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公开(公告)号：US12114419B2
公开(公告)日：2024-10-08
申请号：US17713347
申请日：2022-04-05
Applicant: Dell Products L.P.
Inventor： William Andrew Smith , Mallikarjun Vasa , Bhyrav M. Mutnury
CPC classification number: H05K1/0218 , H05K1/115 , H05K3/42 , H05K2201/09518 , H05K2201/09545
Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
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2.发明授权公开(公告)号：US12174772B2
公开(公告)日：2024-12-24
申请号：US18159933
申请日：2023-01-26
Applicant: Dell Products L.P.
IPC: G06F13/40
Abstract: Methods and systems for managing operation of data processing systems are disclosed. The data processing systems may include a limited number of hardware components. To increase the usable number or types of hardware components, an add-in card or other device may be attached to the data processing system. To facilitate connection of a variety of types of devices having varying form factors, an interposer may be used. The data processing system may modify a communication topology based on whether a device or the interposer is connected to it to establish communication channels.
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公开(公告)号：US20220030331A1
公开(公告)日：2022-01-27
申请号：US16936751
申请日：2020-07-23
Applicant: Dell Products L.P.
Inventor： Salvador Jimenez, III , Noman Mithani , William Andrew Smith
IPC: H04Q1/14
Abstract: A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.
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公开(公告)号：US20230319978A1
公开(公告)日：2023-10-05
申请号：US17713347
申请日：2022-04-05
Applicant: Dell Products L.P.
Inventor： William Andrew Smith , Mallikarjun Vasa , Bhyrav M. Mutnury
CPC classification number: H05K1/0218 , H05K1/115 , H05K3/42 , H05K2201/09518 , H05K2201/09545
Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
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Patent Agency Ranking
公开(公告)号：US11436177B2
公开(公告)日：2022-09-06
申请号：US16937726
申请日：2020-07-24
Applicant: Dell Products L.P.
Inventor： William Andrew Smith , Robert G. Bassman , Salvador Jimenez, III , Sanjiv Sinha , Noman Mithani
Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature. The floating device transmits floating device location identifying information to the device location identification subsystem that is based on the engagement of the chassis engagement elements and the first chassis location identification feature, and that identifies a relative location of the first floating device housing in the chassis.
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公开(公告)号：US20240389219A1
公开(公告)日：2024-11-21
申请号：US18784640
申请日：2024-07-25
Applicant: DELL PRODUCTS L.P.
Inventor： William Andrew Smith , Mallikarjun Vasa , Bhyrav M. Mutnury
Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
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公开(公告)号：US12111707B2
公开(公告)日：2024-10-08
申请号：US18159929
申请日：2023-01-26
Applicant: Dell Products L.P.
Inventor： William Andrew Smith , Timothy M. Lambert , Jeffrey Leighton Kennedy
IPC: G06F1/26 , G06F1/3215 , G06F13/42
CPC classification number: G06F1/26 , G06F1/3215 , G06F13/4221 , G06F13/4295 , G06F2213/0026 , G06F2213/0042
Abstract: Methods and systems for managing operation of data processing systems are disclosed. The data processing systems may include a limited number of hardware components. To increase the usable number or types of hardware components, an add-in card or other device may be attached to the data processing system. When connected to the data processing system, these devices may consume power delivered by the data processing system. The devices may cooperate with the host data processing system so that power is consumed in a manner that is less likely to negatively impact operation of the devices and host system.
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公开(公告)号：US11758306B2
公开(公告)日：2023-09-12
申请号：US16936751
申请日：2020-07-23
Applicant: Dell Products L.P.
Inventor： Salvador Jimenez, III , Noman Mithani , William Andrew Smith
IPC: H04Q1/14
CPC classification number: H04Q1/141 , H04Q1/142 , H04Q2201/10
Abstract: A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.
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公开(公告)号：US20220027302A1
公开(公告)日：2022-01-27
申请号：US16937726
申请日：2020-07-24
Applicant: Dell Products L.P.
Inventor： William Andrew Smith , Robert G. Bassman , Salvador Jimenez, III , Sanjiv Sinha , Noman Mithani
Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature. The floating device transmits floating device location identifying information to the device location identification subsystem that is based on the engagement of the chassis engagement elements and the first chassis location identification feature, and that identifies a relative location of the first floating device housing in the chassis.
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