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公开(公告)号：US07799603B2
公开(公告)日：2010-09-21
申请号：US12466361
申请日：2009-05-14
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译： 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。
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公开(公告)号：US08067696B2
公开(公告)日：2011-11-29
申请号：US12389521
申请日：2009-02-20
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译： 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。
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3.发明授权Circuit substrate for mounting electronic component and circuit substrate assembly having same 有权用于安装电子部件的电路基板和具有该电路的电路基板组件公开(公告)号：US08300420B2
公开(公告)日：2012-10-30
申请号：US12471396
申请日：2009-05-24
CPC分类号： H05K1/186 , B82Y10/00 , H01L23/373 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/9222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/18162 , H01L2924/19042 , H05K3/4038 , H05K2201/026
摘要： A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
摘要翻译： 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。
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公开(公告)号：US20100035187A1
公开(公告)日：2010-02-11
申请号：US12467291
申请日：2009-05-17
申请人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
IPC分类号： G03F7/20
CPC分类号： H05K3/4644 , H05K3/0094 , H05K3/421 , H05K2201/09563 , H05K2201/09745 , H05K2203/025 , Y10T29/49117 , Y10T29/49124
摘要： A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.
摘要翻译： 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。
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公开(公告)号：US08227175B2
公开(公告)日：2012-07-24
申请号：US12467291
申请日：2009-05-17
申请人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
IPC分类号： H05K3/00
CPC分类号： H05K3/4644 , H05K3/0094 , H05K3/421 , H05K2201/09563 , H05K2201/09745 , H05K2203/025 , Y10T29/49117 , Y10T29/49124
摘要： A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.
摘要翻译： 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。
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