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    LED based pedestal-type lighting structure
    3.
    发明授权
    LED based pedestal-type lighting structure 有权
    LED基座式照明结构

    公开(公告)号：US09217544B2

    公开(公告)日：2015-12-22

    申请号：US14014272

    申请日：2013-08-29

    Applicant: Cree, Inc.

    Inventor： Tao Tong ,  Ronan LeToquin ,  Bernd Keller ,  Theodore Lowes ,  Eric Tarsa ,  Mark Youmans

    IPC: F21K99/00 ,  F21V3/00 ,  F21V3/04 ,  F21Y101/02 ,  F21Y111/00 ,  F21V29/77

    CPC classification number: F21K9/56 ,  F21K9/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/04 ,  F21V29/773 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.

    Abstract translation: 公开了基于LED的灯和灯泡，其包括具有多个LED的基座，其中所述基座至少部分地包括导热材料。 散热器结构包括在与散热器结构热耦合的基座上。 相对于LED布置远程荧光体，使得来自LED的至少一些光穿过远程荧光体并被转换成不同波长的光。 一些灯泡或灯泡实施例可以发出来自LED和远程荧光体的光的白光组合。 这些可以包括发射蓝光的LED，远程荧光体具有吸收蓝色光并发出黄色或绿色光的材料。 可以包括扩散器以将发射光扩散到所需的图案，例如全向的。

    Optical Element and Method of Forming an Optical Element
    5.
    发明申请
    Optical Element and Method of Forming an Optical Element 有权
    光学元件和形成光学元件的方法

    公开(公告)号：US20150370000A1

    公开(公告)日：2015-12-24

    申请号：US14839557

    申请日：2015-08-28

    Applicant: Cree, Inc.

    Inventor： Steve Wilcenski ,  Kurt S. Wilcox ,  Theodore Lowes

    IPC: F21V8/00

    CPC classification number: G02B6/0065 ,  F21Y2105/00 ,  F21Y2115/10 ,  G02B6/0033 ,  G02B6/005

    Abstract: According to one aspect, an optical waveguide comprises a waveguide body exhibiting total internal reflection, a substrate, and a plurality of light extraction features disposed on a surface of the substrate. The light extraction features are non-adhesively bonded to the waveguide body or may be disposed on opposing sides of the substrate. A method of forming an optical element is also disclosed.

    Abstract translation: 根据一个方面，光波导包括呈现全内反射的波导体，衬底以及设置在衬底的表面上的多个光提取特征。 光提取特征是非粘合地结合到波导体或可以设置在基板的相对侧上。 还公开了一种形成光学元件的方法。

    WAFER LEVEL CONTACT PAD SOLDER BUMPING FOR SURFACE MOUNT DEVICES WITH NON-PLANAR RECESSED CONTACTING SURFACES
    6.
    发明申请
    WAFER LEVEL CONTACT PAD SOLDER BUMPING FOR SURFACE MOUNT DEVICES WITH NON-PLANAR RECESSED CONTACTING SURFACES 有权
    WAFER LEVEL联系方式垫片焊接用于带有非平面接触接触表面的表面安装设备

    公开(公告)号：US20150200335A1

    公开(公告)日：2015-07-16

    申请号：US14152829

    申请日：2014-01-10

    Applicant: Cree, Inc

    Inventor： Chandan Bhat ,  Theodore Lowes

    IPC: H01L33/48 ,  H01L33/46 ,  H01L33/00 ,  H01L33/56 ,  H01L27/15 ,  H01L33/62 ,  H01L33/50

    CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0066

    Abstract: This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

    Abstract translation: 本公开涉及诸如发光器件的表面贴装器件及其制造方法，包括具有突出接触凸块的凹陷接触焊盘。 根据本公开的实施例包括发光器件，其中所述器件至少包括接触焊盘，使得接触焊盘相对于器件的表面凹陷。 接触凸块形成为与接触垫接触，使得接触凸块突出超过表面并且可接触装置意图安装到的基座的表面。 还公开了包括使用虚拟晶片结构的方法的制造方法。

    LED PACKAGES WITH CHIPS HAVING INSULATED SURFACES
    7.
    发明申请
    LED PACKAGES WITH CHIPS HAVING INSULATED SURFACES 审中-公开
    LED包装与具有绝缘表面的CHIPS

    公开(公告)号：US20160072022A1

    公开(公告)日：2016-03-10

    申请号：US14478571

    申请日：2014-09-05

    Applicant: CREE, INC.

    Inventor： Theodore Lowes ,  Kurt W. Wilcox ,  Bernd Keller ,  Chandan Bhat

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/46 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/486 ,  H01L33/44 ,  H01L33/505 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

    Abstract translation: 公开了发射器​​封装，其可以包括覆盖发射极的绝缘层，例如在发射器的主发射表面和透镜或密封剂之间。 封装可以包括安装有发射极倒装芯片的子安装件，使得二极管区域位于发射极的非绝缘和/或导电基板和底座之间。 然后可以用薄的绝缘层覆盖基座。 相同或另一绝缘层可以覆盖底座上的其他电活动表面。 通过绝缘发射器的电活性表面，并且在一些实施例中，其它电活性表面，即使不符合透镜粘附标准，该封装也可满足UL8750等级4封装标准。 由于包装本身符合4级标准，因此可以在夹具水平上使用更便宜和/或更多光学有效的材料。

    LED BASED PEDESTAL-TYPE LIGHTING STRUCTURE
    8.
    发明申请
    LED BASED PEDESTAL-TYPE LIGHTING STRUCTURE 有权
    基于LED的PEDESTAL型照明结构

    公开(公告)号：US20140003048A1

    公开(公告)日：2014-01-02

    申请号：US14014272

    申请日：2013-08-29

    Applicant: Cree, Inc.

    Inventor： Tao Tong ,  Ronan LeToquin ,  Bernd Keller ,  Theodore Lowes ,  Eric Tarsa ,  Mark Youmans

    IPC: F21K99/00

    CPC classification number: F21K9/56 ,  F21K9/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/04 ,  F21V29/773 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.

    Abstract translation: 公开了基于LED的灯和灯泡，其包括具有多个LED的基座，其中所述基座至少部分地包括导热材料。 散热器结构包括在与散热器结构热耦合的基座上。 相对于LED布置远程荧光体，使得来自LED的至少一些光穿过远程荧光体并被转换成不同波长的光。 一些灯泡或灯泡实施例可以发出来自LED和远程荧光体的光的白光组合。 这些可以包括发射蓝光的LED，远程荧光体具有吸收蓝色光并发出黄色或绿色光的材料。 可以包括扩散器以将发射光扩散到所需的图案，例如全向的。

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