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公开(公告)号:US20170227208A1
公开(公告)日:2017-08-10
申请号:US15018606
申请日:2016-02-08
Applicant: Cree, Inc.
Inventor: Andrew BENDTSEN , Kurt WILCOX , Boris KARPICHEV , John DURKEE , John ROBERTS , David GOELZ , Douglas E. Keiter , Randy Bernard
IPC: F21V29/83 , F21V5/04 , F21V23/00 , F21V17/16 , H05B37/02 , F21V29/89 , F21V31/00 , F21V7/00 , F21V13/04 , F21V23/06 , F21V15/015 , F21V29/74
CPC classification number: F21V29/83 , F21S8/00 , F21V5/007 , F21V5/045 , F21V7/0083 , F21V13/04 , F21V15/01 , F21V17/16 , F21V23/007 , F21V23/0442 , F21V23/06 , F21V29/508 , F21V29/74 , F21V29/89 , F21V31/00 , F21W2131/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H05B33/0803 , H05B37/0218 , H05B37/0227 , Y02B20/46
Abstract: In one aspect, luminaires are described herein enabling independent thermal management of driver and LED assemblies. For example, a luminaire comprises a driver assembly vertically integrated with a LED assembly, the driver assembly comprising a driver heatsink having an interior in which a circuit board assembly is positioned, and the LED assembly comprising an array of LEDs and LED heatsink, wherein a barrier is positioned between the driver heatsink and the LED heatsink, separating convective cooling of the driver assembly from convective cooling of the LED assembly.
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公开(公告)号:US20170227207A1
公开(公告)日:2017-08-10
申请号:US15181065
申请日:2016-06-13
Applicant: Cree, Inc.
Inventor: Andrew BENDTSEN , Kurt Wilcox , Boris Karpichev , John Roberts , David Goelz , Douglas E. Keiter , Randy Bernard
CPC classification number: F21V29/74 , F21S8/026 , F21V5/045 , F21V7/00 , F21V15/01 , F21V23/003 , F21V23/007 , F21V23/0457 , F21V23/0464 , F21V23/0478 , F21V29/10 , F21V29/15 , F21V29/508 , F21V31/005 , F21Y2103/33 , F21Y2115/10 , G01J1/0214 , G01J1/0271 , G01J1/32 , G01J1/4204 , G01J1/4228 , G01J2001/4247 , G01J2001/4252 , H05B33/0857
Abstract: In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.
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