公开(公告)号：US11510294B2

公开(公告)日：2022-11-22

申请号：US17364987

申请日：2021-07-01

Applicant: CreeLED, Inc.

Inventor： Aaron Francis ,  Kyle Damborsky ,  Robert Wilcox ,  Jasper Cabalu ,  Colin Blakely

IPC: H05B45/20 ,  H01L27/15 ,  H01L33/50 ,  H01L33/62

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.

公开(公告)号：US20220005987A1

公开(公告)日：2022-01-06

申请号：US16918137

申请日：2020-07-01

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Derek Miller ,  Kyle Damborsky ,  Aaron Francis ,  Colin Blakely

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/64

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.

公开(公告)号：US11552229B2

公开(公告)日：2023-01-10

申请号：US17019593

申请日：2020-09-14

Applicant: CreeLED, Inc.

Inventor： Kyle Damborsky ,  Ayush Tripathi ,  Robert Wilcox ,  Sarah Trinkle ,  Colin Blakely

IPC: H01L33/58 ,  H01L33/52 ,  H01L25/075 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.

公开(公告)号：US20210329758A1

公开(公告)日：2021-10-21

申请号：US17364987

申请日：2021-07-01

Applicant: CreeLED, Inc.

Inventor： Aaron Francis ,  Kyle Damborsky ,  Robert Wilcox ,  Jasper Cabalu ,  Colin Blakely

IPC: H05B45/20 ,  H01L27/15 ,  H01L33/50 ,  H01L33/62

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.

公开(公告)号：US11411148B2

公开(公告)日：2022-08-09

申请号：US17016701

申请日：2020-09-10

Applicant: CreeLED, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/00 ,  H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US20220085258A1

公开(公告)日：2022-03-17

申请号：US17019593

申请日：2020-09-14

Applicant: CreeLED, Inc.

Inventor： Kyle Damborsky ,  Ayush Tripathi ,  Robert Wilcox ,  Sarah Trinkle ,  Colin Blakely

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/52 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.

公开(公告)号：US11894499B2

公开(公告)日：2024-02-06

申请号：US16918137

申请日：2020-07-01

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Derek Miller ,  Kyle Damborsky ,  Aaron Francis ,  Colin Blakely

IPC: H01L33/58 ,  H01L33/64 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L33/56

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.

公开(公告)号：USD1000400S1

公开(公告)日：2023-10-03

申请号：US29779119

申请日：2021-04-16

Applicant: CreeLED, Inc.

Designer： Robert Wilcox ,  Sarah Trinkle ,  Kyle Damborsky ,  Colin Blakely ,  Ayush Tripathi

Abstract: FIG. 1 is a top perspective view of the light emitting diode package;
FIG. 2 is a top view of the light emitting diode package of FIG. 1;
FIG. 3 is a bottom view of the light emitting diode package of FIG. 1;
FIG. 4 is a side view of the light emitting diode package of FIG. 1;
FIG. 5 is an opposing side view of the light emitting diode package of FIG. 1;
FIG. 6 is an end view of the light emitting diode package of FIG. 1;
FIG. 7 is an opposing end view of the light emitting diode package of FIG. 1; and,
FIG. 8 is a bottom perspective view of the light emitting diode package of FIG. 1.
The broken lines shown in the drawings depict portions of the light emitting diode package that form no part of the claimed design.