Optical monitoring for OXC fabric
    1.
    发明授权
    Optical monitoring for OXC fabric 有权
    OXC织物的光学监测

    公开(公告)号:US06507421B1

    公开(公告)日:2003-01-14

    申请号:US09414621

    申请日:1999-10-08

    IPC分类号: H04J1400

    摘要: An optical crossconnect (OXC) fabric including an array of tiltable mirrors, a reflector and a plurality of optical fibers controls the position of the mirrors to optimize the transfer of a signal between an input optical fiber and an output optical fiber by monitoring the optical signal at an optical translation unit in each of the input optical fiber and the output optical fiber. The optical translation units are operable for regenerating the optical signals transmitted through the fibers.

    摘要翻译: 包括可倾斜反射镜阵列,反射器和多个光纤的光学交叉连接(OXC)结构控制反射镜的位置,以通过监视光信号来优化输入光纤和输出光纤之间的信号传输 在每个输入光纤和输出光纤中的光学平移单元处。 光学平移单元可操作用于再生通过光纤传输的光信号。

    Method and device for optically crossconnecting optical signals using tilting mirror MEMS with drift monitoring feature
    2.
    发明授权
    Method and device for optically crossconnecting optical signals using tilting mirror MEMS with drift monitoring feature 有权
    使用具有漂移监测功能的倾斜镜MEMS光学交叉连接光信号的方法和装置

    公开(公告)号:US06798992B1

    公开(公告)日:2004-09-28

    申请号:US09518070

    申请日:2000-03-02

    IPC分类号: H04J1400

    摘要: A device and method for detecting rotational drift of mirror elements in a MEMS tilt mirror array used in an optical crossconnect. The optical crossconnect directs optical signals from an input fiber to an output fiber along an optical path by rotatably positioning mirror elements in desired positions. A monitoring device disposed outside of the optical path is used to obtain images of the MEMS array or to transmit and receive a test signal through the crossconnect for detecting the presence of mirror element drift.

    摘要翻译: 一种用于检测在光学交叉连接中使用的MEMS倾斜反射镜阵列中的镜元件的旋转漂移的装置和方法。 光学交叉连接器通过将镜子元件可旋转地定位在期望的位置,将光信号从输入光纤引导到输出光纤。 设置在光路外部的监视装置用于获得MEMS阵列的图像,或者通过交叉连接器发送和接收测试信号,以检测镜元件漂移的存在。

    MEMS optical isolators
    3.
    发明授权
    MEMS optical isolators 有权
    MEMS光隔离器

    公开(公告)号:US06441360B1

    公开(公告)日:2002-08-27

    申请号:US09515412

    申请日:2000-02-29

    IPC分类号: H01J314

    摘要: An opto-isolator incorporating a MEMS device includes an optical signal source and an optical signal detector defining therebeween an optical path for communication of optical signals. A MEMS device having an actuator for controlling a moveable element is disposed between the source and detector for manipulating the optical signals. In one embodiment, the moveable element is a shutter which is operable to selectively allow optical signals to be received by the detector and prevent signals from being detected. In another embodiment, the moveable member is a MEMS tilt mirror for selectively directing optical signals to the detector.

    摘要翻译: 结合MEMS器件的光隔离器包括光信号源和光信号检测器,其中定义用于光信号通信的光路。 具有用于控制可移动元件的致动器的MEMS装置设置在源和检测器之间,用于操纵光信号。 在一个实施例中,可移动元件是快门,其可操作以选择性地允许光信号被检测器接收并防止检测信号。 在另一个实施例中,可移动构件是用于将光信号选择性地引导到检测器的MEMS倾斜镜。

    Mems variable optical delay lines
    5.
    发明授权
    Mems variable optical delay lines 有权
    存储器可变光延迟线

    公开(公告)号:US06356377B1

    公开(公告)日:2002-03-12

    申请号:US09515999

    申请日:2000-02-29

    IPC分类号: G02B2600

    CPC分类号: G02B6/2861

    摘要: A variable optical delay line using MEMS devices. A reflector on a micro machine linear rack is positioned and spaced from an input source and/or an output to receive and reflect input light waves toward the output. The distance between the reflector and the input and output is variable and thereby enables selective path delay compensation of the input light wave signals. Other disclosed embodiments utilize pivoting MEMS mirrors and selective adjustment of the mirror pivot angles to provide the selective path delay compensation required in a light wave system.

    摘要翻译: 使用MEMS器件的可变光延迟线。 微机器线性架上的反射器与输入源和/或输出端定位并隔开,以将输入光波接收并反射到输出端。 反射器与输入和输出之间的距离是可变的,从而使输入光波信号的选择性路径延迟补偿成为可能。 其他公开的实施例利用旋转的MEMS镜子和镜子枢转角度的选择性调整,以提供在光波系统中所需的选择性路径延迟补偿。

    Optical crossconnect using tilting mirror MEMS array
    6.
    发明授权
    Optical crossconnect using tilting mirror MEMS array 有权
    光学交叉连接使用倾斜镜MEMS阵列

    公开(公告)号:US06690885B1

    公开(公告)日:2004-02-10

    申请号:US09512174

    申请日:2000-02-24

    IPC分类号: H04J1400

    摘要: An optical crossconnect constructed of micro -electromechanical systems (MEMS) tilt mirror arrays for selectively routing optical signals to optic fibers. The crossconnect includes a lens array for directing optical signals from a fiber array to the MEMS mirror array. Individual mirror elements in the mirror array reflect the optic signals to additional optic elements such as a planar mirror, a transmissive/reflective optical element or a second MEMS mirror array for routing the optical signals to output optic fibers.

    摘要翻译: 由微机电系统(MEMS)倾斜镜阵列构成的光学交叉连接器,用于选择性地将光信号路由到光纤。 交叉连接包括用于将光信号从光纤阵列引导到MEMS反射镜阵列的透镜阵列。 反射镜阵列中的单个镜像元件将光学信号反射到附加光学元件,例如平面镜,透射/反射光学元件或用于将光信号路由到输出光纤的第二MEMS镜阵列。

    Micro-electro-mechanical optical device
    7.
    发明授权
    Micro-electro-mechanical optical device 有权
    微机电光学装置

    公开(公告)号:US06300619B1

    公开(公告)日:2001-10-09

    申请号:US09415178

    申请日:1999-10-08

    IPC分类号: G02B2600

    摘要: A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.

    摘要翻译: 一种微机电(MEM)光学装置,其具有减小的占地面积,以增加基板上的产量。 MEM装置包括具有外边缘并由设置在基板上的支撑结构支撑的光学元件。 支撑结构通过第一和第二对梁将其机械地连接到基板,所述梁将结构移动到用于将光学装置升高到基板上方的活动位置。 当处于升高位置时,可以选择性地倾斜光学装置以偏转光信号。 梁在一端连接到支撑结构,另一端连接到基板,并且被布置成使得第一和第二梁端部位于光学装置外边缘附近。 在优选实施例中,在光学装置的外边缘上包括一个减小降低力的元件,用于减小光学元件边缘和基板之间的接触面积。

    Hermatic firewall for MEMS packaging in flip-chip bonded geometry
    9.
    发明授权
    Hermatic firewall for MEMS packaging in flip-chip bonded geometry 有权
    Hermatic防火墙用于MEMS封装中的倒装芯片焊接几何

    公开(公告)号:US06400009B1

    公开(公告)日:2002-06-04

    申请号:US09419488

    申请日:1999-10-15

    IPC分类号: H01L2312

    摘要: A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

    摘要翻译: 用于气密地密封混合电路中的微机电系统(MEMS)装置的封装包括形成在用于MEMS器件的衬底上的防火墙,其具有限定封装的空腔的高度,其中MEMS器件将被密封。 与第一基板间隔开的第二基板在第二基板被倒装芯片接合到第一基板时气密地密封空腔,并且将金属材料焊接到第一基板上,薄膜金属材料放置在防火墙的至少顶部上。 所得到的防火墙MEMS器件封装可以使用传统的CMOS封装技术进一步封装。 通过密封空腔,封装的MEMS器件得到保护,防止在常规CMOS封装技术的环境中发现有害条件,这常常对MEMS器件功能有害。

    Method and arrangement for a combined modulator/photodetector
    10.
    发明授权
    Method and arrangement for a combined modulator/photodetector 失效
    组合调制器/光电探测器的方法和装置

    公开(公告)号:US5767997A

    公开(公告)日:1998-06-16

    申请号:US675980

    申请日:1996-07-05

    IPC分类号: H04B10/24 H04B10/00

    CPC分类号: H04B10/40

    摘要: Apparatus and methods for a combined optical modulator/photodetector are disclosed. A modulator chip is attached to a photodetector chip using a non-conductive epoxy or solder. The combined modulator/photodetector can be configured in at least two ways. In one configuration, the modulator is located on the upper surface of a chip that is attached, at its lower surface, to a photodetector containing chip. In another configuration, the modulator is located on the lower surface of the modulator chip, which is again attached at its lower surface to the pbotodetector chip. By combining the modulator and photodetector in the manner described above, they can be placed in a single package, resulting in reduced packaging costs versus a separately packaged modulator and a separately packaged photodetector. Moreover, feedback from the photodetector can used to optimize the operation of micromechanical optical modulators.

    摘要翻译: 公开了用于组合光调制器/光电检测器的装置和方法。 使用非导电环氧树脂或焊料将调制器芯片附接到光电检测器芯片。 组合的调制器/光电检测器可以至少两种方式配置。 在一种配置中,调制器位于芯片的上表面上,芯片的下表面附接到包含光电检测器的芯片。 在另一种配置中,调制器位于调制器芯片的下表面上,该调制器芯片的下表面再次连接到波导检测器芯片。 通过以上述方式组合调制器和光电检测器,它们可以放置在单个封装中,从而与单独封装的调制器和单独封装的光电检测器相比降低了封装成本。 此外,来自光电检测器的反馈可用于优化微机械光学调制器的操作。