公开(公告)号：US11742258B2

公开(公告)日：2023-08-29

申请号：US17617238

申请日：2021-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yuma Sato ,  Keisuke Aramaki ,  Yusuke Kubo

IPC: C08J5/18 ,  H01L23/373 ,  B29C48/00 ,  C08J5/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  B29K101/10 ,  B29K101/12 ,  B29K509/04 ,  B82Y30/00

CPC classification number: H01L23/3737 ,  B29C48/0021 ,  B29C48/022 ,  C08J5/042 ,  C08J5/18 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2509/04 ,  B29K2995/0013 ,  B29K2995/0094 ,  B82Y30/00 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005

Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.