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公开(公告)号：US07799603B2
公开(公告)日：2010-09-21
申请号：US12466361
申请日：2009-05-14
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译： 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。
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公开(公告)号：US08067696B2
公开(公告)日：2011-11-29
申请号：US12389521
申请日：2009-02-20
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译： 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。
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3.发明授权Circuit substrate for mounting electronic component and circuit substrate assembly having same 有权用于安装电子部件的电路基板和具有该电路的电路基板组件公开(公告)号：US08300420B2
公开(公告)日：2012-10-30
申请号：US12471396
申请日：2009-05-24
CPC分类号： H05K1/186 , B82Y10/00 , H01L23/373 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/9222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/18162 , H01L2924/19042 , H05K3/4038 , H05K2201/026
摘要： A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
摘要翻译： 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。
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公开(公告)号：US20100035187A1
公开(公告)日：2010-02-11
申请号：US12467291
申请日：2009-05-17
申请人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
IPC分类号： G03F7/20
CPC分类号： H05K3/4644 , H05K3/0094 , H05K3/421 , H05K2201/09563 , H05K2201/09745 , H05K2203/025 , Y10T29/49117 , Y10T29/49124
摘要： A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.
摘要翻译： 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。
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公开(公告)号：US08227175B2
公开(公告)日：2012-07-24
申请号：US12467291
申请日：2009-05-17
申请人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
发明人： Chung-Jen Tsai , Yu-Cheng Huang , Hung-Yi Chang , Cheng-Hsien Lin
IPC分类号： H05K3/00
CPC分类号： H05K3/4644 , H05K3/0094 , H05K3/421 , H05K2201/09563 , H05K2201/09745 , H05K2203/025 , Y10T29/49117 , Y10T29/49124
摘要： A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.
摘要翻译： 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。
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公开(公告)号：US08332984B2
公开(公告)日：2012-12-18
申请号：US11967006
申请日：2007-12-29
申请人： Tso-Hung Yeh , Hung-Yi Chang , Chih-Lung Hsiao , Cheng-Hsien Lin
发明人： Tso-Hung Yeh , Hung-Yi Chang , Chih-Lung Hsiao , Cheng-Hsien Lin
IPC分类号： B08B1/02
CPC分类号： H05K3/26 , H05K2203/0143 , H05K2203/0191 , H05K2203/1545
摘要： The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.
摘要翻译： 本发明涉及一种用于印刷电路板的清洁装置。 清洁装置包括基座，固定到基座的夹板，至少一个保持构件，至少一个清洁辊和驱动机构。 保持构件弹性地支撑在基座上。 所述至少一个清洁辊分别枢转地设置在所述至少一个保持构件上。 清洁辊包括附接到清洁辊的表面的清洁层。 夹紧板与清洁辊相对并离开一段距离。 所述驱动机构与所述清洁辊连接并构造成驱动所述清洁辊旋转。 清洁装置可以高效地清洁印刷电路板。
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公开(公告)号：US08001684B2
公开(公告)日：2011-08-23
申请号：US11959194
申请日：2007-12-18
IPC分类号： H05K3/02
CPC分类号： H05K3/281 , H05K1/0269 , H05K1/0393 , H05K3/027 , H05K2201/0355 , H05K2201/09063 , H05K2201/09918 , H05K2203/063 , H05K2203/1545 , H05K2203/166 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.
摘要翻译： 提供了制造柔性印刷电路板的示例性方法。 从第一供给辊供给金属箔。 金属箔在金属箔的两个相对侧上具有第一表面和第二表面。 具有限定在其中的多个第一开口的第一覆盖层从第二馈送辊供应并层压在金属箔的第一表面上。 用金属箔形成电迹线。 具有限定在其中的多个第二开口的第二覆盖物从第三进料辊供应并层压在金属箔的第二表面上。 每个第二开口与相应的第一开口对准，使得电迹线从相应的第一和第二开口露出。 该方法可以提高以空心形式制造柔性印刷电路板的质量和效率。
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公开(公告)号：US09247650B2
公开(公告)日：2016-01-26
申请号：US12589459
申请日：2009-10-22
申请人： Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
发明人： Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
CPC分类号： H05K3/246 , B82Y10/00 , C23C18/18 , H05K3/125 , H05K2201/026 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , H05K2203/072
摘要： A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated.
摘要翻译： 提供制造导线的方法。 首先，提供具有碳纳米管的油墨。 其次，使用基板上的墨形成基线。 第三，基线是无电镀。
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公开(公告)号：US08071887B2
公开(公告)日：2011-12-06
申请号：US12253869
申请日：2008-10-17
申请人： Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
发明人： Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
IPC分类号： H05K1/03
CPC分类号： H05K1/097 , B82Y10/00 , H05K3/125 , H05K3/246 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , Y10T29/49155 , Y10T428/2462 , Y10T428/30 , Y10T428/32
摘要： A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
摘要翻译： 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。
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公开(公告)号：US08049113B2
公开(公告)日：2011-11-01
申请号：US12047152
申请日：2008-03-12
申请人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
发明人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
摘要： The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。 导电层包括第一导电部分，连接部分和第二导电部分。 连接部分包括第一端和第二端。 第一端连接到第一导电部分; 第二端连接到第二导电部分。 连接部的宽度从第一端到第二端逐渐减小。 可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。
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