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    Switching circuitry for reconfigurable arrays of sensor elements
    2.
    发明授权
    Switching circuitry for reconfigurable arrays of sensor elements 有权
    用于可重构阵列的传感器元件的开关电路

    公开(公告)号：US07280435B2

    公开(公告)日：2007-10-09

    申请号：US10978196

    申请日：2004-10-29

    申请人： Kai Erik Thomenius ,  Rayette Ann Fisher ,  Robert Gideon Wodnicki ,  Christopher Robert Hazard ,  Lowell Scott Smith ,  David Martin Mills

    发明人： Kai Erik Thomenius ,  Rayette Ann Fisher ,  Robert Gideon Wodnicki ,  Christopher Robert Hazard ,  Lowell Scott Smith ,  David Martin Mills

    IPC分类号： H04R17/00 ,  A61B8/00

    CPC分类号： H03M11/00 ,  B06B1/0207 ,  B06B1/0292 ,  G01N29/262 ,  G01N2291/044 ,  G01N2291/106

    摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.

    摘要翻译： 一种包括可通过交换网络重新配置的传感器阵列的设备。 传感器可以是光学，热或压力传感器或超声换能器。 更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且 第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述 一个接入开关经由所述一个矩阵开关。

    Tileable sensor array
    4.
    发明授权
    Tileable sensor array 有权
    可分层传感器阵列

    公开(公告)号：US08659148B2

    公开(公告)日：2014-02-25

    申请号：US12956194

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    IPC分类号： H01L23/34

    CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

    摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

    TILEABLE SENSOR ARRAY
    6.
    发明申请
    TILEABLE SENSOR ARRAY 有权
    可传感器阵列

    公开(公告)号：US20120133001A1

    公开(公告)日：2012-05-31

    申请号：US12956194

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    IPC分类号： H01L27/00 ,  H01L31/18 ,  H01L21/60

    CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

    摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

    Methods of making and using integrated and testable sensor array
    7.
    发明授权
    Methods of making and using integrated and testable sensor array 有权
    制作和使用集成和可测量传感器阵列的方法

    公开(公告)号：US07781238B2

    公开(公告)日：2010-08-24

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
    8.
    发明申请
    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
    制造和使用集成和可测传感器阵列的方法

    公开(公告)号：US20090148967A1

    公开(公告)日：2009-06-11

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    Isolation of short-circuited sensor cells for high-reliability operation of sensor array
    10.
    发明授权
    Isolation of short-circuited sensor cells for high-reliability operation of sensor array 有权
    隔离传感器阵列的高可靠性操作的短路传感器单元

    公开(公告)号：US07293462B2

    公开(公告)日：2007-11-13

    申请号：US11028789

    申请日：2005-01-04

    申请人： Warren Lee ,  David Martin Mills ,  Glenn Scott Claydon ,  Kenneth Wayne Rigby ,  Wei-Cheng Tian ,  Ye-Ming Li ,  Jie Sun ,  Lowell Scott Smith ,  Stanley Chienwu Chu ,  Sam Yie-Sum Wong ,  Hyon-Jin Kwon

    发明人： Warren Lee ,  David Martin Mills ,  Glenn Scott Claydon ,  Kenneth Wayne Rigby ,  Wei-Cheng Tian ,  Ye-Ming Li ,  Jie Sun ,  Lowell Scott Smith ,  Stanley Chienwu Chu ,  Sam Yie-Sum Wong ,  Hyon-Jin Kwon

    IPC分类号： G01H11/00

    CPC分类号： H04R23/00 ,  B06B1/0292

    摘要： A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses. In another implementation, the isolating means comprise a multiplicity of short circuit protection modules, each module comprising a current sensor circuit and an electrical isolation switch.

    摘要翻译： 一种包括传感器阵列和多条总线线路的设备，每个传感器电连接到相应的总线，并且包括相应多个微机械传感器单元组，特定传感器的传感器单元组彼此电耦合 通过连接该传感器的总线，每个传感器单元组包括彼此电互连并且不可切换地彼此分离的相应多个微机械传感器单元，该装置还包括用于隔离传感器 来自其相关联的总线线路的单元组以及响应于该传感器单元组的微机械传感器单元中的任一个被短路到地。 在一个实施方案中，隔离装置包括多个保险丝。 在另一实施方案中，隔离装置包括多个短路保护模块，每个模块包括电流传感器电路和电隔离开关。