公开(公告)号：US09634209B2

公开(公告)日：2017-04-25

申请号：US14012764

申请日：2013-08-28

Applicant: Cree, Inc.

Inventor： Chi Keung Chan ,  Chak Hau Pang ,  Fei Hong Li ,  David Todd Emerson

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.

公开(公告)号：US20130341656A1

公开(公告)日：2013-12-26

申请号：US14012764

申请日：2013-08-28

Applicant: Cree, Inc.

Inventor： Chi Keung Chan ,  Chak Hau Pang ,  Fei Hong Li ,  David Todd Emerson

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.

Abstract translation: 表面贴装LED封装包括承载多个LED的引线框架和至少部分地封装引线框架的塑料外壳。 引线框架包括导电芯片载体和与导电芯片载体分开的第一，第二和第三导电连接部件。 第一，第二和第三导电连接部分中的每一个具有上表面，下表面和上表面上的连接垫。 多个LED设置在导电芯片载体的上表面上。 每个LED具有电耦合到导电芯片载体的第一电端子。 每个LED具有电耦合到第一，第二和第三导电连接部分中对应的一个的连接焊盘的第二电端子。