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公开(公告)号：US07554190B2
公开(公告)日：2009-06-30
申请号：US11248720
申请日：2005-10-11
CPC分类号： H01L23/26 , H01L23/055 , H01L23/10 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L2224/16225 , H01L2224/27013 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01064 , H01L2924/01065 , H01L2924/01066 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01105 , H01L2924/01327 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2224/0401
摘要： A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
摘要翻译： 用于从电子部件散热的金属热接口结构包括散热器盖，在电子部件的工作温度范围内为液体的金属合金，以及用于促进长期可靠性和高热性能的设计特征。
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公开(公告)号：US20080137300A1
公开(公告)日：2008-06-12
申请号：US12028235
申请日：2008-02-08
CPC分类号： H01L23/42 , H01L23/10 , H01L23/433 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01064 , H01L2924/01065 , H01L2924/01066 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01082 , H01L2924/01105 , H01L2924/01327 , H01L2924/10158 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , Y10T29/49002 , Y10T29/4935 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
摘要翻译： 用于从电子部件散热的金属热接口结构包括散热器盖，在电子部件的工作温度范围内为液体的金属合金，以及用于促进长期可靠性和高热性能的设计特征。
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公开(公告)号：US07663227B2
公开(公告)日：2010-02-16
申请号：US12028235
申请日：2008-02-08
CPC分类号： H01L23/42 , H01L23/10 , H01L23/433 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32057 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01064 , H01L2924/01065 , H01L2924/01066 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01082 , H01L2924/01105 , H01L2924/01327 , H01L2924/10158 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , Y10T29/49002 , Y10T29/4935 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
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