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公开(公告)号：US11985760B2
公开(公告)日：2024-05-14
申请号：US17659735
申请日：2022-04-19
申请人： Dell Products L.P.
CPC分类号： H05K1/0216 , H01P3/081 , H05K1/024
摘要： A printed circuit board (PCB), including: a ground reference layer; a pre-impregnated (pre-preg) layer having a surface; a first transmission line positioned on the surface; a second transmission line positioned on the surface spaced-apart from the first transmission line a first distance; and a solder mask layer positioned on the surface of the pre-preg layer and surrounding the first transmission line and the second transmission line, the solder mask layer having a thickness and a dielectric constant, wherein the thickness of the solder mask layer and a value of the dielectric constant of the solder mask layer cause convergence of electric fields associated with the first transmission line to be within a second distance from the first transmission line.
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2.发明公开公开(公告)号：US20230337354A1
公开(公告)日：2023-10-19
申请号：US17659735
申请日：2022-04-19
申请人： Dell Products L.P.
CPC分类号： H05K1/0216 , H05K1/024 , H01P3/081
摘要： A printed circuit board (PCB), including: a ground reference layer; a pre-impregnated (pre-preg) layer having a surface; a first transmission line positioned on the surface; a second transmission line positioned on the surface spaced-apart from the first transmission line a first distance; and a solder mask layer positioned on the surface of the pre-preg layer and surrounding the first transmission line and the second transmission line, the solder mask layer having a thickness and a dielectric constant, wherein the thickness of the solder mask layer and a value of the dielectric constant of the solder mask layer cause convergence of electric fields associated with the first transmission line to be within a second distance from the first transmission line.
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公开(公告)号：US20230319978A1
公开(公告)日：2023-10-05
申请号：US17713347
申请日：2022-04-05
申请人： Dell Products L.P.
CPC分类号： H05K1/0218 , H05K1/115 , H05K3/42 , H05K2201/09518 , H05K2201/09545
摘要： An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
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公开(公告)号：US11774474B2
公开(公告)日：2023-10-03
申请号：US17713406
申请日：2022-04-05
申请人： Dell Products L.P.
摘要： Embodiments described herein relate to a method for modifying transmission line characteristics. The method may include: making a first determination of a null frequency of an input signal to a transmission line; performing an analysis to make a second determination of a wavelength of the input signal using, at least in part, the null frequency; making a third determination, based on the analysis, of a half wavelength of the input signal; calculating, based on the half wavelength, a total stub length; and adding a trace to a stub associated with a via, wherein the stub and the trace are a length that is at least a portion of the half wavelength of the input signal.
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公开(公告)号：US20220229097A1
公开(公告)日：2022-07-21
申请号：US17713406
申请日：2022-04-05
申请人： Dell Products L.P.
摘要： Embodiments described herein relate to a method for modifying transmission line characteristics. The method may include: making a first determination of a null frequency of an input signal to a transmission line; performing an analysis to make a second determination of a wavelength of the input signal using, at least in part, the null frequency; making a third determination, based on the analysis, of a half wavelength of the input signal; calculating, based on the half wavelength, a total stub length; and adding a trace to a stub associated with a via, wherein the stub and the trace are a length that is at least a portion of the half wavelength of the input signal.
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公开(公告)号：US11163291B2
公开(公告)日：2021-11-02
申请号：US16270906
申请日：2019-02-08
申请人： Dell Products L.P.
发明人： Sandor Farkas , Bhyrav M. Mutnury
IPC分类号： G05B19/406 , G06F13/42
摘要： In one or more embodiments, one or more systems, methods, and/or processes may determine a first height of a first eye diagram of a differential pair of circuit board traces of a circuit board of an information handling system; may determine a first width of the first eye diagram; may transfer a liquid above an area of the circuit board; may provide a differential signal to the differential pair; may determine a second height of a second eye diagram of the differential pair; may determine a second width of the second eye diagram; may determine at least one of that the second height is less than the first height by at least a first threshold and that the second width is less than the first width by at least a second threshold; and may provide information that indicates a presence of the liquid on the circuit board.
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7.发明授权公开(公告)号：US11144410B2
公开(公告)日：2021-10-12
申请号：US16874380
申请日：2020-05-14
申请人： DELL PRODUCTS, L.P.
摘要： A dynamic random access memory (DRAM) device includes an on-die termination (ODT) controller including an input to receive an ODT signal from a memory controller, and ODT circuitry to terminate an interface circuit, the interface circuit to provide a data signal between the memory controller and the DRAM device. The ODT controller is configured in a first impedance switching mode to terminate the interface circuit at a first impedance level in response to a first state of the ODT signal, to terminate the interface circuit at a second impedance level in response to a second state of the ODT signal, and to terminate the interface circuit at a third impedance level in response to a change in the ODT signal from the first state to the second state, the third impedance level being between the first impedance level and the second impedance level.
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公开(公告)号：US20200245451A1
公开(公告)日：2020-07-30
申请号：US16260595
申请日：2019-01-29
申请人： DELL PRODUCTS L.P.
发明人： Umesh Chandra , Bhyrav M. Mutnury
摘要： A multi-layer PCB has conductive vias (134) passing through multiple layers. A layer may have a conductive non-functional feature (710) physically contacting a via but not surrounding the via, to make the PCB more resistant to thermal stresses while, at the same time, reducing the parasitic capacitance compared to a prior art non-functional pad (310n).
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公开(公告)号：US10667393B2
公开(公告)日：2020-05-26
申请号：US15861877
申请日：2018-01-04
申请人： DELL PRODUCTS, L.P.
摘要： A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI).
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公开(公告)号：US20190274213A1
公开(公告)日：2019-09-05
申请号：US15910773
申请日：2018-03-02
申请人： Dell Products L.P.
发明人： Umesh Chandra , Chun-Lin Liao , Bhyrav M. Mutnury
摘要： A circuit board pad mounting orientation system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. At least one connector pad receives the signal transmission line adjacent a first end of that connector pad. At least one connector pad includes a second end that provides a reduction in a width of that connector pad to indicate a mounting orientation for coupling to the connector pad that receives the signal transmission line. In a specific example, a first connector pad receives the signal transmission line, includes the first end, and includes the second end that is opposite the first connector pad from the first end and that provides the reduction in the width of the first connector pad to indicate the mounting orientation for coupling to the first connector pad.
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