HIGHLY DIELECTRIC FILM, USAGES THEREOF, AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20190127531A1

    公开(公告)日:2019-05-02

    申请号:US16094356

    申请日:2017-04-12

    摘要: This disclosure provides a highly dielectric film that is formed of a fluoroalkyl-group-containing organopolysiloxane cured product and that has a high dielectric constant and is substantially flat and uniform in a width direction of the film, usages thereof and a manufacturing method therefor. There is provided the highly dielectric film formed of a fluoroalkyl-group-containing organopolysiloxane cured product, in which in a width direction of the film, a difference between a thickness at an end of the film and a thickness at a center of the film is 5.0% or less, and the thickness at the center of the film falls within a range of 50 to 1000 μm. Such a film may be provided with a primer layer and a planarization layer, and the film may be obtained by means of rolling and may also be obtained by means of curing performed between separators provided with a separation layer.

    LAMINATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20200164613A1

    公开(公告)日:2020-05-28

    申请号:US16607016

    申请日:2017-09-20

    摘要: Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.