-
公开(公告)号：US07699648B2
公开(公告)日：2010-04-20
申请号：US12355324
申请日：2009-01-16
申请人： Ching-Jen Wang , Chu-Chieh Pan , Chih-hao Kuo
发明人： Ching-Jen Wang , Chu-Chieh Pan , Chih-hao Kuo
IPC分类号： H01R13/60
CPC分类号： H01R13/658 , H01R12/724
摘要： This invention discloses a stackable connector assembly, which includes a first connector, a second connector, a shielding member, a contact member, and a ground member. The second connector is placed above the first connector. The shielding member is covered on the first connector. The contact member is used for connecting the shielding member and the ground member. This structure can reduce the electromagnetic radiation from the first connector.
摘要翻译： 本发明公开了一种可堆叠连接器组件，其包括第一连接器，第二连接器，屏蔽构件，接触构件和接地构件。 第二连接器位于第一连接器的上方。 屏蔽部件被覆盖在第一连接器上。 接触构件用于连接屏蔽构件和接地构件。 这种结构可以减少来自第一连接器的电磁辐射。
-
公开(公告)号：US07953134B2
公开(公告)日：2011-05-31
申请号：US12347392
申请日：2008-12-31
申请人： Ming-Ta Chin , Kuo-Feng Huang , Ping-Fei Shen , Ching-Jen Wang , Shih-Pang Chang
发明人： Ming-Ta Chin , Kuo-Feng Huang , Ping-Fei Shen , Ching-Jen Wang , Shih-Pang Chang
IPC分类号： H01S5/00
CPC分类号： H01S5/343 , B82Y20/00 , H01L33/06 , H01L33/30 , H01S5/0216 , H01S5/0217 , H01S5/309 , H01S5/3407
摘要： A semiconductor light-emitting device includes a substrate, a first cladding layer over the substrate, an active region on the first cladding layer, and a second cladding layer on the active region, wherein the active region includes a first type barrier layer that is doped and a second type barrier layer that is undoped, the first type barrier layer being closer to the first cladding layer than the second type barrier layer.
摘要翻译： 一种半导体发光器件，包括：衬底，衬底上的第一覆层，第一覆层上的有源区和有源区上的第二覆层，其中有源区包括掺杂的第一类阻挡层 以及不掺杂的第二类型阻挡层，所述第一类型阻挡层比所述第二类型阻挡层更靠近所述第一包覆层。
-
公开(公告)号：US20120182704A1
公开(公告)日：2012-07-19
申请号：US13349333
申请日：2012-01-12
申请人： Chien-Yi Lee , Ching-Jen Wang , Yu-Ti Kuo , Chun-Liang Chen
发明人： Chien-Yi Lee , Ching-Jen Wang , Yu-Ti Kuo , Chun-Liang Chen
IPC分类号： H05K5/00
CPC分类号： H05K9/0067
摘要： An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.
摘要翻译： 提供了包括导电元件，导电层和外壳的电子设备。 壳体具有表面，第一支撑构件和第二支撑构件。 第一支撑构件和第二支撑构件设置在表面上，并且第一支撑构件具有悬挂臂。 壳体，第一支撑构件和第二支撑构件一体地形成，并且导电层存在于壳体，第一支撑构件和第二支撑构件的表面上。 导电元件按压第一悬臂以接触第二支撑构件，使得接地电路形成有导电元件，第一悬挂臂，第二支撑构件和表面。
-
公开(公告)号：US08023278B2
公开(公告)日：2011-09-20
申请号：US12120304
申请日：2008-05-14
申请人： Ching-Jen Wang
发明人： Ching-Jen Wang
CPC分类号： H05K1/0256 , H05K1/0237 , H05K1/0266 , H05K1/181 , H05K3/28 , H05K2201/09236 , H05K2201/09936
摘要： A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.
摘要翻译： 电路板包括多个导电层，多个绝缘层，电信网络连接端口和调制解调器卡处理模块。 高电压信号线布置在导电层之一处。 绝缘层分别设置在每个导电层之间。 电信网络连接端口设置在导电层上并与高压信号线的一端电连接。 调制解调器卡处理模块设置在导电层上并与高电压信号线的另一端电连接。
-
公开(公告)号：US08553387B2
公开(公告)日：2013-10-08
申请号：US13042406
申请日：2011-03-07
申请人： Ching-Jen Wang , Fang-Teng Chung , Wen-Hsieh Hsieh
发明人： Ching-Jen Wang , Fang-Teng Chung , Wen-Hsieh Hsieh
CPC分类号： H05K9/0067
摘要： This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
摘要翻译： 本发明提供了一种包括壳体和电路板的电子设备。 外壳有开口。 电路板位于壳体中，并且至少包括导电层和表面绝缘层。 导电层包括信号传输部分和静态感应部分。 静电感应部分与导电层上的信号传输部分电气断开，静电感应部分比信号传输部分更靠近开口。 表面绝缘层覆盖电路板上的信号传输部分并暴露静态感应部分。
-
公开(公告)号：US20110317378A1
公开(公告)日：2011-12-29
申请号：US13042406
申请日：2011-03-07
申请人： Ching-Jen Wang , Fang-Teng Chung , Wen-Hsieh Hsieh
发明人： Ching-Jen Wang , Fang-Teng Chung , Wen-Hsieh Hsieh
IPC分类号： H05K5/00
CPC分类号： H05K9/0067
摘要： This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
摘要翻译： 本发明提供了一种包括壳体和电路板的电子设备。 外壳有开口。 电路板位于壳体中，并且至少包括导电层和表面绝缘层。 导电层包括信号传输部分和静态感应部分。 静电感应部分与导电层上的信号传输部分电气断开，静电感应部分比信号传输部分更靠近开口。 表面绝缘层覆盖电路板上的信号传输部分并暴露静态感应部分。
-
公开(公告)号：US20070291464A1
公开(公告)日：2007-12-20
申请号：US11717683
申请日：2007-03-14
申请人： Ching-Jen Wang
发明人： Ching-Jen Wang
IPC分类号： H05K7/00
CPC分类号： H05K9/0028 , H01R13/6594
摘要： This invention discloses an EMI shielding module installed on the circuit board with at least one connection hole. This EMI shielding module includes a shielding case and at least one protrusion. The shielding case capped on the device is arranged on the circuit board. The protrusion is arranged on the shielding case and inserted in the connection hole. Therefore, the shielding case is grounded by connecting it to the circuit board with the protrusion inserted in the connection hole.
摘要翻译： 本发明公开了一种安装在具有至少一个连接孔的电路板上的EMI屏蔽模块。 该EMI屏蔽模块包括屏蔽壳和至少一个突起。 设在电路板上的屏蔽盒设在电路板上。 突出部布置在屏蔽壳上并插入连接孔中。 因此，通过将突起插入连接孔中将屏蔽壳体连接到电路板而接地。
-
公开(公告)号：US08760885B2
公开(公告)日：2014-06-24
申请号：US13349333
申请日：2012-01-12
申请人： Chien-Yi Lee , Ching-Jen Wang , Yu-Ti Kuo , Chun-Liang Chen
发明人： Chien-Yi Lee , Ching-Jen Wang , Yu-Ti Kuo , Chun-Liang Chen
CPC分类号： H05K9/0067
摘要： An electronic device including a conductive element, a conductive layer, and a case is provided. The case has a surface, a first supporting member, and a second supporting member. The first supporting member and the second supporting member are disposed on the surface, and the first supporting member has a suspending arm. The case, the first supporting member and the second supporting member are integrally formed, and the conductive layer exists on the surface of the case, the first supporting member, and the second supporting member. The conductive element presses the first suspending arm to contact the second supporting member, such that a ground circuit is formed with the conductive element, the first suspending arm, the second supporting member, and the surface.
摘要翻译： 提供了包括导电元件，导电层和外壳的电子设备。 壳体具有表面，第一支撑构件和第二支撑构件。 第一支撑构件和第二支撑构件设置在表面上，并且第一支撑构件具有悬挂臂。 壳体，第一支撑构件和第二支撑构件一体地形成，并且导电层存在于壳体，第一支撑构件和第二支撑构件的表面上。 导电元件按压第一悬臂以接触第二支撑构件，使得接地电路形成有导电元件，第一悬挂臂，第二支撑构件和表面。
-
公开(公告)号：US07497726B2
公开(公告)日：2009-03-03
申请号：US11717113
申请日：2007-03-13
申请人： Ching-Jen Wang , Chu-Chieh Pan , Chih-hao Kuo
发明人： Ching-Jen Wang , Chu-Chieh Pan , Chih-hao Kuo
CPC分类号： H01R13/658 , H01R12/724
摘要： This invention discloses a stackable connector assembly, which includes a first connector, a second connector, a shielding member, a contact member, and a ground member. The second connector is placed above the first connector. The shielding member is covered on the first connector. The contact member is used for connecting the shielding member and the ground member. This structure can reduce the electromagnetic radiation from the first connector.
摘要翻译： 本发明公开了一种可堆叠连接器组件，其包括第一连接器，第二连接器，屏蔽构件，接触构件和接地构件。 第二连接器位于第一连接器的上方。 屏蔽部件被覆盖在第一连接器上。 接触构件用于连接屏蔽构件和接地构件。 这种结构可以减少来自第一连接器的电磁辐射。
-
公开(公告)号：US20080304243A1
公开(公告)日：2008-12-11
申请号：US12120304
申请日：2008-05-14
申请人： Ching-Jen Wang
发明人： Ching-Jen Wang
IPC分类号： H05K7/02
CPC分类号： H05K1/0256 , H05K1/0237 , H05K1/0266 , H05K1/181 , H05K3/28 , H05K2201/09236 , H05K2201/09936
摘要： A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.
摘要翻译： 电路板包括多个导电层，多个绝缘层，电信网络连接端口和调制解调器卡处理模块。 高电压信号线布置在导电层之一处。 绝缘层分别设置在每个导电层之间。 电信网络连接端口设置在导电层上并与高压信号线的一端电连接。 调制解调器卡处理模块设置在导电层上并与高电压信号线的另一端电连接。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.012 秒)