Abstract:
A wafer structure with a buffer layer is provided. The wafer structure comprises a wafer which has at least one pad formed thereon, a passivation layer formed on the wafer for partially exposing the at least one pad, a buffer layer formed on the passivation layer and the pad, and an under bump metallurgy (UBM) formed on the buffer layer. The buffer layer comprises a thickness-increased inner buffering member made from aluminum and located between the UBM and the pad to enhance the shock-absorbing ability of the wafer in a drop test to avoid the conductive bump bonded to a substrate coming off or cracking. The invention can also enhance the bonding between the conductive bump and the UBM. The buffer layer may further comprise an outer buffering member made of polyimide, coated on the passivation layer and partially arranged between the UBM and the passivation layer.
Abstract:
A method for removing residual flux applied to a wafer process is disclosed by the present invention, the method comprises the steps of: providing a wafer; forming a plurality of bumps on the surface of the wafer; coating flux on the surfaces of the bumps; reflowing the bumps; immersing the wafer in a cleaning solvent; cleaning the wafer by a plasma descum cleaning; rinsing the wafer; and drying the wafer.
Abstract:
A paper feeding apparatus comprises a fluid-supply device; a connecting pipe communicating with the fluid-supply device; and a plurality of force units connecting to the connecting pipe, each force unit having a pressing wheel on one end thereof; wherein each pressing wheel operates in coordination with a paper feeding wheel for feeding paper. The force units output equal force according to the same hydraulic pressure so that the pressing wheels provide the same component force to the corresponding paper feeding wheel so as to improve the quality of paper feeding. Furthermore, a method for using the paper feeding apparatus is disclosed.
Abstract:
A paper feeding apparatus includes a fluid-supply device, a connecting pipe communicating with the fluid-supply device, and a plurality of force units connecting to the connecting pipe, each force unit having a pressing wheel on one end thereof, wherein each pressing wheel operates in coordination with a paper feeding wheel for feeding paper. The force units output equal force according to the same hydraulic pressure so that the pressing wheels provide the same component force to the corresponding paper feeding wheel so as to improve the quality of paper feeding. Furthermore, a method for using the paper feeding apparatus is disclosed.
Abstract:
A method and system for preventing white pixel difficulties resulting from undesired current induced in an image sensor having a photodiode and a depletion region therein. The photodiode is isolated in a pixel layout for an image sensor. A depletion region is configured, such that the depletion region is maintained in a defect-free region associated with the pixel layout for the image sensor, thereby reducing white pixel difficulties caused by induced and undesired current. The image sensor is preferably a CMOS image sensor. A depletion region of the photodiode is constantly maintained in a defect-free region during operation of the CMOS image sensor.
Abstract:
A solid tire includes an annular tire body having opposite left and right side faces and a ground contacting face interconnecting the left and right side faces. Each of the left and right side faces is formed with a plurality of axially extending blind bores. Each of the blind bores has an open end, a closed end opposite to the open end, a reduced section extending inwardly from the open end, and an enlarged section extending from the reduced section to the closed end. The enlarged section of each of the blind bores reduces gradually in cross-section toward the reduced section and the closed end.