Method for fabricating a vertical NROM cell
    1.
    发明授权
    Method for fabricating a vertical NROM cell 有权
    制造垂直NROM电池的方法

    公开(公告)号:US07005701B2

    公开(公告)日:2006-02-28

    申请号:US10318551

    申请日:2002-12-13

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A method for fabricating a vertical nitride read-only memory (NROM) cell. A substrate having at least one trench is provided. A spacer is formed over the sidewall of the trench. Subsequently, ion implantation is performed on the substrate using the spacer as a mask to form doping areas as bit lines in the substrate near its surface and the bottom of the trench. Bit line oxides are formed over each of the doping areas. After the spacer is removed, a conformable insulating layer as gate dielectric is deposited on the sidewall of the trench and the surface of the bit line oxide. Finally, a conductive layer as a word line is deposited over the insulating layer and fills in the trench.

    摘要翻译: 一种用于制造垂直氮化物只读存储器(NROM)单元的方法。 提供具有至少一个沟槽的衬底。 间隔件形成在沟槽的侧壁上。 随后,使用间隔物作为掩模在衬底上进行离子注入,以在沟槽的表面和底部附近的衬底中形成作为位线的掺杂区域。 在每个掺杂区域上形成位线氧化物。 在移除间隔物之后,在沟槽的侧壁和位线氧化物的表面上沉积作为栅极电介质的适形绝缘层。 最后,作为字线的导电层沉积在绝缘层上并填充在沟槽中。

    Method for fabricating a vertical NROM cell
    2.
    发明授权
    Method for fabricating a vertical NROM cell 有权
    制造垂直NROM电池的方法

    公开(公告)号:US06916715B2

    公开(公告)日:2005-07-12

    申请号:US10694155

    申请日:2003-10-27

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A method for fabricating a vertical nitride read-only memory (NROM) cell. A substrate having at least one trench is provided. A spacer is formed over the sidewall of the trench. Subsequently, ion implantation is performed on the substrate using the spacer as a mask to form doping areas as bit lines in the substrate near its surface and the bottom of the trench. Bit line oxides are formed over each of the doping areas. After the spacer is removed, a conformable insulating layer as gate dielectric is deposited on the sidewall of the trench and the surface of the bit line oxide. Finally, a conductive layer as a word line is deposited over the insulating layer and fills in the trench.

    摘要翻译: 一种用于制造垂直氮化物只读存储器(NROM)单元的方法。 提供具有至少一个沟槽的衬底。 间隔件形成在沟槽的侧壁上。 随后,使用间隔物作为掩模在衬底上进行离子注入,以在沟槽的表面和底部附近的衬底中形成作为位线的掺杂区域。 在每个掺杂区域上形成位线氧化物。 在移除间隔物之后,在沟槽的侧壁和位线氧化物的表面上沉积作为栅极电介质的适形绝缘层。 最后,作为字线的导电层沉积在绝缘层上并填充在沟槽中。

    Stack gate with tip vertical memory and method for fabricating the same
    3.
    发明授权
    Stack gate with tip vertical memory and method for fabricating the same 有权
    具有尖端垂直存储器的堆叠门及其制造方法

    公开(公告)号:US07022573B2

    公开(公告)日:2006-04-04

    申请号:US10884701

    申请日:2004-07-02

    IPC分类号: H01L21/336

    摘要: A stacked gate vertical flash memory and a fabrication method thereof. The stacked gate vertical flash memory comprises a semiconductor substrate with a trench, a source conducting layer formed on the bottom of the trench, an insulating layer formed on the source conducting layer, a gate dielectric layer formed on a sidewall of the trench, a conducting spacer covering the gate dielectric layer as a floating gate, an inter-gate dielectric layer covering the conducting spacer, and a control gate conducting layer filled in the trench.

    摘要翻译: 堆叠式门垂直闪存及其制造方法。 层叠栅极垂直闪速存储器包括具有沟槽的半导体衬底,形成在沟槽底部的源极导电层,形成在源极导电层上的绝缘层,形成在沟槽侧壁上的栅极电介质层,导电层 覆盖作为浮动栅极的栅极介电层的隔板,覆盖导电间隔物的栅极间介电层和填充在沟槽中的控制栅极导电层。

    VERTICAL DRAM AND FABRICATION METHOD THEREOF
    4.
    发明申请
    VERTICAL DRAM AND FABRICATION METHOD THEREOF 有权
    垂直DRAM及其制造方法

    公开(公告)号:US20050127422A1

    公开(公告)日:2005-06-16

    申请号:US10707396

    申请日:2003-12-10

    IPC分类号: H01L21/8242 H01L27/108

    摘要: A vertical DRAM and fabrication method thereof. The vertical DRAM has a plurality of memory cells on a substrate, and each of the memory cells has a trench capacitor, a vertical transistor, and a source-isolation oxide layer in a deep trench. The main advantage of the present invention is to form an annular source diffusion and an annular drain diffusion of the vertical transistor around the sidewall of the deep trench. As a result, when a gate of the transistor is turned on, an annular gate channel is provided. The width of the gate channel of the present invention is therefore increased.

    摘要翻译: 垂直DRAM及其制造方法。 垂直DRAM在衬底上具有多个存储单元,并且每个存储单元在深沟槽中具有沟槽电容器,垂直晶体管和源极隔离氧化物层。 本发明的主要优点是在深沟槽的侧壁周围形成环形源极扩散和垂直晶体管的环形漏极扩散。 结果,当晶体管的栅极导通时,提供环形栅极沟道。 因此,本发明的栅极通道的宽度增加。

    Stack gate with tip vertical memory and method for fabricating the same
    5.
    发明授权
    Stack gate with tip vertical memory and method for fabricating the same 有权
    具有尖端垂直存储器的堆叠门及其制造方法

    公开(公告)号:US06870216B2

    公开(公告)日:2005-03-22

    申请号:US10606702

    申请日:2003-06-26

    摘要: A stacked gate vertical flash memory and a fabrication method thereof. The stacked gate vertical flash memory comprises a semiconductor substrate with a trench, a source conducting layer formed on the bottom of the trench, an insulating layer formed on the source conducting layer, a gate dielectric layer formed on a sidewall of the trench, a conducting spacer covering the gate dielectric layer as a floating gate, an inter-gate dielectric layer covering the conducting spacer, and a control gate conducting layer filled in the trench.

    摘要翻译: 堆叠式门垂直闪存及其制造方法。 层叠栅极垂直闪速存储器包括具有沟槽的半导体衬底,形成在沟槽底部的源极导电层,形成在源极导电层上的绝缘层,形成在沟槽侧壁上的栅极电介质层,导电层 覆盖作为浮动栅极的栅极介电层的隔板,覆盖导电间隔物的栅极间介电层和填充在沟槽中的控制栅极导电层。

    Multi-bit stacked-type non-volatile memory
    6.
    发明授权
    Multi-bit stacked-type non-volatile memory 有权
    多位堆叠型非易失性存储器

    公开(公告)号:US07476929B2

    公开(公告)日:2009-01-13

    申请号:US11269671

    申请日:2005-11-09

    IPC分类号: H01L27/115 H01L29/788

    摘要: The present invention discloses a multi-bit stacked-type non-volatile memory having a spacer-shaped floating gate and a manufacturing method thereof. The manufacturing method includes forming a patterned dielectric layer containing arsenic on a semiconductor substrate, wherein the patterned dielectric layer defines an opening as an active area. A dielectric spacer is formed on a side wall of the patterned dielectric layer and a gate dielectric layer is formed on the semiconductor substrate. A source/drain region is formed by thermal driving method making arsenic diffusion from the patterned dielectric layer into the semiconductor substrate. A spacer-shaped floating gate is formed on the side wall of the dielectric spacer and the gate dielectric layer. An interlayer dielectric layer is formed on the spacer-shaped floating gate. A control gate is formed on the interlayer dielectric layer and fills the opening of the active area.

    摘要翻译: 本发明公开了一种具有间隔型浮动栅极的多位堆叠型非易失性存储器及其制造方法。 制造方法包括在半导体衬底上形成含有砷的图案化电介质层,其中图案化电介质层限定开口作为有效区域。 在图案化电介质层的侧壁上形成介质间隔物,并在半导体衬底上形成栅极电介质层。 源极/漏极区域通过使从扩散图案化的介电层扩散到半导体衬底中的热驱动方法形成。 间隔物形状的浮栅形成在电介质隔离物的侧壁和栅介电层上。 在间隔物形浮栅上形成层间绝缘层。 在层间电介质层上形成控制栅极,填充有源区的开口。

    Multi-bit stacked-type non-volatile memory and manufacture method thereof
    7.
    发明申请
    Multi-bit stacked-type non-volatile memory and manufacture method thereof 有权
    多位堆叠型非易失性存储器及其制造方法

    公开(公告)号:US20060063339A1

    公开(公告)日:2006-03-23

    申请号:US11269671

    申请日:2005-11-09

    IPC分类号: H01L21/331 H01L21/8222

    摘要: The present invention discloses a multi-bit stacked-type non-volatile memory having a spacer-shaped floating gate and a manufacturing method thereof. The manufacturing method includes forming a patterned dielectric layer containing arsenic on a semiconductor substrate, wherein the patterned dielectric layer defines an opening as an active area. A dielectric spacer is formed on a side wall of the patterned dielectric layer and a gate dielectric layer is formed on the semiconductor substrate. A source/drain region is formed by thermal driving method making arsenic diffusion from the patterned dielectric layer into the semiconductor substrate. A spacer-shaped floating gate is formed on the side wall of the dielectric spacer and the gate dielectric layer. An interlayer dielectric layer is formed on the spacer-shaped floating gate. A control gate is formed on the interlayer dielectric layer and fills the opening of the active area.

    摘要翻译: 本发明公开了一种具有间隔型浮动栅极的多位堆叠型非易失性存储器及其制造方法。 制造方法包括在半导体衬底上形成含有砷的图案化电介质层,其中图案化电介质层限定开口作为有效区域。 在图案化电介质层的侧壁上形成介质间隔物,并在半导体衬底上形成栅极电介质层。 源极/漏极区域通过使从扩散图案化的介电层扩散到半导体衬底中的热驱动方法形成。 间隔物形状的浮栅形成在电介质隔离物的侧壁和栅介电层上。 在间隔物形浮栅上形成层间绝缘层。 在层间电介质层上形成控制栅极,填充有源区的开口。

    Vertical DRAM and fabrication method thereof
    8.
    发明授权
    Vertical DRAM and fabrication method thereof 有权
    垂直DRAM及其制造方法

    公开(公告)号:US07135731B2

    公开(公告)日:2006-11-14

    申请号:US10707396

    申请日:2003-12-10

    摘要: A vertical DRAM and fabrication method thereof. The vertical DRAM has a plurality of memory cells on a substrate, and each of the memory cells has a trench capacitor, a vertical transistor, and a source-isolation oxide layer in a deep trench. The main advantage of the present invention is to form an annular source diffusion and an annular drain diffusion of the vertical transistor around the sidewall of the deep trench. As a result, when a gate of the transistor is turned on, an annular gate channel is provided. The width of the gate channel of the present invention is therefore increased.

    摘要翻译: 垂直DRAM及其制造方法。 垂直DRAM在衬底上具有多个存储单元,并且每个存储单元在深沟槽中具有沟槽电容器,垂直晶体管和源极隔离氧化物层。 本发明的主要优点是在深沟槽的侧壁周围形成环形源极扩散和垂直晶体管的环形漏极扩散。 结果,当晶体管的栅极导通时,提供环形栅极沟道。 因此,本发明的栅极通道的宽度增加。

    Multi-bit stacked-type non-volatile memory and manufacture method thereof

    公开(公告)号:US06995061B2

    公开(公告)日:2006-02-07

    申请号:US10779607

    申请日:2004-02-18

    IPC分类号: H01L21/336

    摘要: The present invention discloses a multi-bit stacked-type non-volatile memory having a spacer-shaped floating gate and a manufacturing method thereof. The manufacturing method includes forming a patterned dielectric layer containing arsenic on a semiconductor substrate, wherein the patterned dielectric layer defines an opening as an active area. A dielectric spacer is formed on a side wall of the patterned dielectric layer and a gate dielectric layer is formed on the semiconductor substrate. A source/drain region is formed by thermal driving method making arsenic diffusion from the patterned dielectric layer into the semiconductor substrate. A spacer-shaped floating gate is formed on the side wall of the dielectric spacer and the gate dielectric layer. An interlayer dielectric layer is formed on the spacer-shaped floating gate. A control gate is formed on the interlayer dielectric layer and fills the opening of the active area.

    Two bit memory structure and method of making the same
    10.
    发明授权
    Two bit memory structure and method of making the same 有权
    两位存储器结构和制作方法相同

    公开(公告)号:US07700991B2

    公开(公告)日:2010-04-20

    申请号:US11946868

    申请日:2007-11-29

    IPC分类号: H01L29/76

    CPC分类号: H01L29/7881 H01L29/66825

    摘要: A method for fabricating the memory structure includes: providing a substrate having a pad, forming an opening in the pad, forming a first spacer on a sidewall of the opening, filling the opening with a sacrificial layer, removing the first spacer and exposing a portion of the substrate, removing the exposed substrate to define a first trench and a second trench, removing the sacrificial layer to expose a surface of the substrate to function as a channel region, forming a first dielectric layer on a surface of the first trench, a surface of the second trench and a surface of the channel region, filling the first trench and the second trench with a first conductive layer, forming a second dielectric layer on a surface of the first conductive layer and the surface of the channel region, filling the opening with a second conductive layer, and removing the pad.

    摘要翻译: 一种用于制造存储器结构的方法包括:提供具有焊盘的衬底,在焊盘中形成开口,在开口的侧壁上形成第一间隔物,用牺牲层填充开口,移除第一间隔物并露出一部分 去除所述暴露的衬底以限定第一沟槽和第二沟槽,去除所述牺牲层以暴露所述衬底的表面以用作沟道区域,在所述第一沟槽的表面上形成第一介电层, 第二沟槽的表面和沟道区的表面,用第一导电层填充第一沟槽和第二沟槽,在第一导电层的表面和沟道区的表面上形成第二介电层,填充第二沟槽 用第二导电层打开,并移除垫。