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公开(公告)号：US06688156B2
公开(公告)日：2004-02-10
申请号：US09754711
申请日：2001-01-04
IPC分类号： G01L2700
CPC分类号： G01L27/007
摘要： The invention relates to a tester for pressure sensors in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head is provided which has an interior space open on one side, the open face of which is capable of being mounted on the pressure sensor in such a way that the interior space is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element at least so that the sensor element is moved out of its resting position. At the same time, the electrical connections of the selected pressure sensor are connected with an electrical evaluation unit.
摘要翻译： 本发明涉及一种用于晶片化合物中的压力传感器的测试器或具有用于压力传感器的凹部的隔离压力传感器，以及用于电连接至少一个压力传感器的电连接的装置。 本发明旨在使其能够测试晶片化合物中的压力传感器的功能。 根据本发明，提供一种压力头，其具有在一侧开口的内部空间，其敞开面能够以这样的方式安装在压力传感器上，使得内部空间被密封。 以这种方式，可以至少使传感器元件移动到其静止位置之外，在传感器元件上施加规定量和持续时间的静态或动态压力。 同时，所选择的压力传感器的电气连接与电气评估单元连接。
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公开(公告)号：US07038441B2
公开(公告)日：2006-05-02
申请号：US10677524
申请日：2003-10-02
申请人： Karsten Stoll , Stefan Kreissig , Alf Wachtveitl , Michael Teich , Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Dietmar Runge
发明人： Karsten Stoll , Stefan Kreissig , Alf Wachtveitl , Michael Teich , Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Dietmar Runge
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R31/2806 , G01R31/2831 , G01R31/2887
摘要： The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.
摘要翻译： 本发明涉及具有卡盘的装载装置的测试装置，其具有用于测试基板的轴承表面和卡盘驱动装置，通过该卡盘驱动器卡盘可以移动工作区域，并且其中 具有用于接收可以从卡盘的工作区域移动到工作区域外部的接收位置的测试基板的接收装置，其基础是提高卡盘的运动精度的目的。 此外，在具有受控气氛的测试装置的情况下，另一个目的是防止卡盘暴露于露天气氛。 这是通过以下事实来实现的：提供了可以在卡盘位于工作区域内的位置的接近卡盘的位置之间移动的托架和接收位置，该托架被设置 具有保持器，其中测试基板可以至少间接地插入，使得当托架处于靠近卡盘的位置时，测试基板位于卡盘上方。 当托架位于靠近卡盘的位置时，托架和夹头可以相对于彼此垂直移动。
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3.发明授权Method for increasing the accuracy of the positioning of a first object relative to a second object 有权提高第一物体相对于第二物体的定位精度的方法公开(公告)号：US08094925B2
公开(公告)日：2012-01-10
申请号：US12619327
申请日：2009-11-16
CPC分类号： G06T7/74 , G06T2207/30148
摘要： A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.
摘要翻译： 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻，使用一个识别过程，第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位，以保持两个物体的期望位置。
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4.发明授权公开(公告)号：US06864676B2
公开(公告)日：2005-03-08
申请号：US10139735
申请日：2002-05-06
CPC分类号： G01R1/0408
摘要： A substrate-holding device is designed as a one-piece ceramic element having a number of variably heavily doped layer regions. At least one layer region is a conductive region and at least one layer region is an insulative region. A multilayer chuck structure is thereby formed which does not exhibit mechanical surface interfaces between the layers.
摘要翻译： 衬底保持装置被设计为具有多个可变重掺杂层区域的一体式陶瓷元件。 至少一个层区域是导电区域，并且至少一个层区域是绝缘区域。 由此形成多层卡盘结构，其不会在层之间表现出机械表面界面。
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5.发明申请Method For Increasing The Accuracy Of The Positioning Of A First Object Relative To A Second Object 审中-公开提高第一个对象相对于第二个对象的定位精度的方法公开(公告)号：US20080298671A1
公开(公告)日：2008-12-04
申请号：US12170848
申请日：2008-07-10
IPC分类号： G06K9/00
CPC分类号： G06T7/74 , G06T2207/30148
摘要： A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.
摘要翻译： 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻，使用一个识别过程，第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位，以保持两个物体的期望位置。
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6.发明授权公开(公告)号：US09110131B2
公开(公告)日：2015-08-18
申请号：US13640432
申请日：2010-04-13
申请人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
发明人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
CPC分类号： G01R31/2891
摘要： The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.
摘要翻译： 本发明总体上涉及用于使接触区域（22）与测试仪中的探针尖端（18）接触的方法和装置。 布置在基板（6）上的接触区域（22）和探针尖端（18）相对于彼此定位，然后通过前进运动彼此接触。 为了检测每个探针尖端（18）的牢固接触，从至少两个观察方向（34）观察探针尖端（18）和接触区域（22）之间的接触，其中包括观察角 α在0〜180度的范围内。
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7.发明申请公开(公告)号：US20130027070A1
公开(公告)日：2013-01-31
申请号：US13640432
申请日：2010-04-13
申请人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
发明人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
IPC分类号： G01R1/067
CPC分类号： G01R31/2891
摘要： The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.
摘要翻译： 本发明总体上涉及用于使接触区域（22）与测试仪中的探针尖端（18）接触的方法和装置。 布置在基板（6）上的接触区域（22）和探针尖端（18）相对于彼此定位，然后通过前进运动彼此接触。 为了检测每个探针尖端（18）的牢固接触，从至少两个观察方向（34）观察探针尖端（18）和接触区域（22）之间的接触，其中包括观察角 α在0〜180度的范围内。
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公开(公告)号：US07046025B2
公开(公告)日：2006-05-16
申请号：US10677178
申请日：2003-10-02
申请人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Frank-Michael Werner , Axel Schmidt , Matthias Zieger
发明人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Frank-Michael Werner , Axel Schmidt , Matthias Zieger
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R31/2806 , G01R31/2831 , G01R31/2887
摘要： A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.
摘要翻译： 用于在低温下测试基板的测试装置具有卡盘，该卡盘可以通过卡盘驱动器在工作区域中移动，卡盘驱动器的温度可以使用加热和冷却装置来控制。 卡盘具有用于接收测试基板的接收表面和用于固定接收测试基板的基板载体的保持装置。 空间和热定义的测试条件在室温和低温下以最小的能量和劳动成本维持。 这通过提供围绕卡盘的工作区域的真空室来实现。 卡盘在一侧与非冷却的卡盘驱动器热分离，另一侧以可释放的方式热连接到测试基板。 通过直接冷却的热辐射屏蔽将冷却的卡盘和冷却的测试基板与周围的未冷却组件的热辐射隔离。
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公开(公告)号：US20050083037A1
公开(公告)日：2005-04-21
申请号：US10928985
申请日：2004-08-27
申请人： Stefan Schneidewind , Claus Dietrich , Frank-Michael Werner , Don Feuerstein , Mike Lancaster , Denis Place
发明人： Stefan Schneidewind , Claus Dietrich , Frank-Michael Werner , Don Feuerstein , Mike Lancaster , Denis Place
CPC分类号： H01L21/67207 , H01L21/67253
摘要： Arrangement and method for testing a substrate under load with a prober are provided, by which the full productivity of the prober can be exploited. The arrangement includes a chuck, a chuck driver, control electronics, probe or probe card holding means, and has a loading means for applying a thermal, mechanical, electrical or other physical or chemical loading to the substrate. The substrate is subjected to a loading and then its properties are measured by means of the prober. The loading means is arranged as a separate subassembly separated from the prober and therein is connected to the latter via a handling system. The method provides for the substrate to be brought into operative connection with a loading means, subjected to the loading in this loading means, then removed from the loading means and tested in terms of its functions.
摘要翻译： 该装置具有仅在测试期间通过处理系统（3）连接到探测器（1）的温度控制站（2）。 温度控制站向半导体晶片施加热，机械，电气，物理或其他化学载荷，然后通过处理系统将晶片转移到探测器进行进一步测试。 在负载下测试半导体晶片的方法也包括独立权利要求。
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公开(公告)号：US07196507B2
公开(公告)日：2007-03-27
申请号：US10928975
申请日：2004-08-27
申请人： Stefan Schneidewind , Claus Dietrich , Frank-Michael Werner , Don Feuerstein , Mike Lancaster , Denis Place
发明人： Stefan Schneidewind , Claus Dietrich , Frank-Michael Werner , Don Feuerstein , Mike Lancaster , Denis Place
IPC分类号： G01R31/28
CPC分类号： H01L21/6719 , H01L21/67173
摘要： An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.
摘要翻译： 用于测试衬底的装置减少了在制造过程中通过测试衬底，特别是半导体晶片所需的面积和成本。 该装置包括测试装置，其包括卡盘，卡盘驱动器，控制电子装置，具有处理系统的探针板或探针板保持装置，基板杂志站和对准站。 测试装置包括至少两个测试装置，这两个测试装置都共同操作地连接到处理系统，基板仓库站和对准站。
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