公开(公告)号：US20050224951A1

公开(公告)日：2005-10-13

申请号：US10815565

申请日：2004-03-31

申请人： Daewoong Suh ,  Christos Economopoulos ,  Saikumar Jayaraman ,  Mohd Basiron ,  Sheau Lim ,  Yoong Chin

发明人： Daewoong Suh ,  Christos Economopoulos ,  Saikumar Jayaraman ,  Mohd Basiron ,  Sheau Lim ,  Yoong Chin

IPC分类号： H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/613 ,  H01L2224/05599

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. An article that exhibits a stress-relief layer with a structure characteristic of the manner of dispensing is also included. A computing system that includes a stress-relief layer with a structure characteristic of the manner of dispensing is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的焊料凸块的条件来形成应力消除层。 应力消除层流向焊料凸块。 还包括具有分配方式结构特征的应力消除层的制品。 还包括包括具有分配方式的结构特征的应力消除层的计算系统。