摘要:
An optical crossconnect (OXC) fabric including an array of tiltable mirrors, a reflector and a plurality of optical fibers controls the position of the mirrors to optimize the transfer of a signal between an input optical fiber and an output optical fiber by monitoring the optical signal at an optical translation unit in each of the input optical fiber and the output optical fiber. The optical translation units are operable for regenerating the optical signals transmitted through the fibers.
摘要:
A device and method for detecting rotational drift of mirror elements in a MEMS tilt mirror array used in an optical crossconnect. The optical crossconnect directs optical signals from an input fiber to an output fiber along an optical path by rotatably positioning mirror elements in desired positions. A monitoring device disposed outside of the optical path is used to obtain images of the MEMS array or to transmit and receive a test signal through the crossconnect for detecting the presence of mirror element drift.
摘要:
An opto-isolator incorporating a MEMS device includes an optical signal source and an optical signal detector defining therebeween an optical path for communication of optical signals. A MEMS device having an actuator for controlling a moveable element is disposed between the source and detector for manipulating the optical signals. In one embodiment, the moveable element is a shutter which is operable to selectively allow optical signals to be received by the detector and prevent signals from being detected. In another embodiment, the moveable member is a MEMS tilt mirror for selectively directing optical signals to the detector.
摘要:
An optical signal processing apparatus includes at least two mirror array chips mounted on an upper surface of a base in close proximity to each other to form a compound array. Each mirror array chip includes a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate. The mirrors are movable in response to an electrical signal. A plurality of electrical leads for conduct the electrical signals to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base.
摘要:
A variable optical delay line using MEMS devices. A reflector on a micro machine linear rack is positioned and spaced from an input source and/or an output to receive and reflect input light waves toward the output. The distance between the reflector and the input and output is variable and thereby enables selective path delay compensation of the input light wave signals. Other disclosed embodiments utilize pivoting MEMS mirrors and selective adjustment of the mirror pivot angles to provide the selective path delay compensation required in a light wave system.
摘要:
An optical crossconnect constructed of micro -electromechanical systems (MEMS) tilt mirror arrays for selectively routing optical signals to optic fibers. The crossconnect includes a lens array for directing optical signals from a fiber array to the MEMS mirror array. Individual mirror elements in the mirror array reflect the optic signals to additional optic elements such as a planar mirror, a transmissive/reflective optical element or a second MEMS mirror array for routing the optical signals to output optic fibers.
摘要:
A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.
摘要:
Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid evaporated into the ambient region.
摘要:
A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.
摘要:
Apparatus and methods for a combined optical modulator/photodetector are disclosed. A modulator chip is attached to a photodetector chip using a non-conductive epoxy or solder. The combined modulator/photodetector can be configured in at least two ways. In one configuration, the modulator is located on the upper surface of a chip that is attached, at its lower surface, to a photodetector containing chip. In another configuration, the modulator is located on the lower surface of the modulator chip, which is again attached at its lower surface to the pbotodetector chip. By combining the modulator and photodetector in the manner described above, they can be placed in a single package, resulting in reduced packaging costs versus a separately packaged modulator and a separately packaged photodetector. Moreover, feedback from the photodetector can used to optimize the operation of micromechanical optical modulators.