公开(公告)号：US20230147757A1

公开(公告)日：2023-05-11

申请号：US17920631

申请日：2021-04-22

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Toru ARAI

IPC: C01B33/18 ,  C08K3/36

CPC classification number: C01B33/18 ,  C08K3/36 ,  C01P2004/32 ,  C01P2002/74

Abstract: A spherical silica powder which, when heated from 25° C. up to 1000° C. at a rate of 30° C./min, desorbs water molecules in an amount of 0.01 mmol/g or less at 500° C. to 1000° C., and which has a specific surface area of 1 to 30 m2/g.

公开(公告)号：US20240417545A1

公开(公告)日：2024-12-19

申请号：US18701790

申请日：2022-10-07

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA ,  Kei KUBOBUCHI ,  Takako EBISUZAKI

IPC: C08K9/06 ,  C09C1/30

Abstract: Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same.
Spherical silica particles (X) are those having a surface fractal dimension of 1.0-2.3. The resin composition contains the spherical silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin. The specific surface area of the spherical silica particles (X) is preferably 0.1-2.0 m2/g. The average particle diameter of the spherical silica particles (X) is preferably 1-30 μm.

公开(公告)号：US20240317597A1

公开(公告)日：2024-09-26

申请号：US18578989

申请日：2022-06-24

Applicant: Denka Company Limited

Inventor： Toshihiko TSUNEYOSHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C01F7/02 ,  C01B33/18 ,  C08K3/22 ,  C08K3/36

CPC classification number: C01F7/02 ,  C01B33/18 ,  C08K3/22 ,  C08K3/36 ,  C01P2002/85 ,  C01P2004/61 ,  C01P2004/84 ,  C08K2003/2227 ,  C08K2201/003

Abstract: Provided are oxide composite particles closer to a sphere that are mixed with a resin to obtain a resin composition having low dielectric constant and low dielectric loss tangent. The oxide composite particles containing silica and an oxide of aluminum (a single oxide or a composite oxide, or both), in which the oxide composite particles contain 10 to 90% by mass of an α-cristobalite crystal phase, 50% by mass or less of an α-alumina crystal phase, and more than 10% by mass of a mullite crystal phase, and an elemental ratio of aluminum to silicon (aluminum/silicon) as determined by X-ray photoelectron spectroscopy is 0.1 or more.

公开(公告)号：US20230295442A1

公开(公告)日：2023-09-21

申请号：US18020182

申请日：2021-08-13

Applicant: DENKA COMPANY LIMITED

Inventor： Takuji KOBAYASHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C09C1/36

CPC classification number: C09C1/36 ,  C01P2006/63 ,  C01P2006/64 ,  C01P2006/80 ,  C01P2002/72

Abstract: A method for producing a particle, containing a step of heating a mixture containing TiH2 and TiO2 at 700 to 900° C., wherein a molar ratio of the TiH2 to the TiO2 contained in the mixture is 3.1 to 4.6. A particle having a crystal composition composed of Ti2O3 and γ-Ti3O5, wherein a molar ratio of the Ti2O3 to the γ-Ti3O5 is 0.1 or more.

公开(公告)号：US20240359998A1

公开(公告)日：2024-10-31

申请号：US18573868

申请日：2022-06-20

Applicant: Denka Company Limited

Inventor： Takuji KOBAYASHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C01G23/04

CPC classification number: C01G23/043 ,  C01P2002/72 ,  C01P2002/90 ,  C01P2006/22

Abstract: A powder containing: a first particle having a first crystal composition; and a second particle having a second crystal composition different from the first crystal composition, wherein each of the first crystal composition and the second crystal composition contains at least one selected from the group consisting of Ti2O3, γ-Ti3O5 and Ti4O7.

公开(公告)号：US20240351893A1

公开(公告)日：2024-10-24

申请号：US18684435

申请日：2022-08-19

Applicant: Denka Company Limited

Inventor： Takuji KOBAYASHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C01B33/18 ,  C08K3/36

CPC classification number: C01B33/18 ,  C08K3/36 ,  C01P2002/70 ,  C01P2002/88 ,  C01P2004/32 ,  C01P2006/32 ,  C01P2006/82

Abstract: To provide: a spherical crystalline silica powder which enables a resin molded article having a high coefficient of linear thermal expansion and a low dielectric tangent to be obtained; and a method for producing the same.
Provided is a spherical crystalline silica powder in which the number of water molecules desorbed at 50° C.-1,000° C. when the temperature is increased from 25° C. to 1,000° C. at a condition of 30° C./min. is 10 μmol/g or less, and in which 10 mass % or more of the total powder is α-quartz crystal.
Also provided is a method for producing a spherical crystalline silica powder, the method comprising:



(i) heating a spherical amorphous silica powder to obtain a spherical crystalline silica powder;
(ii) bringing the spherical crystalline silica powder into contact with an acid; and
(iii) heating, at 800-1,400° C., the spherical crystalline silica powder treated by (ii).

公开(公告)号：US20240317975A1

公开(公告)日：2024-09-26

申请号：US18578955

申请日：2022-06-24

Applicant: Denka Company Limited

Inventor： Toshihiko TSUNEYOSHI ,  Motoharu FUKAZAWA ,  Takuto OKABE

IPC: C08K9/02 ,  C09C1/30 ,  C09C3/06 ,  H01Q1/36

CPC classification number: C08K9/02 ,  C09C1/3054 ,  C09C3/063 ,  C01P2002/72 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/84 ,  H01Q1/36

Abstract: Provided are oxide composite particles to be mixed with a resin to obtain a resin composition having low viscosity, low dielectric constant, and low dielectric loss tangent. The oxide composite particles containing silica and an oxide of aluminum (a single oxide or a composite oxide, or both), in which the oxide composite particles contain 50% by mass or more of an α-cristobalite crystal phase, less than 5% by mass of an α-alumina crystal phase, and 10% by mass or less of a mullite crystal phase, and an elemental ratio of aluminum to silicon (aluminum/silicon) as determined by X-ray photoelectron spectroscopy is 0.01 to 5.0.

公开(公告)号：US20220169832A1

公开(公告)日：2022-06-02

申请号：US17436013

申请日：2020-01-30

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C08K7/18 ,  C01B33/18 ,  C08K9/06 ,  B65B1/04

Abstract: A spherical silica powder with a low dielectric tangent, wherein after formulating the spherical silica powder in a resin and molding it into a sheet, in a dielectric tangent of the spherical silica powder calculated by using he following Formula (I) based on a dielectric tangent (tan δc) of the sheet which is measured under the conditions a frequency is 35-40 GHz with a resonator method, B/A is 0.70 or lower, wherein “A” represents a dielectric tangent (tan δfA) of the spherical silica powder before a dielectric tangent reduction treatment and “B” represents a dielectric tangent (tan δfB) of the spherical silica powder after a dielectric tangent reduction treatment; and a specific surface area of said spherical silica powder after a dielectric tangent reduction treatment is 1-30 m2/g.

公开(公告)号：US20240308867A1

公开(公告)日：2024-09-19

申请号：US18273831

申请日：2022-01-21

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C01F7/021 ,  C08K3/22 ,  C08L71/12

CPC classification number: C01F7/021 ,  C08K3/22 ,  C08L71/12 ,  C01P2002/72 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/40 ,  C01P2006/80 ,  C08K2003/2227

Abstract: Provided are spherical alumina particles to be mixed with a resin to obtain a resin composition having low dielectric loss tangent. The spherical alumina particles containing 90% by mass or more of an α-alumina crystal phase, in which the spherical alumina particles have a half-width of an α-alumina (113) peak of 0.124° or less as observed by X-ray diffraction and an average particle diameter of 0.5 to 40 μm.

公开(公告)号：US20240239682A1

公开(公告)日：2024-07-18

申请号：US18563782

申请日：2022-05-18

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C01G23/04 ,  C01F7/021 ,  C08K7/18

CPC classification number: C01G23/04 ,  C01F7/021 ,  C08K7/18 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C08K2201/003 ,  C08K2201/006

Abstract: To provide: an inorganic oxide powder which, when filled in a resin material, can simultaneously achieve a high dielectric constant and a low dielectric dissipation factor; a method for producing the same; and a resin composition comprising the inorganic oxide powder.
Provided is an inorganic oxide powder comprising a spherical titanium oxide powder and an aluminum oxide powder, wherein the aluminum content in the inorganic oxide powder is 20-50,000 mass ppm. Further provided is a resin composition comprising the inorganic oxide powder and at least one resin material selected from a thermoplastic resin and a thermosetting resin.