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公开(公告)号：US08629004B2
公开(公告)日：2014-01-14
申请号：US13173334
申请日：2011-06-30
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3672 , H01L23/42 , H01L23/49562 , H01L23/49568 , H01L24/30 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/30181 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13054 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.
摘要翻译： 具有一体结构的半导体模块通过绝缘材料将半导体芯片安装在冷却板表面的一侧，并通过树脂模制部件模制半导体芯片和冷却板来制造。 该方法包括以下步骤：（a）在冷却板的表面上形成作为绝缘材料的喷涂绝缘膜; （b）在与设置有冷却板的面相反的喷涂绝缘膜的表面上形成喷涂的导电膜; （c）通过使用喷涂的导电膜和冷却板作为电极并在其间施加电压来检查喷涂的导电膜是否与冷却板绝缘; 以及（d）当喷涂的导电膜绝缘时，将半导体芯片安装在喷涂导电膜的上侧，然后树脂成型半导体芯片和冷却板。
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公开(公告)号：US20090251858A1
公开(公告)日：2009-10-08
申请号：US12457245
申请日：2009-06-04
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
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公开(公告)号：US07508668B2
公开(公告)日：2009-03-24
申请号：US10554998
申请日：2004-08-20
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译： 电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。 主电路部分设置在控制电路基板部分和电力布线部分之间。
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4.发明申请公开(公告)号：US20090251859A1
公开(公告)日：2009-10-08
申请号：US12457246
申请日：2009-06-04
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译： 电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。 主电路部分设置在控制电路基板部分和电力布线部分之间。
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公开(公告)号：US20080164607A1
公开(公告)日：2008-07-10
申请号：US12073871
申请日：2008-03-11
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H01L23/48
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译： 电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。 主电路部分设置在控制电路基板部分和电力布线部分之间。
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公开(公告)号：US20060284308A1
公开(公告)日：2006-12-21
申请号：US10554998
申请日：2004-08-20
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H01L23/06
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译： 电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。 主电路部分设置在控制电路基板部分和电力布线部分之间。
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公开(公告)号：US20060173028A1
公开(公告)日：2006-08-03
申请号：US10548639
申请日：2004-03-17
IPC分类号： A61K31/4747
CPC分类号： C07D405/06 , A61K31/443
摘要： The present invention provides a therapeutic and/or preventive agent for chronic skin diseases which comprises 7-[2-(3,5-dichloro-4-pyridyl)-1-oxoethyl]-4-methoxy-spiro[1,3-benzodioxol-2,1′-cyclopentane] or a pharmaceutically acceptable salt thereof as an active ingredient.
摘要翻译： 本发明提供了一种慢性皮肤疾病的治疗和/或预防剂，其包括7- [2-（3,5-二氯-4-吡啶基）-1-氧代乙基] -4-甲氧基 - 螺[1,3-苯并间 -2,1'-环戊烷]或其药学上可接受的盐作为活性成分。
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公开(公告)号：US20070287689A1
公开(公告)日：2007-12-13
申请号：US11576972
申请日：2005-10-13
CPC分类号： A61K45/06 , A61K31/277 , A61K31/357 , A61K31/4409 , A61K31/4427 , A61K31/443 , A61K31/4433 , A61K31/496 , A61K31/573 , A61K31/58 , A61K2300/00
摘要： The present invention provides: a therapeutic and/or preventive agent for chronic skin diseases which comprises (a) a phosphodiesterase (PDE)-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) a steroid agent as active ingredients; a therapeutic and/or preventive agent for chronic skin diseases to be administered simultaneously or separately with an interval which comprises (a) a PDE-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) a steroid agent, as active ingredients; a kit for treating and/or preventing chronic skin diseases characterized by comprising (a) a first component comprising a PDE-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) a second component comprising a steroid agent; and the like.
摘要翻译： 本发明提供：慢性皮肤病的治疗和/或预防剂，其包含（a）磷酸二酯酶（PDE）-IV抑制剂或其药学上可接受的盐和（b）作为活性成分的类固醇剂; 用于与（a）PDE-IV抑制剂或其药学上可接受的盐和（b）类固醇剂）作为活性成分的间隔同时或分开施用的慢性皮肤病的治疗和/或预防剂。 用于治疗和/或预防慢性皮肤疾病的试剂盒，其特征在于包含（a）包含PDE-IV抑制剂或其药学上可接受的盐的第一组分和（b）包含类固醇剂的第二组分; 等等。
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公开(公告)号：US08729264B2
公开(公告)日：2014-05-20
申请号：US12680484
申请日：2008-09-26
申请人： Keisuke Yamamoto , Seiji Aratake , Daisuke Nakashima , Kimihisa Ueno , Mirai Mizutani , Daisuke Harada , Katsuya Kobayashi , Kazuki Hemmi
发明人： Keisuke Yamamoto , Seiji Aratake , Daisuke Nakashima , Kimihisa Ueno , Mirai Mizutani , Daisuke Harada , Katsuya Kobayashi , Kazuki Hemmi
IPC分类号： C07D487/00
CPC分类号： C07D487/04 , A61K31/519 , A61K31/5377
摘要： Provided is an agent for the prevention and/or treatment of a skin disease containing, as an active ingredient, a pyrazolopyrimidine derivative represented by the formula (I) (wherein each symbol is as defined in the specification), or a pharmacologically acceptable salt thereof, and the like.
摘要翻译： 本发明提供含有式（I）表示的吡唑并嘧啶衍生物（其中各符号如说明书中的定义）作为活性成分的皮肤病的预防和/或治疗药剂或其药理学上可接受的盐 ，等等。
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公开(公告)号：US20080085858A1
公开(公告)日：2008-04-10
申请号：US11576970
申请日：2005-10-13
IPC分类号： A61K31/66 , A61K31/19 , A61K31/33 , A61K31/357 , A61K31/4015 , A61K31/4152 , A61K31/437 , A61K31/44 , A61K38/13 , A61P37/06 , A61P17/00 , A61K31/4409 , A61K31/443 , A61K31/4439 , A61K31/496 , A61K31/5025 , A61K31/505 , A61K31/522
CPC分类号： A61K31/496 , A61K31/277 , A61K31/357 , A61K31/436 , A61K31/44 , A61K31/4409 , A61K31/4427 , A61K31/443 , A61K31/4433 , A61K31/706 , A61K38/13 , A61K45/06 , A61K2300/00
摘要： The present invention provides a pharmaceutical composition comprising (a) a phosphodiesterase (PDE)-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) an immunosuppressant, a therapeutic and/or preventive agent for chronic skin diseases comprising (a) a PDE-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) an immunosuppressant, a therapeutic and/or preventive agent for chronic skin diseases to be administered simultaneously or separately with an interval comprising (a) a PDE-IV inhibitor or a pharmaceutically acceptable salt thereof and (b) an immunosuppressant, as active ingredients; and the like.
摘要翻译： 本发明提供一种药物组合物，其包含（a）磷酸二酯酶（PDE）-IV抑制剂或其药学上可接受的盐和（b）免疫抑制剂，用于慢性皮肤病的治疗和/或预防剂，其包含（a）PDE- IV抑制剂或其药学上可接受的盐，和（b）用于与（a）PDE-IV抑制剂或其药学上可接受的盐同时或分开施用的间隔施用的慢性皮肤病的免疫抑制剂，治疗和/或预防剂 和（b）作为活性成分的免疫抑制剂; 等等。
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