Tester for pressure sensors
    1.
    发明授权
    Tester for pressure sensors 失效
    压力传感器测试仪

    公开(公告)号:US06688156B2

    公开(公告)日:2004-02-10

    申请号:US09754711

    申请日:2001-01-04

    IPC分类号: G01L2700

    CPC分类号: G01L27/007

    摘要: The invention relates to a tester for pressure sensors in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head is provided which has an interior space open on one side, the open face of which is capable of being mounted on the pressure sensor in such a way that the interior space is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element at least so that the sensor element is moved out of its resting position. At the same time, the electrical connections of the selected pressure sensor are connected with an electrical evaluation unit.

    摘要翻译: 本发明涉及一种用于晶片化合物中的压力传感器的测试器或具有用于压力传感器的凹部的隔离压力传感器,以及用于电连接至少一个压力传感器的电连接的装置。 本发明旨在使其能够测试晶片化合物中的压力传感器的功能。 根据本发明,提供一种压力头,其具有在一侧开口的内部空间,其敞开面能够以这样的方式安装在压力传感器上,使得内部空间被密封。 以这种方式,可以至少使传感器元件移动到其静止位置之外,在传感器元件上施加规定量和持续时间的静态或动态压力。 同时,所选择的压力传感器的电气连接与电气评估单元连接。

    Test apparatus with loading device
    2.
    发明授权
    Test apparatus with loading device 有权
    带装载装置的试验装置

    公开(公告)号:US07038441B2

    公开(公告)日:2006-05-02

    申请号:US10677524

    申请日:2003-10-02

    IPC分类号: G01R31/02

    摘要: The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.

    摘要翻译: 本发明涉及具有卡盘的装载装置的测试装置,其具有用于测试基板的轴承表面和卡盘驱动装置,通过该卡盘驱动器卡盘可以移动工作区域,并且其中 具有用于接收可以从卡盘的工作区域移动到工作区域外部的接收位置的测试基板的接收装置,其基础是提高卡盘的运动精度的目的。 此外,在具有受控气氛的测试装置的情况下,另一个目的是防止卡盘暴露于露天气氛。 这是通过以下事实来实现的:提供了可以在卡盘位于工作区域内的位置的接近卡盘的位置之间移动的托架和接收位置,该托架被设置 具有保持器,其中测试基板可以至少间接地插入,使得当托架处于靠近卡盘的位置时,测试基板位于卡盘上方。 当托架位于靠近卡盘的位置时,托架和夹头可以相对于彼此垂直移动。

    Device for testing thin elements
    3.
    发明申请
    Device for testing thin elements 有权
    用于测试薄元素的设备

    公开(公告)号:US20070139067A1

    公开(公告)日:2007-06-21

    申请号:US11314624

    申请日:2005-12-21

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2831

    摘要: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.)

    摘要翻译: 提供了用于测试诸如晶片或单独基板的薄元件的装置,同时提供用于检查薄元件的反面的设备,其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片,也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板,可在x / y方向上移动和/或转动板的框架,并且如果需要,在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板,其中通过真空使用机械元件(夹紧环,夹紧箔或其它合适的夹紧元件),凝胶封装垫或 粘合剂等)

    Device for testing thin elements
    4.
    发明授权
    Device for testing thin elements 有权
    用于测试薄元素的设备

    公开(公告)号:US07282930B2

    公开(公告)日:2007-10-16

    申请号:US11314624

    申请日:2005-12-21

    IPC分类号: G01R31/302

    CPC分类号: G01R31/2831

    摘要: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

    摘要翻译: 提供了用于测试诸如晶片或单独基板的薄元件的装置,同时提供用于检查薄元件的反面的设备,其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片,也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板,可在x / y方向上移动和/或转动板的框架,并且如果需要,在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板,其中通过真空使用机械元件(夹紧环,夹紧箔或其它合适的夹紧元件),凝胶封装垫或 粘合剂等

    Probe holder for a probe for testing semiconductor components
    5.
    发明授权
    Probe holder for a probe for testing semiconductor components 有权
    用于测试半导体元件的探头的探头支架

    公开(公告)号:US07859278B2

    公开(公告)日:2010-12-28

    申请号:US11674205

    申请日:2007-02-13

    IPC分类号: G01R1/04

    CPC分类号: G01R1/07342

    摘要: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the holder arm to the carrier device. The holder arm and fastening arm are connected to one another by a parallel guide whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented making it easier for the probe needle to carry out a vertical yielding movement, with almost no rotation of the probe needle about a horizontal axis.

    摘要翻译: 其中探针在垂直力作用下具有轻微水平偏移的探针支架包括用于探针的探针支架,其中该支架用于紧固和电接触连接在测试的载体装置上 装置,并且具有在其自由端具有针保持器的保持臂,用于固定探针,以及用于将保持臂连接到承载装置的紧固臂。 保持臂和紧固臂通过平行的引导件彼此连接,由此可以减少或甚至防止针尖由于外力引起的水平偏移,从而使探针更容易进行垂直屈服运动,几乎可以 探头针绕水平轴不旋转。

    Arrangement for the testing of semiconductor structures
    6.
    发明授权
    Arrangement for the testing of semiconductor structures 失效
    半导体结构测试的安排

    公开(公告)号:US06373272B1

    公开(公告)日:2002-04-16

    申请号:US09142391

    申请日:1998-09-16

    IPC分类号: G01R3126

    CPC分类号: G01R31/2887

    摘要: The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.

    摘要翻译: 本发明提供一种用于半导体结构测试的装置。 该设备设置有用于保持半导体晶片和用于接触针的针保持器的卡盘,该卡盘设置有用于半导体晶片的紧固装置,并且可移动以使用定位装置相对于接触针定位 。 本发明的目的是在分离之前及时且可靠地检测不可维修或不可完全维修的芯片的故障,以避免用于分离和组装有缺陷的芯片的不必要的工作。 实现目的在于卡盘具有向上暴露半导体晶片的下表面的接收区域和用于其的接收平面。 接收平面布置在针架上方,并且接触针以这样的方式指向上方,使得它们接触半导体晶片的向下指向的上表面上的半导体芯片的接触岛。

    Adapter for positioning of contact tips
    7.
    发明授权
    Adapter for positioning of contact tips 有权
    适配器用于定位接触尖端

    公开(公告)号:US07463044B2

    公开(公告)日:2008-12-09

    申请号:US11531092

    申请日:2006-09-12

    IPC分类号: G01R31/02

    摘要: An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is in mechanical contact with and mobile relative to the base element. The location surface can be positioned relative to the base, in at least one positioning direction, by the positioning element which includes a gearing for converting rotary movement to translational movement in the positioning direction.

    摘要翻译: 用于定位接触尖端的适配器具有用于定位接触尖端的位置表面和具有用于将适配器设置在安装表面上的基座的基座元件。 定位元件相对于基座元件机械地接触和移动。 位置表面可以通过定位元件在至少一个定位方向上相对于基座定位,该定位元件包括用于将旋转运动转换成在定位方向上的平移运动的传动装置。

    ADAPTER FOR POSITIONING OF CONTACT TIPS
    8.
    发明申请
    ADAPTER FOR POSITIONING OF CONTACT TIPS 有权
    适配器定位接触提示

    公开(公告)号:US20070296402A1

    公开(公告)日:2007-12-27

    申请号:US11531092

    申请日:2006-09-12

    IPC分类号: G01R31/28

    摘要: An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is in mechanical contact with and mobile relative to the base element. The location surface can be positioned relative to the base, in at least one positioning direction, by the positioning element which includes a gearing for converting rotary movement to translational movement in the positioning direction.

    摘要翻译: 用于定位接触尖端的适配器具有用于定位接触尖端的位置表面和具有用于将适配器设置在安装表面上的基座的基座元件。 定位元件相对于基座元件机械地接触和移动。 位置表面可以通过定位元件在至少一个定位方向上相对于基座定位,该定位元件包括用于将旋转运动转换成在定位方向上的平移运动的传动装置。