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公开(公告)号：US07494920B2
公开(公告)日：2009-02-24
申请号：US11250687
申请日：2005-10-14
IPC分类号： H01L21/4763
CPC分类号： H01L23/3121 , H01L21/4846 , H01L23/49805 , H01L25/105 , H01L2224/48247 , H01L2225/1005 , H01L2225/1023 , H01L2225/1064 , H05K3/3442 , H05K2201/10454 , H05K2201/10696 , Y02P70/613
摘要： A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other s-uitable electroless metal plating deposition that prevents oxidation and promotes solderability.
摘要翻译： 提出了制造可垂直安装的集成电路（IC）封装的方法。 集成电路安装在印刷电路板（PCB）上并电耦合到PCB上的接合焊盘。 接合焊盘与嵌入在PCB中的通孔耦合。 将IC，接合焊盘，通孔和PCB的一部分分开以形成可垂直安装的IC封装。 在分割期间通孔横截面切割，以便露出通孔的一部分，从而为IC封装提供可安装区域。 IC封装可以封装或容纳在电介质材料中。 此外，可以用防腐剂或其它可防止氧化并促进可焊性的适用的无电金属电镀沉积来处理通孔。
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公开(公告)号：US20070090529A1
公开(公告)日：2007-04-26
申请号：US11250687
申请日：2005-10-14
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L21/4846 , H01L23/49805 , H01L25/105 , H01L2224/48247 , H01L2225/1005 , H01L2225/1023 , H01L2225/1064 , H05K3/3442 , H05K2201/10454 , H05K2201/10696 , Y02P70/613
摘要： A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other suitable electroless metal plating deposition that prevents oxidation and promotes solderability.
摘要翻译： 提出了制造可垂直安装的集成电路（IC）封装的方法。 集成电路安装在印刷电路板（PCB）上并电耦合到PCB上的接合焊盘。 接合焊盘与嵌入在PCB中的通孔耦合。 将IC，接合焊盘，通孔和PCB的一部分分开以形成可垂直安装的IC封装。 在分割期间通孔横截面切割，以便露出通孔的一部分，从而为IC封装提供可安装区域。 IC封装可以封装或容纳在电介质材料中。 此外，通孔可以用防腐剂或其它合适的无电金属电镀沉积进行处理，防止氧化并促进可焊性。
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公开(公告)号：US08315793B2
公开(公告)日：2012-11-20
申请号：US12477667
申请日：2009-06-03
CPC分类号： B81B7/02 , B81B2201/0242 , B81B2201/0292
摘要： An integrated sensor device is provided. The integrated sensor device comprises a first substrate including a surface portion and a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors.
摘要翻译： 提供集成的传感器装置。 集成传感器装置包括第一衬底，第一衬底包括表面部分和第二衬底，第二衬底以堆叠构型耦合到第一衬底的表面部分，其中在第一衬底和第二衬底之间限定空腔。 集成传感器装置还包括至少部分地位于第一衬底中的一个或多个微电机械系统（MEMS）传感器，其中MEMS传感器与空腔连通。 集成传感器装置还包括一个或多个附加传感器。
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公开(公告)号：US20100312468A1
公开(公告)日：2010-12-09
申请号：US12477667
申请日：2009-06-03
CPC分类号： B81B7/02 , B81B2201/0242 , B81B2201/0292
摘要： An integrated sensor device is provided. The integrated sensor device comprises a first substrate including a surface portion and a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors.
摘要翻译： 提供集成的传感器装置。 集成传感器装置包括第一衬底，第一衬底包括表面部分和第二衬底，第二衬底以堆叠构型耦合到第一衬底的表面部分，其中在第一衬底和第二衬底之间限定空腔。 集成传感器装置还包括至少部分地位于第一衬底中的一个或多个微电机械系统（MEMS）传感器，其中MEMS传感器与空腔连通。 集成传感器装置还包括一个或多个附加传感器。
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公开(公告)号：US20090093981A1
公开(公告)日：2009-04-09
申请号：US11868390
申请日：2007-10-05
IPC分类号： G01C17/38
摘要： A magnetic compass includes a magnetic sensor, an acceleration sensor, respective signal conditioning circuits in electronic communication with the sensors and a microprocessor. These components are arranged and structurally coupled to a single electronic package that supports the sensors, the signal conditioning circuits, and the microprocessor to provide a miniaturized magnetic compass. In addition, a temperature sensor may be coupled to the package to provide temperature compensation for at least some of the above-identified components.
摘要翻译： 磁罗盘包括磁传感器，加速度传感器，与传感器电子通信的各个信号调理电路和微处理器。 这些组件被布置和结构上耦合到支持传感器，信号调节电路和微处理器的单个电子封装件以提供小型化的磁罗盘。 此外，温度传感器可以耦合到封装以为至少一些上述部件提供温度补偿。
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公开(公告)号：US20060152217A1
公开(公告)日：2006-07-13
申请号：US11031940
申请日：2005-01-07
IPC分类号： G01R33/02
CPC分类号： G01C17/38
摘要： A method and system for calibrating a magnetic compass and/or verifying a compass calibration, using a calibration magnetic field produced by a field-generating coil within the magnetic compass is described. The field-generating coil is located near magnetometers within the magnetic compass. Passing a self-trimming current through the coil produces a magnetic field that acts on the magnetometers. Samples of an output signal from each magnetometer are taken to obtain digital values that indicate the output signal from each magnetometer. The digital values are used by a processor to determine one or more calibration coefficient for using calibrating the magnetic compass. The samples of the output signals are taken when a self-trimming current is passing through the coil and when the self-trimming current is not passing through the coil. Calibration of the compass occurs by applying the one or more calibration coefficients to subsequent signals that indicate the output signals of one or more of the magnetometers.
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7.发明申请公开(公告)号：US20130116943A1
公开(公告)日：2013-05-09
申请号：US13289804
申请日：2011-11-04
CPC分类号： G01R33/098
摘要： A method to measure an applied magnetic field in a plane is provided. The method includes simultaneously applying a first and second alternating drive current to a respective first and second strap overlaying a magnetoresistive sensor so the magnetoresistive sensor is subjected to a periodically rotating magnetic drive field rotating in the plane in the magnetoresistive sensor. When the applied magnetic field to be measured is superimposed on the periodically rotating magnetic drive field rotating in the plane, the method includes extracting a second harmonic component of an output voltage output from the magnetoresistive sensor. The magnitude of the magnetic field to be measured in the plane is proportional to an amplitude of the extracted second harmonic component of the output voltage. The orientation of the magnetic field to be measured in the plane is related to a phase angle of the extracted second harmonic component of the output voltage.
摘要翻译： 提供了测量平面中施加的磁场的方法。 该方法包括同时将第一和第二交替驱动电流施加到覆盖磁阻传感器的相应的第一和第二带上，使得磁阻传感器经历在磁阻传感器的平面中旋转的周期性旋转的磁驱动场。 当所测量的施加磁场叠加在在平面内旋转的周期性旋转的磁驱动场时，该方法包括提取从磁阻传感器输出的输出电压的二次谐波分量。 在平面中要测量的磁场的大小与输出电压的提取的二次谐波分量的振幅成比例。 在平面中要测量的磁场的取向与所提取的输出电压的二次谐波分量的相位角有关。
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公开(公告)号：US20120299587A1
公开(公告)日：2012-11-29
申请号：US13116844
申请日：2011-05-26
IPC分类号： G01R33/02
CPC分类号： G01R33/0206
摘要： Systems and methods for three-axis magnetic sensors are provided. In one embodiment, a three-axis magnetic sensor formed on a single substrate comprises: an in-plane two-axis magnetic sensor comprising at least one of either a magnetic-resistance (MR) sensor or a magnetic-inductive (MI) sensor formed on the single substrate; and an out-of-plane magnetic sensor comprising a Hall effect sensor formed on the single substrate. The in-plane two-axis magnetic sensor measures magnetic fields in a first plane parallel to a plane of the substrate, and the out-of-plane magnetic sensor measures magnetic fields along an axis orthogonal to the first plane.
摘要翻译： 提供三轴磁传感器的系统和方法。 在一个实施例中，形成在单个基板上的三轴磁传感器包括：面内两轴磁传感器，包括形成的磁阻（MR）传感器或磁感应（MI）传感器中的至少一个传感器 在单个基板上; 以及包括形成在单个基板上的霍尔效应传感器的平面外的磁传感器。 面内双轴磁传感器测量与基板平面平行的第一平面中的磁场，并且平面外的磁传感器测量沿着与第一平面正交的轴的磁场。
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公开(公告)号：US20120279077A1
公开(公告)日：2012-11-08
申请号：US13101492
申请日：2011-05-05
IPC分类号： G01C17/00
CPC分类号： B81B7/0074 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/10155 , H01L2924/00014 , H01L2924/00
摘要： Systems and methods for three-axis sensor chip packages are provided. In one embodiment, a directional sensor package comprises: a base; a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit; a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit located on a second surface. The second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base. The second surface is adjacent to the first surface and angled with respect to a plane of the first surface.
摘要翻译： 提供三轴传感器芯片封装的系统和方法。 在一个实施例中，定向传感器封装包括：基座; 安装到基座的第一传感器芯片，第一传感器管芯具有电耦合到第一有源传感器电路的第一有源传感器电路和第一多个金属焊盘; 安装到基座的第二传感器芯片，第二传感器管芯具有位于第一表面上的第二有源传感器电路，以及电耦合到位于第二表面上的第二有源传感器电路的第二多个金属焊盘。 定位第二传感器模具使得第二有源传感器电路相对于第一有源传感器电路区域正交定向并垂直于基极。 第二表面与第一表面相邻并且相对于第一表面的平面成角度。
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公开(公告)号：US08459112B2
公开(公告)日：2013-06-11
申请号：US13156758
申请日：2011-06-09
IPC分类号： H01L23/02
CPC分类号： G01R33/028 , G01R33/0052 , G01R33/0206 , H01L2224/48091 , H01L2924/00014
摘要： Systems and methods for fabricating a multi-axis sensor are provided. In one implementation, a method comprises: fabricating a first die having a first active surface with first application electronics; fabricating a second die having a second active surface with second application electronics and a plurality of electrical connections that extend from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface; aligning the side surface interface to be coplanar with the first active surface; and forming at least one electrical connection between the plurality of electrical connections and the first active surface.
摘要翻译： 提供了制造多轴传感器的系统和方法。 在一个实施方式中，一种方法包括：用第一应用电子器件制造具有第一有源表面的第一管芯; 制造具有第二有源表面的第二管芯，其具有第二应用电子器件和从第二施加电子器件延伸到与第二有源表面相邻的第二管芯的侧表面界面的多个电连接; 使所述侧表面界面与所述第一活性表面共面; 以及在所述多个电连接和所述第一主动表面之间形成至少一个电连接。
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