Method of manufacturing a semiconductor structure and separating the semiconductor from a substrate
    2.
    发明授权
    Method of manufacturing a semiconductor structure and separating the semiconductor from a substrate 有权
    制造半导体结构并将半导体与衬底分离的方法

    公开(公告)号:US08664087B2

    公开(公告)日:2014-03-04

    申请号:US13310342

    申请日:2011-12-02

    IPC分类号: H01L21/30 H01L21/46

    摘要: A method of manufacturing a semiconductor structure is disclosed, which includes providing a substrate comprising a bottom surface and a growth surface opposite to the bottom surface; forming a buffer layer comprising a first surface which is not a C-plane substantially parallel with the bottom surface on the growth surface; forming a semiconductor structure on the buffer layer; forming at least one cavity in the buffer layer; extending the cavity along a main extending direction; separating the substrate and the semiconductor structure; wherein the main extending direction is substantially not parallel with the normal direction of the first surface.

    摘要翻译: 公开了一种制造半导体结构的方法,其包括提供包括底表面和与底表面相对的生长表面的基底; 形成缓冲层,所述缓冲层包括第一表面,所述第一表面不是与生长表面上的底表面基本平行的C平面; 在缓冲层上形成半导体结构; 在所述缓冲层中形成至少一个空腔; 沿着主延伸方向延伸空腔; 分离衬底和半导体结构; 其中所述主延伸方向基本上不与所述第一表面的法线方向平行。

    LIGHT EMITTING DEVICE WITH QCSE-REVERSED AND QCSE-FREE MULTI QUANTUM WELL STRUCTURE
    3.
    发明申请
    LIGHT EMITTING DEVICE WITH QCSE-REVERSED AND QCSE-FREE MULTI QUANTUM WELL STRUCTURE 审中-公开
    具有QCSE反射和无QCSE的多量子结构的发光器件

    公开(公告)号:US20130320296A1

    公开(公告)日:2013-12-05

    申请号:US13488764

    申请日:2012-06-05

    IPC分类号: H01L33/04

    CPC分类号: H01L33/06 H01L33/32

    摘要: A light-emitting device comprises a semiconductor stacked structure, the semiconductor stacked structure comprising a p-type semiconductor layer, a n-type semiconductor layer and an multiple quantum well structure between the p-type semiconductor layer and the n-type semiconductor layer, wherein the multiple quantum well structure comprises a first multiple quantum well structure near the n-type semiconductor layer and a second multiple quantum well structure near the p-type semiconductor layer, wherein the first multiple quantum well structure has positive interface bound charge and the second multiple quantum well structure has zero interface bound charge.

    摘要翻译: 发光器件包括半导体堆叠结构,在p型半导体层和n型半导体层之间的半导体层叠结构包括p型半导体层,n型半导体层和多量子阱结构, 其中所述多量子阱结构包括靠近所述n型半导体层的第一多量子阱结构和在所述p型半导体层附近的第二多量子阱结构,其中所述第一多量子阱结构具有正界面结合的电荷, 多量子阱结构具有零界面界限电荷。