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公开(公告)号：US09851506B2
公开(公告)日：2017-12-26
申请号：US14830046
申请日：2015-08-19
Applicant: Coriant Advanced Technology, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
CPC classification number: G02B6/134 , G02B6/12002 , G02B6/1223 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/2821 , G02B6/305 , G02B2006/12038
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
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公开(公告)号：US20160291265A1
公开(公告)日：2016-10-06
申请号：US15087278
申请日：2016-03-31
Applicant: Coriant Advanced Technology, LLC
Inventor： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC classification number: G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
Abstract translation: 两个半导体芯片被光学对准以形成混合半导体器件。 两个芯片具有光波导和对准表面，其定位在与相应波导的光轴精确定义的互补垂直偏移上，使得当其中一个芯片被放置在另一个芯片上并且它们的对准表面彼此邻接时，波导器垂直对准。 其芯片的层叠中的至少一个对准表面的位置通过外延精确地限定。 芯片在偏移接合焊盘处接合，其中对准表面在其间没有接合材料的情况下抵接。
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公开(公告)号：US09500821B2
公开(公告)日：2016-11-22
申请号：US14924172
申请日：2015-10-27
Applicant: Coriant Advanced Technology, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
CPC classification number: G02B6/4243 , G02B6/12004 , G02B6/1225 , G02B6/34 , G02B6/4214 , G02B6/4224 , G02B6/423 , G02B6/4232 , G02B6/4246 , G02B6/4278 , G02B6/428 , G02B2006/12142 , H01S5/0085 , H01S5/0261
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
Abstract translation: 公开了一种用于电子电路的光子接口。 光子接口包括具有调制器和光电检测器的光子集成电路，以及用于与另一光电路的光通信的光纤或光纤。 调制器驱动器芯片可以直接安装在光子集成电路上。 光纤可以放置在光纤支架的V形槽中，光纤支架可以包括至少一个光刻定义的对准特征，用于与硅光子电路的光学对准。
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Patent Agency Ranking
公开(公告)号：US09989715B2
公开(公告)日：2018-06-05
申请号：US15296709
申请日：2016-10-18
Applicant: Coriant Advanced Technology, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
CPC classification number: G02B6/4243 , G02B6/12004 , G02B6/1225 , G02B6/34 , G02B6/4214 , G02B6/4224 , G02B6/423 , G02B6/4232 , G02B6/4246 , G02B6/4278 , G02B6/428 , G02B2006/12142 , H01S5/0085 , H01S5/0261
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
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公开(公告)号：US09817197B2
公开(公告)日：2017-11-14
申请号：US15087278
申请日：2016-03-31
Applicant: Coriant Advanced Technology, LLC
Inventor： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC classification number: G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
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公开(公告)号：US20170045697A1
公开(公告)日：2017-02-16
申请号：US15296709
申请日：2016-10-18
Applicant: Coriant Advanced Technology, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
CPC classification number: G02B6/4243 , G02B6/12004 , G02B6/1225 , G02B6/34 , G02B6/4214 , G02B6/4224 , G02B6/423 , G02B6/4232 , G02B6/4246 , G02B6/4278 , G02B6/428 , G02B2006/12142 , H01S5/0085 , H01S5/0261
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
Abstract translation: 公开了一种用于电子电路的光子接口。 光子接口包括具有调制器和光电检测器的光子集成电路，以及用于与另一光电路的光通信的光纤或光纤。 调制器驱动器芯片可以直接安装在光子集成电路上。 光纤可以放置在光纤支架的V形槽中，光纤支架可包括至少一个光刻定义的对准特征，用于与硅光子电路的光学对准。
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公开(公告)号：US20160356958A1
公开(公告)日：2016-12-08
申请号：US14830046
申请日：2015-08-19
Applicant: Coriant Advanced Technology, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
CPC classification number: G02B6/134 , G02B6/12002 , G02B6/1223 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/2821 , G02B6/305 , G02B2006/12038
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
Abstract translation: 一种集成光学器件，其制造在位于金属堆叠的垂直跨度内的线路工艺后端，并且具有超过在绝缘体上硅层上制造的对应的集成光学器件的一个或多个优点。
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公开(公告)号：US20160116688A1
公开(公告)日：2016-04-28
申请号：US14924172
申请日：2015-10-27
Applicant: Coriant Advanced Technology, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
CPC classification number: G02B6/4243 , G02B6/12004 , G02B6/1225 , G02B6/34 , G02B6/4214 , G02B6/4224 , G02B6/423 , G02B6/4232 , G02B6/4246 , G02B6/4278 , G02B6/428 , G02B2006/12142 , H01S5/0085 , H01S5/0261
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
Abstract translation: 公开了一种用于电子电路的光子接口。 光子接口包括具有调制器和光电检测器的光子集成电路，以及用于与另一光电路的光通信的光纤或光纤。 调制器驱动器芯片可以直接安装在光子集成电路上。 光纤可以放置在光纤支架的V形槽中，光纤支架可包括至少一个光刻定义的对准特征，用于与硅光子电路的光学对准。
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