公开(公告)号：US11894496B2

公开(公告)日：2024-02-06

申请号：US17178511

申请日：2021-02-18

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Sarah Trinkle ,  Derek Miller ,  Peter Andrews ,  Colin Blakely

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

CPC classification number: H01L33/505 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60

Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.

公开(公告)号：USD1036711S1

公开(公告)日：2024-07-23

申请号：US29877887

申请日：2023-06-13

Applicant: CreeLED, Inc.

Designer： Thomas Celano ,  Alexis Rile ,  Derek Miller ,  David Suich ,  Colin Blakely ,  Sarah Trinkle ,  Robert Wilcox

Abstract: FIG. 1 is a top perspective view of one embodiment of a light-emitting diode package;
FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;
FIG. 3 is a top view of the light-emitting diode package of FIG. 1;
FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;
FIG. 5 is an end view of the light-emitting diode package of FIG. 1;
FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;
FIG. 7 is a side view of the light-emitting diode package of FIG. 1;
FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1;
FIG. 9 is a top perspective view of another embodiment of a light-emitting diode package;
FIG. 10 is a bottom perspective view of the light-emitting diode package of FIG. 9;
FIG. 11 is a top view of the light-emitting diode package of FIG. 9;
FIG. 12 is a bottom view of the light-emitting diode package of FIG. 9;
FIG. 13 is an end view of the light-emitting diode package of FIG. 9;
FIG. 14 is an opposing end view of the light-emitting diode package of FIG. 9;
FIG. 15 is a side view of the light-emitting diode package of FIG. 9; and,
FIG. 16 is an opposing side view of the light-emitting diode package of FIG. 9.
The dashed broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.
The dot-dashed broken lines shown in the drawings depict portions of the light-emitting diode package that represent boundaries of the claimed design and are not part of the claimed design.

公开(公告)号：USD996378S1

公开(公告)日：2023-08-22

申请号：US29829994

申请日：2022-03-09

Applicant: CreeLED, Inc.

Designer： Sarah Trinkle ,  Alexis Rile ,  Robert Wilcox ,  Colin Blakely

Abstract: FIG. 1 is a top perspective view of the light-emitting diode package;
FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;
FIG. 3 is a top view of the light-emitting diode package of FIG. 1;
FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;
FIG. 5 is an end view of the light-emitting diode package of FIG. 1;
FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;
FIG. 7 is a side view of the light-emitting diode package of FIG. 1; and,
FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1.
The broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.

公开(公告)号：US20220262989A1

公开(公告)日：2022-08-18

申请号：US17178511

申请日：2021-02-18

Applicant: CreeLED, Inc.

Inventor： Robert Wilcox ,  Sarah Trinkle ,  Derek Miller ,  Peter Andrews ,  Colin Blakely

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.

公开(公告)号：US20220085258A1

公开(公告)日：2022-03-17

申请号：US17019593

申请日：2020-09-14

Applicant: CreeLED, Inc.

Inventor： Kyle Damborsky ,  Ayush Tripathi ,  Robert Wilcox ,  Sarah Trinkle ,  Colin Blakely

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/52 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.

公开(公告)号：USD1060278S1

公开(公告)日：2025-02-04

申请号：US29877879

申请日：2023-06-13

Applicant: CreeLED, Inc.

Designer： Sarah Trinkle ,  Alexis Rile ,  Robert Wilcox ,  Colin Blakely

公开(公告)号：US20230261154A1

公开(公告)日：2023-08-17

申请号：US17674430

申请日：2022-02-17

Applicant: CreeLED, Inc.

Inventor： Sarah Trinkle ,  Alexis Rile ,  Robert Wilcox ,  Colin Blakely

IPC: H01L33/54 ,  H01L25/075

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/32

Abstract: Light-emitting diode (LED) packages and more particularly LED packages with selectively placed light-altering materials and related methods are disclosed. Selectively placed light-altering materials are provided that are arranged along peripheral edges of LED chips and along portions of underlying submounts. By covering peripheral edges of LED chips without covering entire submount surfaces, light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips. Methods of selectively placing light-altering materials include selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount before curing in place.

公开(公告)号：US11552229B2

公开(公告)日：2023-01-10

申请号：US17019593

申请日：2020-09-14

Applicant: CreeLED, Inc.

Inventor： Kyle Damborsky ,  Ayush Tripathi ,  Robert Wilcox ,  Sarah Trinkle ,  Colin Blakely

IPC: H01L33/58 ,  H01L33/52 ,  H01L25/075 ,  H01L33/00

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.

公开(公告)号：USD1000400S1

公开(公告)日：2023-10-03

申请号：US29779119

申请日：2021-04-16

Applicant: CreeLED, Inc.

Designer： Robert Wilcox ,  Sarah Trinkle ,  Kyle Damborsky ,  Colin Blakely ,  Ayush Tripathi

Abstract: FIG. 1 is a top perspective view of the light emitting diode package;
FIG. 2 is a top view of the light emitting diode package of FIG. 1;
FIG. 3 is a bottom view of the light emitting diode package of FIG. 1;
FIG. 4 is a side view of the light emitting diode package of FIG. 1;
FIG. 5 is an opposing side view of the light emitting diode package of FIG. 1;
FIG. 6 is an end view of the light emitting diode package of FIG. 1;
FIG. 7 is an opposing end view of the light emitting diode package of FIG. 1; and,
FIG. 8 is a bottom perspective view of the light emitting diode package of FIG. 1.
The broken lines shown in the drawings depict portions of the light emitting diode package that form no part of the claimed design.

公开(公告)号：USD996377S1

公开(公告)日：2023-08-22

申请号：US29827155

申请日：2022-02-17

Applicant: CreeLED, Inc.

Designer： Thomas Celano ,  Alexis Rile ,  Derek Miller ,  David Suich ,  Colin Blakely ,  Sarah Trinkle ,  Robert Wilcox

Abstract: FIG. 1 is a top perspective view of one embodiment of a light-emitting diode package;
FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;
FIG. 3 is a top view of the light-emitting diode package of FIG. 1;
FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;
FIG. 5 is an end view of the light-emitting diode package of FIG. 1;
FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;
FIG. 7 is a side view of the light-emitting diode package of FIG. 1;
FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1;
FIG. 9 is a top perspective view of another embodiment of a light-emitting diode package;
FIG. 10 is a bottom perspective view of the light-emitting diode package of FIG. 9;
FIG. 11 is a top view of the light-emitting diode package of FIG. 9;
FIG. 12 is a bottom view of the light-emitting diode package of FIG. 9;
FIG. 13 is an end view of the light-emitting diode package of FIG. 9;
FIG. 14 is an opposing end view of the light-emitting diode package of FIG. 9;
FIG. 15 is a side view of the light-emitting diode package of FIG. 9; and,
FIG. 16 is an opposing side view of the light-emitting diode package of FIG. 9.
The dashed broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.
The dot-dashed broken lines shown in the drawings depict portions of the light-emitting diode package that represent boundaries of the claimed design and are not part of the claimed design.