公开(公告)号：US20240124747A1

公开(公告)日：2024-04-18

申请号：US18276398

申请日：2021-12-15

申请人： LG ELECTRONICS INC.

发明人： Sanghyun HONG

IPC分类号： C09J7/35 ,  B32B5/18 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B27/06 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  F24H1/18

CPC分类号： C09J7/35 ,  B32B5/18 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B27/065 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  F24H1/182 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2301/414 ,  C09J2400/166 ,  C09J2400/246 ,  C09J2425/00 ,  F24H4/04

摘要： Disclosed is a water tank adhesion structure using thermal bonding film for air-to-water source heat pump, the thermal film, which is activated by the temperature of the hot water and is inserted between a hot water tank and insulation material for tight adhesion therebetween, activating when hot water is supplied, which is when insulation is actually necessary.

公开(公告)号：US20190203076A1

公开(公告)日：2019-07-04

申请号：US16353196

申请日：2019-03-14

申请人： Yuh-Jye Uang ,  Chi-Shih Lee

发明人： Yuh-Jye Uang ,  Chi-Shih Lee

IPC分类号： C09J7/35 ,  C09J5/06 ,  C09J11/08 ,  C09J11/04 ,  C09J11/06 ,  C08J5/12 ,  B32B7/06

CPC分类号： C09J7/35 ,  B32B7/06 ,  B32B7/12 ,  C08J5/128 ,  C08J2321/00 ,  C08J2323/08 ,  C08J2329/14 ,  C08K5/098 ,  C08K2003/2206 ,  C08K2003/222 ,  C09J5/06 ,  C09J7/10 ,  C09J7/401 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J123/0869 ,  C09J2201/61 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2400/246 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2411/00 ,  C09J2421/006 ,  C09J2421/008 ,  C09J2423/00 ,  C09J2423/04 ,  C09J2423/046 ,  C09J2423/048 ,  C09J2423/16 ,  C09J2431/00 ,  C09J2431/006 ,  C09J2431/008 ,  C09J2433/00 ,  C08L7/00 ,  C08L23/02

摘要： A hot melt adhesive film for bonding an ethylene-vinyl acetate form and a rubber includes a hot melt adhesive film layer and a release film layer. The hot melt adhesive film layer is prepared by the following raw materials in parts by weight: a 20-50 parts by weight of polyethylene-ester copolymer, a 5-15 parts by weight of rubber, a 15-55 parts by weight of thermoplastic polyolefin, a 5-20 parts by weight of tackifier and a 5-30 parts by weight of auxiliary. The release film layer is releasably adhered to the hot melt adhesive film layer.

公开(公告)号：US12104098B2

公开(公告)日：2024-10-01

申请号：US17767889

申请日：2020-10-06

申请人： DOW SILICONES CORPORATION

发明人： Frederic Gubbels ,  Gregory Chambard

IPC分类号： B60C19/00 ,  B29C73/16 ,  C08J5/12 ,  C08J9/36 ,  C09J5/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06

CPC分类号： C09J183/06 ,  B29C73/163 ,  B60C19/002 ,  C08J5/128 ,  C08J9/36 ,  C09J5/00 ,  C09J11/04 ,  C09J11/06 ,  C08J2205/052 ,  C08J2321/00 ,  C08J2375/04 ,  C08J2483/06 ,  C09J2400/246 ,  C09J2421/008 ,  C09J2483/00

摘要： The present disclosure relates to self-sealing tires, a process for making said self-sealing tires and the use of a silicone composition cured via a condensation cure chemistry to form a self-sealing layer designed to function as both (i) a self-sealing tire puncture material, i.e., to seal puncture holes in the tread region of tires if/when punctured by a foreign body and (ii) as an adhesive for sound-absorbing foams adapted to reduce the noise generated by tires during travel.

公开(公告)号：US20230416578A1

公开(公告)日：2023-12-28

申请号：US18034624

申请日：2021-10-27

申请人： DENKA COMPANY LIMITED

发明人： Yusuke TAKAHASHI ,  Chiaki TAKANO

IPC分类号： C09J151/00 ,  C08F290/04 ,  C09K11/02 ,  C09J5/06 ,  C09J4/06 ,  G01N21/64

CPC分类号： C09J151/003 ,  C08F290/048 ,  C09K11/02 ,  C09J5/06 ,  C09J2400/166 ,  G01N21/6428 ,  C09J2451/00 ,  C09J2400/246 ,  C09J4/06

摘要： A curable composition containing a polymerizable compound (A) and a polymerization initiator (B). A half width of a temperature-loss tangent (tan δ) graph is 90° C. or higher and 150° C. or lower, where the half width is obtained by measuring a dynamic viscoelasticity of a cured substance of this curable composition under measurement conditions of frequency: 1.0 Hz, mode: tensile mode, measurement temperature range: −50° C. to 200° C., and temperature rising rate: 2° C./min.