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公开(公告)号:US20240079492A1
公开(公告)日:2024-03-07
申请号:US18506290
申请日:2023-11-10
Applicant: DENSO CORPORATION
Inventor: Atsuya AKIBA , Yuichi TAKEUCHI , Kazuki ARAKAWA , Yusuke HAYAMA , Yasushi URAKAMI , Shinichiro MIYAHARA , Tomoo MORINO
CPC classification number: H01L29/7813 , H01L29/0696 , H01L29/1095 , H01L29/1608
Abstract: A semiconductor device includes a second deep layer between a first deep layer and first current distribution layer and a base region in an active region and in a part of an inactive region adjacent to the active region. The second deep layer has a second stripe portion including lines connecting to the base region and the first deep layer. The semiconductor device further includes a second current distribution layer between the first current distribution layer and the base region and arranged between the lines of the second stripe portion. The first deep layer has a first stripe portion including a plurality of lines, and each line has an end portion connecting to a frame-shaped portion and an inner portion on an inner side of the end portion. The width of the end portion is equal to or greater than the inner portion.
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公开(公告)号:US20230420523A1
公开(公告)日:2023-12-28
申请号:US18462595
申请日:2023-09-07
Applicant: DENSO CORPORATION
Inventor: Yusuke HAYAMA , Yusuke YAMASHITA , Keita KATAOKA , Yukihiko WATANABE
IPC: H01L29/32 , H01L29/16 , H01L29/06 , H01L29/861 , H01L29/78
CPC classification number: H01L29/32 , H01L29/1608 , H01L29/7813 , H01L29/861 , H01L29/063
Abstract: A semiconductor device includes a first main electrode, a second main electrode, and a semiconductor layer. The semiconductor layer includes a p-type semiconductor region disposed at a position exposed from the upper surface of the semiconductor layer and electrically connected to the second main electrode, and an n-type semiconductor region in contact with the p-type semiconductor region and separated from the second main electrode by the p-type semiconductor region. The n-type semiconductor region has a trap region provided at a position in contact with the p-type semiconductor region, and a hole trap is formed in the trap region.
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