公开(公告)号：US20100139374A1

公开(公告)日：2010-06-10

申请号：US12630105

申请日：2009-12-03

申请人： Daniel L. Dermody ,  Suraj S. Deshmukh ,  Matthew T. Bishop ,  Drew A. Davidock ,  J. Keith Harris ,  Tzu-Chi Kuo ,  Paul L. Morabito ,  Melissa A. Mushrush ,  Donald W. Patrick ,  Jonathan J. Zieman

发明人： Daniel L. Dermody ,  Suraj S. Deshmukh ,  Matthew T. Bishop ,  Drew A. Davidock ,  J. Keith Harris ,  Tzu-Chi Kuo ,  Paul L. Morabito ,  Melissa A. Mushrush ,  Donald W. Patrick ,  Jonathan J. Zieman

IPC分类号： G01N11/02

CPC分类号： G01N11/06 ,  B01J2219/00315 ,  B01J2219/00364 ,  B01J2219/00686 ,  B01J2219/00702 ,  C40B60/12

摘要： The viscosity or relative viscosity of samples can be measured in parallel by dispensing or aspirating the samples at a set condition and then measuring a property of the sample such as mass dispensed or aspirated.

摘要翻译： 样品的粘度或相对粘度可以通过在设定条件下分配或抽吸样品并且然后测量样品的性质（例如质量分配或吸出）来平行测量。

公开(公告)号：US20100125041A1

公开(公告)日：2010-05-20

申请号：US12617739

申请日：2009-11-13

申请人： Daniel L. Dermody ,  J. Keith Harris

发明人： Daniel L. Dermody ,  J. Keith Harris

IPC分类号： C40B30/00 ,  C40B60/12

CPC分类号： C40B60/12 ,  B01L3/5085 ,  B01L9/52 ,  B01L2300/0609

摘要： The invention is a method and system for testing the physicochemical properties of plurality of test samples in parallel. The method includes providing a test assembly having the plurality of test samples, wherein the plurality of test samples is provided over a plurality of cells in the test assembly. A test fluid, a test object, or both are provided over the plurality of test samples to determine a physicochemical property of the plurality of test samples. The physicochemical property of the plurality of test samples is determined from the displacement of the plurality of test samples.

摘要翻译： 本发明是并行测试多个测试样品的物理化学性质的方法和系统。 该方法包括提供具有多个测试样本的测试组件，其中多个测试样本被提供在测试组件中的多个单元上。 在多个测试样品上提供测试流体，测试对象或两者以确定多个测试样品的物理化学性质。 从多个测试样品的位移确定多个测试样品的物理化学性质。

公开(公告)号：US20120225556A1

公开(公告)日：2012-09-06

申请号：US13039705

申请日：2011-03-03

申请人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

发明人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

IPC分类号： H01L21/306 ,  C09K3/14 ,  C09K13/00

CPC分类号： H01L21/3212 ,  C09G1/16

摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

公开(公告)号：US20120225555A1

公开(公告)日：2012-09-06

申请号：US13039723

申请日：2011-03-03

申请人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

发明人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

IPC分类号： H01L21/306 ,  C09K13/00

CPC分类号： H01L21/3212 ,  C09G1/16

摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 水溶性纤维素; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法，包括：提供基材，其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

公开(公告)号：US20100083778A1

公开(公告)日：2010-04-08

申请号：US12573914

申请日：2009-10-06

申请人： J. Keith Harris ,  David A. Hayes ,  Linda A. Moore ,  Jessica L. Bell

发明人： J. Keith Harris ,  David A. Hayes ,  Linda A. Moore ,  Jessica L. Bell

IPC分类号： G01M19/00 ,  B65D25/04

CPC分类号： B01L9/523 ,  B01L3/50855 ,  B01L2200/025 ,  B01L2200/0689 ,  B01L2300/0819 ,  B01L2300/0829

摘要： Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.

摘要翻译： 描述了用于保持无孔基材的装置及其使用方法，所述装置包括用于接收无孔基材的壳体，附接到壳体并与基底相邻共面的可移除的井插入物，所述钻井插入物具有至少一个 打开，其与基底一起限定了孔，以及用于向衬底施加力的装置，使得衬底以足够的力与孔插入物接合以在井中获得流体密封。

公开(公告)号：US20130274169A1

公开(公告)日：2013-10-17

申请号：US13988617

申请日：2011-12-12

申请人： Chaofang Yue ,  David Malotky ,  J. Keith Harris

发明人： Chaofang Yue ,  David Malotky ,  J. Keith Harris

IPC分类号： C11D3/50

CPC分类号： C11D3/507 ,  C11D3/06 ,  C11D3/08 ,  C11D3/10 ,  C11D3/2086 ,  C11D3/3757 ,  C11D3/3942 ,  C11D3/50

摘要： Described are fabric care compositions, comprising a builder and an aqueous dispersion comprising an ethylene acrylic acid copolymer and a fragrance.

摘要翻译： 描述的是织物护理组合物，其包含助洗剂和包含乙烯丙烯酸共聚物和香料的水性分散体。

公开(公告)号：US20090059218A1

公开(公告)日：2009-03-05

申请号：US12195779

申请日：2008-08-21

申请人： Richard S. Harner ,  J. Keith Harris ,  William A. Heeschen ,  Mary Beth Seasholtz

发明人： Richard S. Harner ,  J. Keith Harris ,  William A. Heeschen ,  Mary Beth Seasholtz

IPC分类号： G01J1/10

CPC分类号： G01N21/4785

摘要： The present invention relates to a turbidity calibration standard comprising: a number of from 1 to 5 sequentially-interfaced layers, wherein each layer independently comprises a light-permeable polymer or light-permeable interpolymer; a measured light transmission modulating amount of at least one light transmission modulator, which is distributed in any one or more of the layers; and a light-permeable container, which contains the layers and the at least one light transmission modulator. Also, the invention relates to methods of making and using the standard, and kits comprising the standard.

摘要翻译： 浊度校准标准本发明涉及一种浑浊度校准标准，其包括：多个1至5个顺序界面层，其中各层独立地包含透光聚合物或透光互聚物; 分布在任何一个或多个层中的至少一个光传输调制器的测量光透射调制量; 以及容纳所述层和所述至少一个光透射调制器的透光性容器。 此外，本发明涉及制备和使用该标准品的方法，以及包含该标准品的试剂盒。

公开(公告)号：US5580650A

公开(公告)日：1996-12-03

申请号：US492267

申请日：1995-06-19

申请人： David J. Forgach ,  J. Keith Harris ,  Paul G. Glugla ,  Donald L. Schmidt ,  Richard F. Fibiger

发明人： David J. Forgach ,  J. Keith Harris ,  Paul G. Glugla ,  Donald L. Schmidt ,  Richard F. Fibiger

IPC分类号： B01D69/12 ,  G03F7/038 ,  G03F7/039 ,  B32B3/26

CPC分类号： G03F7/038 ,  B01D69/125 ,  G03F7/039 ,  Y10T428/249953 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31504

摘要： A process is disclosed for the formation of a high flux composite membrane having a thin discriminating film affixed to a porous support layer through a glue layer. The process comprises the formation of the discriminating film by irradiating an aqueous polymer solution in the substantial absence of drying and under conditions which are sufficient to form a polymer film on the surface of the polymer solution at the interphase of the solution and a blanketing fluid. The film is then affixed to the support through the glue layer which may be the same polymer solution from which the discriminating film is formed.

摘要翻译： 公开了一种用于形成具有通过胶层固定到多孔支撑层的薄鉴别膜的高通量复合膜的方法。 该方法包括通过在基本不存在干燥的情况下照射聚合物水溶液并在足以在溶液的相间的聚合物溶液的表面上形成聚合物膜的条件和覆盖流体来形成鉴别膜。 然后将膜通过胶层固定到支撑体上，该胶层可以是形成识别膜的聚合物溶液。

公开(公告)号：US08697013B2

公开(公告)日：2014-04-15

申请号：US12573914

申请日：2009-10-06

申请人： J. Keith Harris ,  David A. Hayes ,  Linda A. Moore ,  Jessica L. Bell

发明人： J. Keith Harris ,  David A. Hayes ,  Linda A. Moore ,  Jessica L. Bell

IPC分类号： G01N15/06

CPC分类号： B01L9/523 ,  B01L3/50855 ,  B01L2200/025 ,  B01L2200/0689 ,  B01L2300/0819 ,  B01L2300/0829

摘要： Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.

摘要翻译： 描述了用于保持无孔基材的装置及其使用方法，所述装置包括用于接收无孔基材的壳体，附接到壳体并与基底相邻共面的可移除的井插入物，所述钻井插入物具有至少一个 打开，其与基底一起限定了孔，以及用于向衬底施加力的装置，使得衬底以足够的力与孔插入物接合以在井中获得流体密封。

公开(公告)号：US08440097B2

公开(公告)日：2013-05-14

申请号：US13039705

申请日：2011-03-03

申请人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

发明人： Hamed Lakrout ,  Jinjie Shi ,  Joseph Letizia ,  Xu Li ,  Thomas H. Kalantar ,  Francis Kelley ,  J. Keith Harris ,  Christopher J. Tucker

IPC分类号： C09K13/00

CPC分类号： H01L21/3212 ,  C09G1/16

摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选的氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。