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1.
公开(公告)号:US20250100384A1
公开(公告)日:2025-03-27
申请号:US18291041
申请日:2022-07-21
Applicant: CORNING INCORPORATED
Inventor: Amey Ganpat Badar , Evan Gray Kister , Balamurugan Meenakshi Sundaram , Yousef Kayed Qaroush , Jason Scott Stewart
IPC: B60K35/50
Abstract: Disclosed are embodiments of a glass article for a vehicle interior system. The glass article includes a glass sheet with a first side and a second side. A first frame is disposed on the glass sheet on the first side of the glass sheet, and a second frame disposed on the second side of the glass sheet. A mandrel is disposed between the first frame and the second frame. The mandrel has a flexural rigidity of at least 150 Pa·m3 and a density of at most 2.75 g/cm3. The second side of the glass sheet rotates about the mandrel from a first configuration to a second configuration. In the first configuration, the first side forms a first angle with the second side, and in the second configuration. the first side forms a second angle with the second side. The first angle is different from the second angle.
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公开(公告)号:US11631828B2
公开(公告)日:2023-04-18
申请号:US16754581
申请日:2018-10-09
Applicant: CORNING INCORPORATED
Inventor: Shinu Baby , Dhananjay Joshi , Yousef Kayed Qaroush , Bin Zhang
Abstract: A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) μm, and (b) a flexible substrate having a thickness from about (100) to (200) μm; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) μm. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.
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公开(公告)号:US11104601B2
公开(公告)日:2021-08-31
申请号:US16085759
申请日:2017-03-13
Applicant: CORNING INCORPORATED
Inventor: Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
Abstract: A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.
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公开(公告)号:US11031574B2
公开(公告)日:2021-06-08
申请号:US16122009
申请日:2018-09-05
Applicant: CORNING INCORPORATED
Inventor: Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
IPC: H01L51/52 , B32B17/06 , G02F1/1333 , B32B7/12 , B32B27/36 , B32B27/28 , B32B27/06 , B32B17/00 , B32B27/34 , G02F1/1335 , H01L27/32
Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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公开(公告)号:US20190218142A1
公开(公告)日:2019-07-18
申请号:US16179377
申请日:2018-11-02
Applicant: CORNING INCORPORATED
Inventor: Stephan Lvovich Logunov , Yousef Kayed Qaroush , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov , Leo Young Zheng
IPC: C03C23/00 , C03C3/14 , C03C3/247 , C03C17/02 , C03C17/06 , C03C17/23 , C03C27/04 , C03C15/00 , C03C27/10 , C03C27/06 , C03C3/16 , C01G19/02 , C03C3/23 , H01L51/52
CPC classification number: C03C23/0025 , C01G19/02 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C15/00 , C03C17/02 , C03C17/06 , C03C17/23 , C03C27/044 , C03C27/06 , C03C27/10 , H01L51/5246
Abstract: An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which σHAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein σHAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its σinterface laser weld>σHAZ, wherein σinterface laser weld is peak value of compressive stress in the laser welded zone.
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公开(公告)号:US12030802B2
公开(公告)日:2024-07-09
申请号:US17602324
申请日:2020-03-30
Applicant: CORNING INCORPORATED
Inventor: Vikram Bhatia , Ah-Young Park , Yousef Kayed Qaroush , Zheming Zheng
CPC classification number: C03B23/0307 , B32B7/12 , B32B17/06 , C03B23/0302 , C03C27/10 , B32B2250/02 , B32B2605/00
Abstract: A cold-formed glass laminate may include a first ply of 3D formed glass with a first thickness and a first strength. The first ply may include pre-formed residual compressive stresses in a peripheral edge portion adapted to offset tensile stresses resulting from a cold-forming process. The laminate may also include a second ply of 3D formed glass with a second thickness less than the first thickness and a second strength greater than the first strength. An adhesive may be arranged between the first ply and the second ply and post-formed residual stresses in the peripheral edge portion of the first ply of the laminate may remain compressive. A method of forming a glass laminate with compressive edge stresses is also described.
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7.
公开(公告)号:US20230242434A1
公开(公告)日:2023-08-03
申请号:US18114001
申请日:2023-02-24
Applicant: CORNING INCORPORATED
Inventor: Vikram Bhatia , Ah-Young Park , Yousef Kayed Qaroush , Neng Wang
IPC: C03B23/023 , B32B17/10 , C03C21/00 , B32B7/02
CPC classification number: C03B23/023 , B32B17/10036 , B32B17/10119 , B32B17/10137 , B32B17/10761 , C03C21/002 , B32B7/02 , Y10T428/24628 , B32B2250/03 , Y10T428/26
Abstract: Articles and methods related to the cold-forming of glass laminate articles utilizing stress prediction analysis are provided. A cold-forming estimator (CFE) value that is related to the stress experienced by a glass sheet of a glass laminate during cold-forming is calculated based on a plurality of geometric parameters of glass layer(s) of a glass laminate article. The calculated CFE value is compared to a cold-forming threshold related to the probability that defects are formed in the complexly curved glass laminate article during cold-forming. Cold-formed glass laminate articles are also provided having geometric parameters such that the CFE value is below the cold-forming threshold.
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公开(公告)号:US20230202300A1
公开(公告)日:2023-06-29
申请号:US17926858
申请日:2021-05-18
Applicant: Corning Incorporated
Inventor: Amey Ganpat Badar , Kaikai Che , Joseph Paul Gelhaus , Paige Varner Kennedy , Evan Gray Kister , Khaled Layouni , Balamurugan Meenakshi Sundaram , Jong Se Park , Yousef Kayed Qaroush , David Evan Robinson , Jason Scott Stewart
CPC classification number: B60K37/04 , H10K59/10 , B60K2370/63 , B60K2370/67 , B60K2370/691 , B60K2370/81 , B60K2370/95 , B60K2370/48 , B60K2370/693
Abstract: Disclosed are structural design solutions for flexible display panels for use in automobile interiors that comprises a flexible joint portion that are configured to meet the requirements of the automobile industry standard head form impact testing.
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公开(公告)号:US20220176678A1
公开(公告)日:2022-06-09
申请号:US17602107
申请日:2020-03-30
Applicant: CORNING INCORPORATED
Inventor: Vikram Bhatia , Zhang Liu , Ah-Young Park , Yousef Kayed Qaroush
Abstract: A cold-formed glass laminate (100) may include a first ply (108) of 3D formed glass with a first thickness, a first strength, and a first coefficient of thermal expansion. The laminate (100) may also include a second ply (110) of 3D formed glass with a second thickness less than the first thickness, a second strength greater than the first strength, and a second coefficient of thermal expansion. The second coefficient of thermal expansion may be selected to be sufficiently higher than the first coefficient of thermal expansion to induce residual compressive stresses in the first ply (108) due to cold forming therewith. An adhesive layer (112) may be arranged between the first ply (108) and the second ply (110).
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公开(公告)号:US11168757B2
公开(公告)日:2021-11-09
申请号:US16552086
申请日:2019-08-27
Applicant: CORNING INCORPORATED
Inventor: Yuehao Li , Derwin A Nelson , Yousef Kayed Qaroush , Yang Yang
Abstract: The apparatus for non-contact damping vibration of a vibrating optical fiber moving over an optical fiber path includes an air bearing and an air supply. The air bearing includes a body having an aperture defined by an inner surface and a central axis that passes through the center of the aperture and along which lies the optical fiber path. A plurality of nozzles is distributed around the inner surface and directed toward the central axis. An air conduit within the body is in pneumatic communication with the plurality of nozzles. The air supply is pneumatically connected to the air conduit and is configured to supply pressurized air to the air bearing. The pressurized air is directed through the nozzles to the vibrating optical fiber and impinges on the optical fiber to damp the vibration of the vibrating optical fiber.
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