公开(公告)号：US12080660B2

公开(公告)日：2024-09-03

申请号：US17228978

申请日：2021-04-13

Applicant: CREE, INC.

Inventor： Xikun Zhang ,  Dejiang Chang ,  Bill Agar ,  Michael Lefevre ,  Alexander Komposch

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L25/00 ,  H01L25/07 ,  H01L29/16

CPC classification number: H01L23/66 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L25/072 ,  H01L25/50 ,  H01L29/16 ,  H01L23/49534 ,  H01L23/49537 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83121 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/29144 ,  H01L2924/0105 ,  H01L2224/29139 ,  H01L2924/0105 ,  H01L2224/29147 ,  H01L2924/0105 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012

Abstract: A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.

公开(公告)号：US11004808B2

公开(公告)日：2021-05-11

申请号：US15973276

申请日：2018-05-07

Applicant: Cree, Inc.

Inventor： Xikun Zhang ,  Dejiang Chang ,  Bill Agar ,  Michael Lefevre ,  Alexander Komposch

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/495 ,  H01L23/498 ,  H01L25/07 ,  H01L25/00 ,  H01L29/16

Abstract: A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.