Portable liquid level detector
    1.
    发明授权

    公开(公告)号:US07091868B2

    公开(公告)日:2006-08-15

    申请号:US10634349

    申请日:2003-08-04

    IPC分类号: G08B21/00

    CPC分类号: G01F23/00 G01F23/263

    摘要: A portable liquid level detector. The detector comprises a portable casing, a power supply unit disposed in the portable casing, a sensing device coupled to the power supply unit to sense a capacitance within a container and to output a enable signal when a difference in the capacitance is detected, a light emission device coupled to the sensing unit that illuminates after receiving the enable signal, and an alarm device coupled to the sensing unit that sounds after receiving the enable signal.

    Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring
    2.
    发明授权
    Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring 有权
    化学机械抛光装置具有用于测量导向环的测量装置

    公开(公告)号:US06923709B2

    公开(公告)日:2005-08-02

    申请号:US10410558

    申请日:2003-04-07

    IPC分类号: B24B49/00

    CPC分类号: B24B37/32 B24B49/00

    摘要: A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.

    摘要翻译: 一种具有用于测量导向环的测量装置的CMP(化学机械抛光)装置。 提供了抛光台。 晶片装载/卸载装置位于抛光台的第一侧。 测量装置位于抛光台的第二侧。 一种具有与第一侧面相反的第一横向和第二横向的载体,其中所述第一横向面向所述抛光台,所述晶片装载/卸载装置或所述测量装置。 引导环布置在载体的第一侧面上。 传送装置设置在载体的第二侧面上并连接到载体上,其中传送装置用于将载体移动到抛光台,晶片装载/卸载装置或测量装置上。 测量装置用于自动并立即测量导环上刻痕的严重程度。

    In-line oscillating device
    3.
    发明授权
    In-line oscillating device 有权
    在线振荡装置

    公开(公告)号:US06743081B2

    公开(公告)日:2004-06-01

    申请号:US10034328

    申请日:2001-12-28

    申请人: Chih-Kun Chen

    发明人: Chih-Kun Chen

    IPC分类号: B24B100

    摘要: An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.

    摘要翻译: 在线振荡装置主要由振荡槽,振荡管和振荡发生器组成。 振荡管设置在振荡槽中,与浆管连接。 用于产生超声波的振荡发生器安装在振荡槽上。 此外,振荡槽填充有介质,以将由振荡发生器产生的超声波传输到振荡管。 在线振荡装置适合安装在需要振荡的浆料管道的任何位置。

    Wafer cleaning apparatus with multiple wash-heads
    4.
    发明授权
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号:US07252099B2

    公开(公告)日:2007-08-07

    申请号:US10655224

    申请日:2003-09-05

    IPC分类号: B08B3/00

    摘要: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译: 在晶片清洗之后,在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座,该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外,旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置,可以完全驱动旋转模块。 此外,多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

    Wafer carrier
    6.
    发明授权
    Wafer carrier 有权
    晶圆载体

    公开(公告)号:US06671576B1

    公开(公告)日:2003-12-30

    申请号:US10391717

    申请日:2003-03-19

    申请人: Chih-Kun Chen

    发明人: Chih-Kun Chen

    IPC分类号: G06F700

    摘要: A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.

    摘要翻译: 一种能够检测其支撑板的定位精度的晶片载体装置。 在本发明中,连接到机械臂的支撑板具有三个反射器和定位窗。 检测装置具有垂直信号发生器,用于向垂直信号接收器输出垂直对准信号,并且三个电平检测器分别向对应的反射器输出第二信号,并从相应的反射器接收相应的反射电平检测信号。 确定单元根据垂直对准信号确定支撑板是否与垂直信号接收器对准。 当支撑板不与垂直信号接收器对准时,确定单元输出位置整流信号。 驱动器通过机械臂移动支撑板,以根据位置整流信号对准垂直信号接收器。

    Wafer cleaning apparatus with multiple wash-heads
    8.
    发明申请
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号:US20050051200A1

    公开(公告)日:2005-03-10

    申请号:US10655224

    申请日:2003-09-05

    IPC分类号: B08B3/02 H01L21/00

    摘要: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译: 在晶片清洗之后,在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座,该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外,旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置,可以完全驱动旋转模块。 此外,多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

    Method of measuring pore depth on the surface of a polishing pad

    公开(公告)号:US06745631B2

    公开(公告)日:2004-06-08

    申请号:US10435440

    申请日:2003-05-09

    IPC分类号: G01N2918

    摘要: A method of measuring pore depth on the surface of a polishing pad during processing. In the present invention, a planar ultrasound sensing device is disposed a predetermined distance above the surface of a polishing pad. The planar ultrasound sensing device sends out a plurality of ultrasound signals to the surface and the pores therein, and receives a plurality of reflected signals from the pad surface and constituent pores. The difference between pore depth and the surface is determined to establish first depth difference data according to the time delay in the reflected signals. The polishing pad is rotated to obtain second to Nth depth difference data. A relational image relative to the surface and the pores of the polishing pad is obtained according to the first to Nth depth difference data.