公开(公告)号：US20080038355A1

公开(公告)日：2008-02-14

申请号：US11876347

申请日：2007-10-22

申请人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

发明人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

IPC分类号： A61K9/00 ,  A61K31/56 ,  A61P43/00

CPC分类号： A61K9/5036 ,  A61K9/145 ,  A61K9/1617 ,  A61K9/1652 ,  A61K9/2081 ,  A61K31/573

摘要： Bioadhesive steroid nanoparticles are used to prepare a rapidly disintegrating solid oral dosage form of steroid. The bioadhesive steroid nanoparticles have a bioadhesive polymer surrounding the steroid nanoparticles and with an average diameter of less than 1000 nm. Hence, the solid oral dosage form, containing the bioadhesive steroid nanoparticles, a disintegrant and an effervescent agent, instantly disintegrates in the oral cavity and adheres on the periodontal pocket and oral mucosa to release steroid rapidly.

摘要翻译： 生物粘附类固醇纳米颗粒用于制备快速崩解固体口服剂型的类固醇。 生物粘附性类固醇纳米颗粒具有围绕类固醇纳米颗粒并具有小于1000nm的平均直径的生物粘附聚合物。 因此，含有生物粘附性类固醇纳米颗粒，崩解剂和泡腾剂的固体口服剂型立即在口腔中分解并粘附在牙周袋和口腔粘膜上以迅速释放类固醇。

公开(公告)号：US20060013873A1

公开(公告)日：2006-01-19

申请号：US10892918

申请日：2004-07-16

申请人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

发明人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

IPC分类号： A61K31/573 ,  A61K9/20

CPC分类号： A61K9/5036 ,  A61K9/145 ,  A61K9/1617 ,  A61K9/1652 ,  A61K9/2081 ,  A61K31/573

摘要： Bioadhesive steroid nanoparticles are used to prepare a rapidly disintegrating solid oral dosage form of steroid. The bioadhesive steroid nanoparticles have a bioadhesive polymer surrounding the steroid nanoparticles and with an average diameter of less than 1000 nm. Hence, the solid oral dosage form, containing the bioadhesive steroid nanoparticles, a disintegrant and an effervescent agent, instantly disintegrates in the oral cavity and adheres on the periodontal pocket and oral mucosa to release steroid rapidly.

摘要翻译： 生物粘附类固醇纳米颗粒用于制备快速崩解固体口服剂型的类固醇。 生物粘附性类固醇纳米颗粒具有围绕类固醇纳米颗粒并具有小于1000nm的平均直径的生物粘附聚合物。 因此，含有生物粘附性类固醇纳米颗粒，崩解剂和泡腾剂的固体口服剂型立即在口腔中分解并粘附在牙周袋和口腔粘膜上以迅速释放类固醇。

公开(公告)号：US20050239747A1

公开(公告)日：2005-10-27

申请号：US10828700

申请日：2004-04-21

申请人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

发明人： Chih-Chiang Yang ,  Yuan-Chih Le ,  Chao-Cheng Liu

IPC分类号： A61K31/56 ,  A61K31/573 ,  A61K31/724

CPC分类号： A61K31/56 ,  A61K9/0014 ,  A61K9/1272 ,  A61K31/573 ,  A61K47/6951 ,  B82Y5/00

摘要： Enhanced transdermal composition comprising a niosome, which retains within its structure a cyclodextrin inclusion complex of a steroidal active agent and a vesicle of nonionic surfactant are provided herein, which increases the permeability of dermal tissue to transdermally administered steroidal active agents. Methods for producing the enhanced transdermal composition as well as its application are also provided.

摘要翻译： 增强的透皮组合物包含在其结构内保留甾体活性剂的环糊精包合物和非离子表面活性剂的囊泡的niosome，其提高真皮组织对透皮给药的甾体活性剂的渗透性。 还提供了用于生产增强的透皮组合物的方法及其应用。

公开(公告)号：US20090278242A1

公开(公告)日：2009-11-12

申请号：US12428277

申请日：2009-04-22

申请人： Yao-Kai Chuang ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

发明人： Yao-Kai Chuang ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.

摘要翻译： 提供了包括引线框架，芯片封装，第二芯片和第二模塑料的堆叠式芯片封装结构。 引线框架包括彼此绝缘的多个第一引线和第二引线。 第一引线具有第一上表面，并且第二引线具有与第一上表面不共面的第二上表面。 芯片封装设置在第一引线上并且包括基板，第一芯片和第一模塑料。 第二芯片堆叠在芯片封装上并电连接到第二引线。 第二模塑料设置在引线框架上，并且填充在第一引线和用于封装芯片封装和第二芯片的第二引线之间。

公开(公告)号：US20090267210A1

公开(公告)日：2009-10-29

申请号：US12428762

申请日：2009-04-23

申请人： Yao-Kai CHUANG ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

发明人： Yao-Kai CHUANG ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2225/0651 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package and a manufacturing method thereof are provided. The package includes a die pad, a plurality of first and second contact pads, a first die, a second die and a molding compound. The contact pads adjacent to at least one side of the die pad are arranged along an inner row and an outer row with respect to the die pad. The first die is fixed on the first die and electrically connected to the first contact pads by wire-bonding. The second die is fixed on the first die and electrically connected to the second contact pads by wire-bonding. The molding compound covers the second die, the first die, the die pad, the first contact pads and the second contact pads. The bottoms of the die pad, the first contact pads and the second contact pads are exposed at the bottom surface of the molding compound.

摘要翻译： 提供一种集成电路封装及其制造方法。 封装包括管芯焊盘，多个第一和第二接触焊盘，第一管芯，第二管芯和模塑料。 与芯片焊盘的至少一侧相邻的接触焊盘相对于管芯焊盘沿着内排和外排布置。 第一管芯固定在第一管芯上，并通过引线接合电连接到第一接触焊盘。 第二管芯固定在第一管芯上，并通过引线接合电连接到第二接触焊盘。 模塑料覆盖第二模具，第一模具，芯片焊盘，第一接触焊盘和第二接触焊盘。 芯片焊盘的底部，第一接触焊盘和第二接触焊盘在模塑料的底表面露出。

公开(公告)号：US07834469B2

公开(公告)日：2010-11-16

申请号：US12428277

申请日：2009-04-22

申请人： Yao-Kai Chuang ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

发明人： Yao-Kai Chuang ,  Chien Liu ,  Chih-Ming Chung ,  Chao-Cheng Liu

IPC分类号： H01L23/29

CPC分类号： H01L23/49548 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.

摘要翻译： 提供了包括引线框架，芯片封装，第二芯片和第二模塑料的堆叠式芯片封装结构。 引线框架包括彼此绝缘的多个第一引线和第二引线。 第一引线具有第一上表面，并且第二引线具有与第一上表面不共面的第二上表面。 芯片封装设置在第一引线上并且包括基板，第一芯片和第一模塑料。 第二芯片堆叠在芯片封装上并电连接到第二引线。 第二模塑料设置在引线框架上，并且填充在第一引线和用于封装芯片封装和第二芯片的第二引线之间。

公开(公告)号：US20090278243A1

公开(公告)日：2009-11-12

申请号：US12429476

申请日：2009-04-24

申请人： Yao-Kai Chuang ,  Chih-Ming Chung ,  Chien Liu ,  Chao-Cheng Liu

发明人： Yao-Kai Chuang ,  Chih-Ming Chung ,  Chien Liu ,  Chao-Cheng Liu

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L21/4832 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads.

摘要翻译： 提供了包括芯片载体，第一芯片，第二芯片，第三芯片和绝缘材料的堆叠型芯片封装结构。 芯片载体包括两个管芯焊盘和围绕焊盘的多个引线。 第一芯片和第二芯片分别设置在芯片焊盘上，并且通过引线接合电连接到引线。 第三芯片穿过第一芯片和第二芯片，分别电连接到第一芯片和第二芯片。 绝缘材料设置在芯片载体上，用于封装第一芯片，第二芯片和第三芯片，并且填充在芯片焊盘和引线之间。