公开(公告)号：US10134593B2

公开(公告)日：2018-11-20

申请号：US15570841

申请日：2016-04-05

Applicant: DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Takeshi Endo ,  Atsuya Akiba ,  Yuichi Takeuchi ,  Hidefumi Takaya ,  Sachiko Aoi

IPC: H01L29/00 ,  H01L21/20 ,  H01L21/265 ,  H01L29/78 ,  H01L29/06 ,  H01L29/12 ,  H01L29/08 ,  H01L29/16 ,  H01L21/00 ,  H01L21/04

Abstract: A semiconductor device includes: a substrate having a cell region with a semiconductor element and an outer peripheral region; and a drift layer on the substrate. The semiconductor element includes a base region, a source region, a trench gate structure, a deep layer deeper than a gate trench, a source electrode, and a drain electrode. The outer peripheral region has a recess portion in which the drift layer are exposed, and a guard ring layer. The guard ring layer includes multiple guard ring trenches having a frame shape, surrounding the cell region and arranged on an exposed surface of the drift layer, and a first guard ring in the guard ring trenches. Each of the linear deep trenches has a width equal to a width of each of the linear guard ring trenches.

公开(公告)号：US12255120B2

公开(公告)日：2025-03-18

申请号：US17824004

申请日：2022-05-25

Applicant: DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation

Inventor： Yoshitaka Kato ,  Takeshi Endo ,  Kazuhiro Tsuruta

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/433

Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.

公开(公告)号：US11532534B2

公开(公告)日：2022-12-20

申请号：US17172361

申请日：2021-02-10

Applicant: DENSO CORPORATION

Inventor： Yoshitaka Kato ,  Takeshi Endo

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.

公开(公告)号：US11101246B2

公开(公告)日：2021-08-24

申请号：US16823402

申请日：2020-03-19

Applicant: DENSO CORPORATION

Inventor： Tomohito Iwashige ,  Takeshi Endo ,  Kazuhiko Sugiura

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H05K7/20 ,  H01L25/07 ,  H01L23/00 ,  H01L23/367 ,  H01L21/48 ,  H01L25/00 ,  H01L23/31

Abstract: In a semiconductor device, a first semiconductor chip and a second semiconductor chip are disposed between a first support member and a second support member. A first underlayer bonding material is disposed between the first semiconductor chip and the first support member. A second underlayer bonding material is disposed between the second semiconductor chip and the first support member. A first upper layer bonding material is disposed between the first semiconductor chip and the second support member. A second upper layer bonding material is disposed between the second semiconductor chip and the second support member.

公开(公告)号：US11050314B2

公开(公告)日：2021-06-29

申请号：US16423737

申请日：2019-05-28

Applicant: DENSO CORPORATION

Inventor： Yoshimitsu Takahashi ,  Mitsutaka Ito ,  Hiroshi Shimizu ,  Takeshi Endo

IPC: H02K3/28 ,  H02K3/04 ,  H02K11/33 ,  H02K1/16 ,  H02K1/27 ,  H02K7/00 ,  H02K21/14 ,  H02K3/34 ,  H02K3/14 ,  H02M7/49 ,  B60K6/26

Abstract: In a rotating electric machine, a stator includes a stator core and three phase windings. In the stator core, a plurality of slots arrayed in a circumferential direction are formed. The three phase windings are wound around the stator core. The three phase windings include first, second, and third windings. One end of the first winding is provided further towards an outer side of the stator in a radial direction than a division line that divides the slot into two in the radial direction of the stator. One end of the second winding is provided further towards an inner side of the stator in the radial direction than the division line. One end of the third winding is provided between the one end of the first winding and the one end of the second winding relative to the radial direction of the stator, with at least a single slot therebetween.