摘要:
A gimbal and corresponding head suspension assembly including a planar flexure platform having integral static attitude compensation, nominal angle adjustment, and load point etched or etched-formed raised features. The head suspension assembly can also include a load point cover with etched or etched-formed load point features. The etched features are manufactured by masking a pivot point at about the intersection of the roll axis and the pitch axis, thus leaving a raised protuberance having either a pivot point or a load point feature. The process of manufacturing etched-formed features includes etching protuberances and slots. A punch press is then applied to the protuberances. The slots help control the formation of raised domes and provide additional static compensation and nominal angle adjustment pivoting clearance.
摘要:
A gimbal and corresponding head suspension assembly including a planar flexure platform having integral static attitude compensation, nominal angle adjustment, and load point etched or etched-formed raised features. The head suspension assembly can also include a load point cover with etched or etched-formed load point features. The etched features are manufactured by masking a pivot point at about the intersection of the roll axis and the pitch axis, thus leaving a raised protuberance having either a pivot point or a load point feature. The process of manufacturing etched-formed features includes etching protuberances and slots. A punch press is then applied to the protuberances. The slots help control the formation of raised domes and provide additional static compensation and nominal angle adjustment pivoting clearance.
摘要:
A method for adjusting the load of a head suspension for supporting a read/write head over a disk in a magnetic disk drive. The suspension includes a load beam having a rigid region and proximal and distal ends, with a base on the proximal end and a flexure on the distal end. A spring region is located between the base and rigid region of the load beam. The spring region includes a pair of arms which extend between the base and rigid region to form a cutout, and a plurality of load adjustment frets which extend across the cutout between the base and rigid region. One or more of the frets can be severed by a laser beam to lower the gram load of the suspension. The gram load of the suspension can be increased by shrinking the frets through exposure to the laser beam. Gram load adjustments can be made with the suspensions in a disk stack assembly by directing the laser beam to the frets through an optical fiber.
摘要:
A head suspension for supporting a read/write head over a disk in a magnetic disk drive. The suspension includes a load beam having a rigid region and proximal and distal ends, with a base on the proximal end and a flexure on the distal end. A spring region is located between the base and rigid region of the load beam. The spring region includes a pair of arms which extend between the base and rigid region to form a cutout, and a plurality of load adjustment frets which extend across the cutout between the base and rigid region. One or more of the frets can be severed by a laser beam to lower the gram load of the suspension. The gram load of the suspension can be increased by shrinking the frets through exposure to the laser beam. Gram load adjustments can be made with the suspensions in a disk stack assembly by directing the laser beam to the frets through an optical fiber.
摘要:
The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed shunt sites wherein there is at least one through hole in the substrate.
摘要:
A laminated adapter provides electrical interconnection between electrical bond pads on a vertical surface of a head slider with electrical trace interconnects adhesively bonded to a horizontal surface of the adapter, opposite to the surface to which the head slider is to be attached. Electrical connection from the electrical bond pads on a vertical face of the head slider to the electrical trace interconnects on the laminated adapter is provided by means such as electrically conductive welds. Electrical connection can be made from a horizontal surface of the assembled laminated adapter opposite to the head to electrical connection means on the surface of the head suspension assembly. The laminated adapter is particularly suitable for use with integrated electrical trace interconnects on a head suspension assembly.
摘要:
The present invention provides an assembly apparatus employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component. The components are imaged by a local imaging system to establish their position relative to each other and the second component is moved into a desired attachment position and then moved into engagement with the adhesive and the first component. The adhesive may then be at least partially cured if desired.
摘要:
The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component. The components are imaged by a local imaging system to establish their position relative to each other and the second component is moved into a desired attachment position and then moved into engagement with the adhesive and the first component. The adhesive may then be at least partially cured if desired.
摘要:
The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed shunt sites wherein there is at least one through hole in the substrate.