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    Chip package
    3.
    发明授权
    Chip package 有权
    芯片封装

    公开(公告)号：US07932531B2

    公开(公告)日：2011-04-26

    申请号：US12506255

    申请日：2009-07-21

    申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    IPC分类号： H01L33/00

    CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

    摘要翻译： 芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

    CHIP PACKAGE
    4.
    发明申请
    CHIP PACKAGE 有权
    芯片包装

    公开(公告)号：US20090321918A1

    公开(公告)日：2009-12-31

    申请号：US12506255

    申请日：2009-07-21

    申请人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    发明人： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    IPC分类号： H01L23/498

    CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

    摘要翻译： 芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

    Column-type combination climbing exercise machine
    8.
    发明授权
    Column-type combination climbing exercise machine 有权

    公开(公告)号：US10758776B2

    公开(公告)日：2020-09-01

    申请号：US16204576

    申请日：2018-11-29

    申请人： Ya-Chi Chen

    发明人： Ya-Chi Chen

    IPC分类号： A63B22/04 ,  A63B21/00 ,  A63B71/00 ,  A63B21/015 ,  A63B22/00 ,  F16D49/10 ,  F16D65/14

    摘要： A column-type combination climbing exercise machine mainly includes: the bottom end of a stand frame provided with a ground seat; a column is locked with the stand frame through a locking component; two sliding chutes are respectively disposed at the opposite left and right sides of the column; two sliding seats are correspondingly disposed in the two sliding chute, each sliding seat is adjacent to the top thereof, and a handle and a pedal are respectively disposed at the two ends of the bottom; a first linkage mechanism is connected with the two sliding seats to form a mutually opposite lift-fall and linkage action; a damper is assembled in the ground seat; two connectors are respectively disposed in the two sliding a seat; and a second linkage mechanism makes the damper and the two sliding seats in a linkage relationship.

    SYSTEM FOR HEATING A VAPOR CELL
    9.
    发明申请
    SYSTEM FOR HEATING A VAPOR CELL 有权
    加热蒸气细胞系统

    公开(公告)号：US20110147367A1

    公开(公告)日：2011-06-23

    申请号：US12645427

    申请日：2009-12-22

    申请人： Robert L. Borwick, III ,  Jeffrey F. DeNatale ,  Chialun Tsai ,  Philip A. Stupar ,  Ya-Chi Chen

    发明人： Robert L. Borwick, III ,  Jeffrey F. DeNatale ,  Chialun Tsai ,  Philip A. Stupar ,  Ya-Chi Chen

    IPC分类号： H05B3/06 ,  H05B3/02

    CPC分类号： H05B3/00 ,  G04F5/14 ,  H05B2214/04

    摘要： A vapor cell includes an interrogation cell in a substrate, the interrogation cell having an entrance window and an exit window, and a first transparent thin-film heater in thermal communication with the entrance window. The transparent thin-film heater has a first layer in communication with a first pole contact at a proximal end of the heater and a layer coupler contact at a distal end, a second layer in communication with a second pole contact at the proximal end, and the second layer electrically coupled to the layer coupler contact at the distal end. An insulating layer is sandwiched between the first and second layers. The insulating layer has an opening at the distal end to admit the layer coupler contact and to insulate the remainder of the second layer from the first layer. The first and second pole contacts are available to complete an electric circuit at the proximal end, with magnetic fields for each of the first and second layers oriented in opposing directions when a current is applied through the circuit.

    摘要翻译： 蒸汽池包括在基板中的询问单元，询问单元具有入口窗口和出口窗口，以及与入口窗口热连通的第一透明薄膜加热器。 透明薄膜加热器具有与加热器的近端处的第一极触点连通的第一层和在远端处的层耦合器触点，在近端与第二极触点连通的第二层，以及 第二层在远端电耦合到层耦合器接触。 绝缘层夹在第一层和第二层之间。 绝缘层在远端具有开口，以允许层耦合器接触并使第二层的其余部分与第一层绝缘。 第一和第二极触点可用于在近端完成电路，当通过电路施加电流时，磁场中的第一和第二层中的每一个以相反的方向取向。

    Adjustable weight training chair
    10.
    外观设计
    Adjustable weight training chair 有权

    公开(公告)号：USD1029970S1

    公开(公告)日：2024-06-04

    申请号：US29775408

    申请日：2021-03-23

    申请人： Ya-Chi Chen

    设计人： Ya-Chi Chen

    摘要： FIG. 1 is an upper perspective view of an adjustable weight training chair showing my new design;
    FIG. 2 is a side view thereof;
    FIG. 3 is an opposite side view thereof;
    FIG. 4 is a front view thereof;
    FIG. 5 is a rear view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is first perspective view of the adjustable weight training chair having seating pads and racks for dumbbells thereon; and,
    FIG. 9 is second perspective view of the adjustable weight training chair having seating pads and racks for dumbbells thereon.
    The broken lines in FIGS. 8 and 9 illustrate portions of the adjustable weight training chair that form no part of the claimed design.