公开(公告)号：US20190162384A1

公开(公告)日：2019-05-30

申请号：US16034101

申请日：2018-07-12

Applicant: CREE, INC.

Inventor： Theodore D. Lowes ,  Chandan Bhat ,  Mark Youmans

IPC: F21S45/30 ,  F21V31/03 ,  F21V31/00 ,  F21V15/04

Abstract: According to one example aspect, a device for venting a luminaire compartment comprises a luminaire compartment disposed between first and second luminaire components and one or more luminaire gaskets maintaining a weather-proof seal about the luminaire compartment. The device further comprises one or more venting tubes traversing the one or more luminaire gaskets such that the one or more venting tubes extend into the luminaire compartment and the one or more venting tubes equalize one or more environmental parameters of the luminaire compartment with one or more environmental parameters of the ambient environment.

公开(公告)号：US20150325759A1

公开(公告)日：2015-11-12

申请号：US14271116

申请日：2014-05-06

Applicant: CREE, INC.

Inventor： Kurt Wilcox ,  Theodore Lowes ,  Corey Goldstein ,  Jason Taylor ,  Chandan Bhat

IPC: H01L33/58 ,  F21V5/04 ,  H01L33/62 ,  H01L23/544 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L23/544 ,  F21V5/04 ,  G02B19/0009 ,  G02B19/0061 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material.

Abstract translation: 公开了固态固定装置和封装件，其包括诸如密封剂的光学元件，其具有集成的指示器，其指示封装朝向用户的一个或多个特性，例如封装方向，极性，芯片型等。主机 光学元件可以是基本上对称的，但是用于指示器。 指示器可以是添加剂，例如凹凸，或减色，例如孔。 指示器可以对人眼可见，和/或可以是机器可检测的，例如通过拾取和放置技术。 指示器可以通过许多工艺形成，包括成型和激光烧蚀/压印，其特别适用于硬质主体材料。

公开(公告)号：US20160072022A1

公开(公告)日：2016-03-10

申请号：US14478571

申请日：2014-09-05

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Kurt W. Wilcox ,  Bernd Keller ,  Chandan Bhat

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/46 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58

CPC classification number: H01L33/486 ,  H01L33/44 ,  H01L33/505 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

Abstract translation: 公开了发射器​​封装，其可以包括覆盖发射极的绝缘层，例如在发射器的主发射表面和透镜或密封剂之间。 封装可以包括安装有发射极倒装芯片的子安装件，使得二极管区域位于发射极的非绝缘和/或导电基板和底座之间。 然后可以用薄的绝缘层覆盖基座。 相同或另一绝缘层可以覆盖底座上的其他电活动表面。 通过绝缘发射器的电活性表面，并且在一些实施例中，其它电活性表面，即使不符合透镜粘附标准，该封装也可满足UL8750等级4封装标准。 由于包装本身符合4级标准，因此可以在夹具水平上使用更便宜和/或更多光学有效的材料。

公开(公告)号：US09954144B2

公开(公告)日：2018-04-24

申请号：US14152829

申请日：2014-01-10

Applicant: Cree, Inc.

Inventor： Chandan Bhat ,  Theodore Lowes

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0066

Abstract: This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

公开(公告)号：US20150200335A1

公开(公告)日：2015-07-16

申请号：US14152829

申请日：2014-01-10

Applicant: Cree, Inc

Inventor： Chandan Bhat ,  Theodore Lowes

IPC: H01L33/48 ,  H01L33/46 ,  H01L33/00 ,  H01L33/56 ,  H01L27/15 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0066

Abstract: This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract translation: 本公开涉及诸如发光器件的表面贴装器件及其制造方法，包括具有突出接触凸块的凹陷接触焊盘。 根据本公开的实施例包括发光器件，其中所述器件至少包括接触焊盘，使得接触焊盘相对于器件的表面凹陷。 接触凸块形成为与接触垫接触，使得接触凸块突出超过表面并且可接触装置意图安装到的基座的表面。 还公开了包括使用虚拟晶片结构的方法的制造方法。