang ,  Hua-Shu Wu ,  Tsung-Mu Lai

    IPC分类号： H01L27/14

    CPC分类号： B81C1/00142

    摘要： Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.

    摘要翻译： 提供了制造微机电结构的方法。 制造微机电结构的方法的示例性实施例包括提供基底。 第一图案化牺牲层形成在衬底的部分上，第一图案化牺牲层包括主体部分和突出部分。 第二图案化牺牲层形成在第一牺牲层上，覆盖突出部分和第一图案化牺牲层的主体部分的部分，其中第二图案化牺牲层不覆盖第一图案化牺牲层的侧壁。 元件层形成在衬底上，覆盖衬底的部分，第一图案化牺牲层和第二图案化牺牲层。 去除第一和第二图案化牺牲层，在基底上留下微结构。

    METHOD FOR FABRICATING CHARGE-TRAPPING MEMORY
    7.
    发明申请
    METHOD FOR FABRICATING CHARGE-TRAPPING MEMORY 有权
    用于制造电荷捕获存储器的方法

    公开(公告)号：US20080025087A1

    公开(公告)日：2008-01-31

    申请号：US11460497

    申请日：2006-07-27

    申请人： Yen-Hao Shih ,  Jung-Yu Hsieh ,  Yi-Lin Yang ,  Chia-Hua Chang ,  Jenn-Gwo Hwu

    发明人： Yen-Hao Shih ,  Jung-Yu Hsieh ,  Yi-Lin Yang ,  Chia-Hua Chang ,  Jenn-Gwo Hwu

    IPC分类号： G11C16/04

    CPC分类号： H01L21/76838 ,  H01L29/66833 ,  H01L29/792

    摘要： A manufacturing method of a charge-trapping memory device is provided. This method includes forming a stacked structure having at least a charge-trapping medium. An annealing process in a hydrogen gas is then performed on the stacked structure subsequent to the device fabrication process. The annealing process is conducted at a temperature of about 350° C. to 450° C. and with the concentration of the hydrogen gas greater than 0.5 mole percent.

    摘要翻译： 提供了一种电荷俘获存储器件的制造方法。 该方法包括形成至少具有电荷捕获介质的堆叠结构。 然后在器件制造过程之后对堆叠结构进行氢气中的退火处理。 退火过程在约350℃至450℃的温度下进行，氢气的浓度大于0.5摩尔％。

    Thickening method of an electroforming shim
    8.
    发明申请
    Thickening method of an electroforming shim 审中-公开
    电铸垫片的增稠方法

    公开(公告)号：US20070039826A1

    公开(公告)日：2007-02-22

    申请号：US11206274

    申请日：2005-08-18

    申请人： Chia-Hua Chang ,  Cherng-Yuh Su ,  Jen-Chin Wu ,  Jun-Lung Hsi

    发明人： Chia-Hua Chang ,  Cherng-Yuh Su ,  Jen-Chin Wu ,  Jun-Lung Hsi

    IPC分类号： C25D1/10

    CPC分类号： C25D1/10

    摘要： A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination.

    摘要翻译： 提供电铸垫片的增厚方法以增加金属垫片的厚度。 在本实施例中，使用具有稀土元素的有源焊料来增加组合工艺期间焊料在衬底表面上的水分。 之后，通过机械搅拌排出稀土元素的氧化物以产生干净的接触表面。 熔化的填料在基材表面上保湿以达到组合。

    Method of fastening mold shell with mold seat without risk of causing mold shell to crack
    9.
    发明申请
    Method of fastening mold shell with mold seat without risk of causing mold shell to crack 有权
    用模座固定模壳的方法，不会造成模壳破裂的风险

    公开(公告)号：US20050066510A1

    公开(公告)日：2005-03-31

    申请号：US10671542

    申请日：2003-09-29

    申请人： Jen-Chin Wu ,  Chia-Hua Chang ,  Ming-Jen Wang

    发明人： Jen-Chin Wu ,  Chia-Hua Chang ,  Ming-Jen Wang

    IPC分类号： B23P15/24 ,  C25D1/10 ,  B23P25/00 ,  B23P11/00

    CPC分类号： B23P15/24 ,  C25D1/10 ,  Y10T29/49885 ,  Y10T29/49888 ,  Y10T29/49947 ,  Y10T29/49966 ,  Y10T29/49982

    摘要： A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.

    摘要翻译： 设计一种方法是用模具座固定模壳，而不会造成模壳破裂。 该方法包括第一步骤，其中通过电铸在模型上形成金属壳。 然后通过电铸来焊接金属外壳至少有一个螺母。 金属壳与模型分离，然后通过电弧喷涂提供厚度的金属层，金属层围绕螺母。 模具座设置有至少一个通孔。 模具壳体通过螺栓与模具座紧固，该螺栓通过模具座的通孔与螺母接合。