EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME
    7.
    发明申请
    EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME 审中-公开
    用于封装半导体器件的环氧树脂组合物和与其相容的半导体器件

    公开(公告)号:US20130158165A1

    公开(公告)日:2013-06-20

    申请号:US13719875

    申请日:2012-12-19

    IPC分类号: C09D163/00

    摘要: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: wherein n is about 1 to about 10.

    摘要翻译: 一种用于封装半导体器件的环氧树脂组合物和用该组合物包封的半导体器件,该组合物包括环氧树脂; 无机填料; 固化促进剂; 和固化剂,所述固化剂包括具有包含至少一个联苯部分的多官能酚醛清漆结构的化合物,所述化合物由式1表示:其中n为约1至约10。